The Photonics Group’s Post

If truly works "as advertised" and expandable to larger volumes - this could as well be a Holy Grail for functional reverse engineering and design verification of microelectronics #reverseengineering #semiconductorsecurity #hardwaresecurity #microelectronics #integratedcircuits

Hello, I'm excited to share one of my works in Semiconductor Design! 🚀 I would like to present some layouts on "Standard cell Design" 🌟 Standard cells are fundamental to creating digital integrated circuits, as they allow for a modular and scalable approach to design. standard cells are designed with a uniform height, we can't vary the height of the cells. We will vary the width that to in multiple of poly pitch. ⭐ Here are a few key points about standard cells: 1) Uniform Height :- All standard cells in a library have the same height. This uniformity simplifies the alignment of power and ground rails across the cells, making the power distribution network more straightforward. 2) Variable Width :- The width of standard cells can vary depending on the complexity and functionality of the cell. The width is generally a multiple of the poly pitch. 3) poly pitch: The distance between the centers of adjacent polysilicon gates. or the distance between center of two metal tracks (poly to poly). 4) Tracks :- Track can be defined as a line on which metal layers are drawn. A Track means one metal (M1) pitch. 🔹Height of standard cell is generally measured in terms of number of tracks inside it. These tracks influence the cell's density, power consumption, and performance. Here three types based on the number of tracks: 1) Ultra High Density (6 to 7 Tracks) 2) High Density (9 to 10 Tracks) 3) High Performance (12 Tracks) 💥Difference between Standard cells and Analog layout : 1) Half DRC rules follow in the standard cells. 2) In the analog layout we have tap connections in top and bottom. whereas in standard cell we create the individual taps, we will use tap less library, to save the area. 3) In standard cell we make on device routing. 4) In standard cell design, the height of the cell is typically divided evenly between the PMOS and NMOS transistors. It's great that your project on standard cell design has provided with valuable insights into analog aspects, and l'm very thankful to Suman Hallur at Epitome Circuits has been a supportive guide. Learning from experienced mentors can make a significant difference in understanding concepts and applying them effectively. #semiconductors #standardcells #VLSI #AnalogLayout #AnalogDesign #Engineering

X-Ray Upgrade Can See Transistors in 3D You can now make a map of even the most advanced chips without destroying them

Electronics scienticic Electronics is a scientific and engineering discipline that studies and applies the principles of physics to design, create, and operate devices that manipulate electrons and other electrically charged particles. Electronics is a subfield of electrical engineering, but it differs from it in that it focuses on using active devices such as transistors, diodes, and integrated circuits to control and amplify the flow of electric current and to convert it from one form to another, such as from alternating current (AC) to direct current (DC) or from analog to digital. Electronics also encompasses the fields of microelectronics, nanoelectronics, optoelectronics, and quantum electronics, which deal with the fabrication and application of electronic devices at microscopic, nanoscopic, optical, and quantum scales. Modern surface-mount electronic components on a printed circuit board, with a large integrated circuit at the top #snsinstitutions #snsdesignthinkers #snsdesignthinking

The deadline to apply for the "2024 Microelectronic Engineering Journal Middle Career Investigator Award and Lectureship" is May 1st of 2024! Find the instructions to apply here: https://lnkd.in/eKjNnTBu #KAUST #IEEE #SEMICONDUCTOR #ENGINEERING #TRANSISTOR #MEMRISTOR #2DMATERIALS #ELECTRONICS #MATERIALSSCIENCE

🌟 Training Completion Announcement 🌟 I am pleased to announce that I have successfully completed a six-week intensive training program focused on the role of ion implantation in the 180 nm CMOS process. This comprehensive experience has significantly enriched my understanding of various critical aspects of CMOS fabrication. 🔬 Key Training Highlights: 1. Clean Room Protocols: Mastered the fundamentals of contamination control and maintaining purity during the fabrication process. 2. Departmental Orientations: Diffusion: Learned about the process of adding impurities to silicon wafers to modify electrical properties. Photolithography: Studied the technique used to transfer patterns onto silicon wafers. Etching: Explored both dry and wet etching methods to remove material from the wafer surface. Thin Film: Gained insights into the deposition of thin films on wafers for various applications. Chemical Mechanical Polishing (CMP): Understood the planarization process essential for creating flat surfaces. Yield Analysis: Analysed techniques to measure and improve the number of functional devices produced. 3. Ion Implantation Expertise: - Developed proficiency in operating high energy, high current, and medium current implanters. - Gained in-depth knowledge of implanter operations, from source feed to implanted species. - Identified and implemented strategies to mitigate potential defects during the implantation process. - Studied 17 different types of implants, including retrograde well implant, halo implant, punch-through implant, and source/drain implant. 4. VLSI Fabrication Insight: - Acquired a comprehensive understanding of the entire VLSI fabrication process, from ingot to final product. - Experienced various semiconductor laboratory facilities, including design, testing, assembly, and packaging. This training has not only broadened my technical knowledge but also enhanced my practical skills in the semiconductor field. I am eager to apply these learnings to future projects and contribute to advancements in semiconductor technology. I would like to express my sincere gratitude to Semi-conductor Laboratory for providing this exceptional training opportunity. Special thanks to my mentor, Mr. Rajeev Ranjan Kumar, for his invaluable guidance, and to Mrs. Chumki Saha, Head of VFD, and Mr. Manoj Wadhwa, Head of VMFG, for their unwavering support. Thank you to everyone who supported me throughout this journey. I look forward to the next steps in my career. #CMOS #Semiconductor #VLSI #IonImplantation #Technology #ProfessionalDevelopment #CleanRoom #Photolithography #Etching #ThinFilm #CMP #YieldAnalysis #HighEnergyImplanter #HighCurrentImplanter #MediumCurrentImplanter #SemiconductorLab #Innovation #Tech #Gratitude #Mentorship

🌟 #Advancing #Electronics: A New Technical #Article by Arkema's R&D Team 🌟 We are proud to share that Jessica DeMott, R&D Manager, and Stephan Brandstadter, Principal Scientist Arkema's R&D Team were contributors to an insightful article on the future of #plasma #etching for #microelectronics. 📡🔬 This collaborative research between Arkema and industry partners explores innovative approaches that will shape the future of the electronics industry. We are incredibly fortunate to have such dedicated and brilliant minds contributing to our R&D efforts. “Future of plasma etching for microelectronics: Challenges and opportunities” ✅ Advancements in Technology: Discusses recent progress in plasma etching crucial for microelectronics development. ✅ Challenges: Highlights issues in achieving precise nanoscale etching. ✅ Future Directions: Explores innovative methods to improve etch selectivity, uniformity, and aspect ratio. ✅ Impact of Emerging Materials: Considers the influence of new materials and complex device architectures on etching processes. ✅ Next-Generation Devices: Focuses on the importance of plasma etching for the future of semiconductor devices. Read their full article here: http://arke.ma/SHps50SP1Y5  📝🔍 #JVSTB

2D materials will definitely contend with spintronics in the emerging areas of new generation of electronics that are ultrafast and energy efficient. These scientists designed a crucial process that may nudge 2D over silicon and spintronics if proven to be scalable. Achieving aligned growth of 2D semiconductors and their direct utilization on original vdWs epitaxial dielectrics to avoid disorders poses significant challenges. City University of Hong Kong (CityUHK) developed a hydromechanical strategy for aligned 2D material synthesis, pushing forward high-performance devices with as-grown 2D materials/vdWs dielectrics. "Directly utilizing 2D semiconductors on their as-grown substrates is significant in avoiding disorder-induced performance degradation of electronic devices. Our progress in this work ingeniously avoids the traditional material transfer process, which has substantial technological implications for unlocking the transformative potential of 2D materials," explained Professor Johnny Ho. In addition, establishing the quantitative criterion for the epitaxy relationship with vdWs dielectrics can be aptly viewed as a measure of our understanding and can guide experimental decisions effectively. This finding opens up exciting opportunities for realizing next-generation electronics on vdW dielectric platforms. The imperative to mitigate disorder-induced performance degradation in electronic devices has driven demand for the direct utilization of as-grown 2D materials/vdW dielectric. "However, the paradox is that the as-grown 2D materials are meticulously detached from the original substrates onto proposed dielectrics for further device fabrication," said Professor Ho. With this powerful methodology platform for synthesizing aligned 2D materials, predicting alignment directions, and preserving their intrinsic properties, future research can leverage this knowledge to develop novel manufacturing techniques, enabling the production of high-performance electronic devices with enhanced functionality, reliability, and scalability. Such devices may include large-scale integrated circuits, flexible and wearable electronics, advanced optoelectronic devices, quantum technologies, etc. Looking ahead, the research team aims primarily to transfer this technique to other 2D material systems to investigate their inherent properties and explore potential avenues for large-scale device integration. These endeavors aim to unlock further the transformative potential of aligned 2D materials on van der Waals dielectrics for developing innovative electronic devices. #climatechange #nextgenelectronics #2Dmaterials #supercomputers

Photonic integrated circuits (PICs) with rapid prototyping and reprogramming capabilities promise revolutionary impacts on a plethora of photonic technologies. We report direct-write and rewritable photonic circuits on a low-loss phase-change material (PCM) thin film. Complete end-to-end PICs are directly laser-written in one step without additional fabrication processes, and any part of the circuit can be erased and rewritten, facilitating rapid design modification. https://lnkd.in/estNF7Ed

Sputtering is a physical vapor deposition (PVD) process that involves the removal of atoms from a solid target material to form a thin film on a substrate. While conventional sputtering methods use DC (direct current) power, RF sputtering uses radio frequency alternating current power to enhance the efficiency and control of the process. Learn More: https://ow.ly/2gBy50Qzznc #sputtering #manufacturing #electronics #fabrication #physicalvapordeposition #pvd #process #cmos #atoms #material #substrate #technology #thinfilm #optics #materialsscience #semiconductors #datastorage #optics #coating #solarcell #solarenergy #lense #mirror #transistors #article