Ansys Structures’ Post

Free surface flow with strong surface tension effect and wall adhesion forces is very common in many manufacturing processes, e.g. reflow soldering in IC packaging. In this amination, a cubic droplet deforms under the surface tension with a small contact angle on the solid wall. The liquid droplet is simulated by LS-DYNA ISPG (Incompressible Smoothed Particle Galerkin) method, and it employs a fully implicit Lagrangian particle-based solution of the Navier-Stokes equation for free surface modeling and can be easily coupled with structural analysis in one solver. Typical ISPG applications include: 1) large-scale reflow soldering with thousands of solder balls. With PCB warpage effect, solder defects, e.g. solder bridging can be predicted. 2) adhesive flow, e.g. adhesive forging, metal hemming, structural adhesive bonding, etc.

Miniature SMD test terminals surface mount test (SMT) terminals that can be used to attach a large range of test or oscilloscope probes to test zones on PCBs. Miniature C12000 series devices present a mechanical test hook interface on the SMD PCB which enables the operator to clip a test probe from oscilloscope to the PCB. Measuring just 2.5 x 1.3 x 1.5mm, the devices can be used separately or by comparison with another. Nicomatic’s Miniature SMD test terminals are less prone to oxidation thanks to pure tin bright tin plating with nickel under layer. Therefore, repeated testing can be securely performed.   📌No PCB Piercing, No Hole Plating & Pre-Manual Insertion or Soldering of Traditional Test Pins 📌No Specific Test Probe Needed 📌 Can be Used as Zero Resistance 📌 No Special Compartment Needed on Auto-Placing Machines 📌 Copper Alloy, RoHS Compliant 📌 Tin or Gold Plated Versions Available 📌 Packaging in Reel of 2,000 or 8,500 Parts 📌 SOT08-05 Standard SMD Slots 📌Part Number C12000B/ C12000BG/ C12000-8500

PCB Plating: application of a metal coating, typically copper, to enhance electrical connectivity and circuit protection. #pcbmanufacturer #pcbafactory #pcbprototype

Ready to put your #soldering equipment and materials to the test? Look no further! Our in-house laboratory 🔬 specializes in comprehensive solder-related testing. But we go beyond just testing – we provide a detailed evaluation of results and document the entire process. Here's how we can assist you: 1️⃣ Solder bath and metal analyses: Crucial for checking contamination and ensuring soldering quality. 2️⃣ Wetting and solderability tests: Verifying if your material is suitable for soldering. 3️⃣ Inspection of printed circuit boards and assemblies for ionic contamination: We'll check for ionic contamination in your PCBs and assemblies. 4️⃣ Surface insulation resistance (SIR test) measurement: Ensuring you use the correct soldering agents for optimal results. While these are our common tests, our expertise extends to any testing needs you may have – just let us know! 📞 Discover more here: https://ow.ly/uPSL50QFVO5 #stannol #testing #analysis #inhouselaboratory

Precision at Every Scale: The Power of Magnifying Glass Inspection and Microscopic Examination in PCB Manufacturing 🔍🔬 At Well PCB, we leave no detail unnoticed in our pursuit of perfection. 🔍💡 Our visual inspection process goes beyond the surface, utilizing tools like magnifying glasses and microscopes to examine PCBs at a microscopic level. 🛠️⚙️ Through meticulous examination, our team ensures that every component is placed with precision and accuracy, meeting the highest quality standards. 💪🏭 Whether it's detecting minute defects or verifying intricate connections, our visual inspection techniques guarantee reliability in every PCB we produce. 🔍✅ Partner with Well PCB for PCB solutions engineered with precision and care. Like and follow for more insights into our manufacturing processes! #pcb #visualinspection #pcba #pcbassembly #pcbmanufacturing

FLIPCHIP ASSEMBLY USING NEW LEAD FREE SOLDER PASTE FORMULATIONS FLIPCHIP technology can be used either inside a package or directly on a substrate.When it is put inside the package, the chip is connected to a redistribution interposer via solder joints, and this technique is named as FC in package (FCIP). FCOB or DCA refers to the technique that the FC is directly connected to a PWB through the solder joints. FCIP technique has been used in many kinds of BGA and CSP components, especially those having high pin count and high-performance components. Source - Encyclopedia of Packaging Materials, Processes, and Mechanics — Volume 1

Meet FR-4—the unsung hero of PCBs! As the standard material, FR-4, a composite of woven fiberglass cloth and epoxy resin, forms the backbone of electronic circuits. Learn more about the essential PCB components here: https://bit.ly/3ujMMpG #FR4Material #PCBBackbone #TechInnovation #CompositeMaterials #ElectronicsEngineering

🌍 Immersion Silver in PCB Manufacturing The basic process of the immersion silver process for PCB usually includes the following steps: PCB daldırma gümüş işleminin temel süreci genellikle aşağıdaki adımları içerir: 1. ⭐ Pretreatment Clean the PCB surface to remove dirt, grease and oxides to ensure good adhesion. 2. ⭐ Microetching Slightly etch the copper on the PCB surface to roughen it and increase the adhesion of the silver layer. 3.⭐ Pre-immersion Treat the PCB with a special solution to prepare for the subsequent silver immersion step. 4. ⭐ Silver Immersion Immerse the PCB in a chemical solution containing silver ions to deposit a uniform layer of silver on the copper surface through a chemical reaction. 5. ⭐ Post-treatment Clean the PCB to remove residual chemicals and perform drying treatment. 6.⭐ Inspection Conduct visual inspection and performance tests on the PCB after silver immersion to ensure that the quality and thickness of the silver layer meet the requirements. 🌟 🌟 🌟 The entire silver immersion process requires strict control of parameters such as the concentration, temperature and processing time of the chemical solution to obtain a high-quality PCB silver immersion effect. #pcb #pcbdesign #pcbmanufacturing #pcba #pcbasassembly #EMS #smt #pcbamanufacturing #ic #chips #components #electroniccomponents #sourcingandprocurement

There are many kinds of surface finish for PCB, such as OSP, HASL, ENIG, ENIPIG, ImAg, ImSn.... Do you know what surface finish is and the functions of them? PCB surface finish is the metal-to-metal connection between bare copper and components in the solderable area of the printed circuit board. The circuit board has a base copper surface, which is easily oxidized without a protective coating, so surface finish is required. As shown in the figure, the surface finish is on the outermost layer of the PCB. PCB surface finish is a process for improving the solderability, corrosion resistance, conductivity and protecting the board from oxidation. The main functions are as follows: 😊 Promote soldering: Improve soldering performance and ensure a firm connection of the solder joint. 😊 Anti-corrosion: Enhance corrosion resistance and extend the service life of the circuit board. 😊 Improve conductivity: Reduce resistance and improve signal transmission quality. 😊 Protect the board: Prevent metal surface oxidation, moisture and other problems. #PCB #PCBSurface #PCBElectronics #PCBWelding #PCBSoldering #PCBSolder #SolderResist #SurfaceFinish #PCBCopper

PCB copper Plating fully automated