From "cold starts"❄️ to "warm starts,"🔥 learn how partners like Synaptics Incorporated were able to use our AI-enabled EDA tools to migrate their processor design to a more advanced semiconductor process node: https://bit.ly/3R70pBb
Synopsys Users Group (SNUG)’s Post
More Relevant Posts
-
Integrated Circuits - Features, Uses and Types #semiconductor Integrated circuit (IC), also known as chip or microchip is a semiconductor which incorporated large number of electronic components, such as transistors, diodes, resistors, and capacitors, on a single piece of semiconductor material, typically silicon. https://lnkd.in/gESrQDUY
To view or add a comment, sign in
-
This video shows how a DR Series compact cylinder can be used in a silicon wafer pin lifter for the semiconductor industry. Once a wafer is placed on the lifter, it can be lifted to different heights for processing. Learn more about the DR/DRS2 Series: https://hubs.li/Q02rnph60 #alphastep #linearmotion #smallisbetter
To view or add a comment, sign in
-
Changing a single material in a semiconductor wafer has consequences in every process step — from deposition through etching and beyond. As more chipmakers start to introduce molybdenum at aggressive semiconductor nodes, learn how our new collaborative approach can help accelerate this change to market. Read more: https://bit.ly/43uRqik #mooreslaw #CMP #CVD
To view or add a comment, sign in
-
Transforming analog verification with AI-accelerated circuit simulators for the next era of intelligent design Semiconductor chip design is undergoing a rapid evolution, driven by the relentless demand for faster, more efficient, and highly integrated electronic systems. However, this progress comes with its own set of challenges, particularly in the realm of simulation and verification. This white paper delves into the intricacies of semiconductor design challenges and how Siemens' new AI-driven Solido Simulation Suite revolutionizes the simulation space with its advanced capabilities. #simulation #spice #ai #fastspice #siemens #solido Pradeep Thiagarajan Lih-Jen Hou Gregory Curtis Sathishkumar Balasubramanian Amit Gupta Jeff Dyck https://lnkd.in/eesYkxyv
To view or add a comment, sign in
-
Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products: Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor. http://dlvr.it/T6Q6NG
To view or add a comment, sign in
-
Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products: Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor. http://dlvr.it/T5gHzR
To view or add a comment, sign in
-
Thursday Knowledge: A silicon ingot is a large, pure, single crystal of silicon that serves as the raw material for manufacturing various electronic components. It’s essentially the starting point for creating semiconductor devices.
To view or add a comment, sign in
-
Discover the importance of wire bonding in chip fabrication and its role in ensuring reliable electrical connections within semiconductor devices while exploring exciting advancements and future trends in this essential technology! https://bit.ly/3W2872L #ICPackaging
To view or add a comment, sign in
-
Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products: Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor. http://dlvr.it/T5gGNK
To view or add a comment, sign in
3,559 followers
More from this author
-
Trillions of Cycles per Day: How SiFive Boosts IP and Software Validation with Synopsys HAPS Prototyping System
Synopsys Users Group (SNUG) 2d -
Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs
Synopsys Users Group (SNUG) 3w -
Accelerating the Pace and Precision of AI Chip Innovation: Synopsys Expanding ZeBu Cloud Capacity
Synopsys Users Group (SNUG) 1mo