TRUMPF’s Post

Have you ever wondered how our devices keep getting faster, smaller, and smarter? The answer is EUV (Extreme Ultraviolet) Lithography—a revolutionary process that uses 13.5 nm light to craft features so small they’re measured in atoms. It’s the precision tool that’s shaping the future of semiconductor technology. Let me run you through why EUV lithography is the game-changer in chip manufacturing:

In semiconductor manufacturing, we use different states of matter to create layers of materials on the wafer. One of these processes is called physical vapor deposition or PVD. With PVD, the material transitions from a solid state to a vapor phase and then back to a solid state to help form the chip. Fascinating, right? Learn more here: https://bit.ly/4e1KM6X #semiconductors #MakePossibleABetterFuture

“It can produce extreme ultraviolet light with a central wavelength of 13.5 nanometres, meeting the urgent demand for EUV light sources in the photolithography market,” the official report said. In the semiconductor industry, the most complex and difficult-to-manufacture machine is the photolithography machine. #Semiconductor #Semiconductormanufacturing #semiconductors #Semiconductorindustry #SemiEDA #Semiconductortechnology #Semicon #ASML #EUV

Lam Research’s dry resist technology is advancing EUV lithography by addressing challenges in stochastic defectivity, cost, and sustainability. Recent qualifications for 2nm logic by imec and advanced DRAM manufacturing confirm its readiness for high-volume production. By integrating atomic layer deposition (ALD) for precise resist deposition and securing a stable precursor supply through partnerships with Entegris and Gelest, Inc., Lam has established a scalable solution for future semiconductor nodes. As the industry moves toward High-NA EUV, dry resist provides a viable alternative to chemically amplified resists (CARs), reducing multi-patterning complexity and improving process efficiency. #EUV #ALDep #Semiconductors #DryResist #HighNA #LamResearch #Lithography #ASML #imec

🚀 Tech Breakthrough: China's Leap in #EUV: HIT Develops 13.5nm Light Source for #Lithography Harbin Institute of Technology (HIT) researchers have developed a cutting-edge 13.5nm extreme ultraviolet (EUV) light source using discharge #plasma technology. This innovation addresses critical challenges in EUV lithography, offering high efficiency, low cost, and a compact design, potentially transforming China's semiconductor manufacturing capabilities. This breakthrough propels China's technological autonomy in #semiconductormanufacturing, potentially impacting the global semiconductor supply chain landscape. #SemiconductorInnovation #ChiTech #EUVLithography #TechBreakthrough

Mass produced advanced semiconductor chips are mind-blowing. "New approaches in the development of extreme ultraviolet (EUV) lithography are being pioneered by Chinese scientists, paving the way for the mass production of advanced semiconductor chips as researchers race to sidestep the strict sanctions put in place by the United States." https://lnkd.in/gDbuVUb6

🗞 Electronic News! 🗞 Philips has sold off its MEMS wafer fab and foundry in Eindhoven, The Netherlands, to a consortium of Dutch investors for an undisclosed sum. The foundry supplies ASML Lithography amongst others and has been renamed Xiver. The MEMS foundry has been purchased by a consortium of private investors led Orange Mills Ventures owned by Cees Meeuwis. Besides supplying components for ASML’s extreme ultraviolet lithography equipment Xiver provides infrared detectors for the automotive sector and has capability in capacitive micromachined ultrasonic transducers . #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Extreme Ultra Violet (EUV) is used to image patterns onto wafers in high-end semiconductor manufacturing. The EUV photons have sufficient energy (~92 eV) to ionize the hydrogen gas inside the lithography tools. This EUV-induced plasma has various positive and negative effects, ranging from material etching and degradation, to electrostatic particle deflection. These effects are complicated by the pulsation of the EUV light; it comes in short pulses: 100 ns of light each 20 µs (50 kHz). Therefore, the EUV-induced plasma is never in steady state, but always transient shifting between bursts of high-energy electrons (up to 78 eV) and decaying afterglow. #ASML https://lnkd.in/g2ARdXsJ

What’s better than Multibeam Corporation gracing the cover of Chip Scale Review, the authority on all things #semiconductor #advancedpackaging? Doing it TWICE…in a year! After 10+ years of development, last summer MultiBeam unveiled the industry’s first #productiongrade #electronbeam #lithography system, perfectly timed for the rise of #AI #semis and the unprecedented, exponentially rising demand for #compute, #power and #memory. New #IC architectures - lower power, faster and/or more conductive (via #compoundsemis) - are made possible with innovations in #manufacturing equipment. MultiBeam’s production-grade, high throughput systems use #electrons rather than lasers to pattern wafers, bringing a game-changing tool to the industry at a critical time. Partnerships with Synopsys Inc and SkyWater Technology are testaments to this technology coming to a #fab near you very soon! Congrats to Ken MacWilliams, Ted Prescop and team!

We're absolutely thrilled to announce another cover and article feature with Chip Scale Review! This technical article follows our July 2023 viewpoint feature which introduced Multicolumn E-Beam Lithography technology as a leading enabler of advanced packaging applications. In this piece, we dive further into how Multibeam capabilities are ushering in a new generation of advanced packaging that enables adaptive patterning of denser interconnects between chiplets – delivering the high speed, low power chip to chip communication required to leapfrog to next-generation performance of integrated chips. The industry is starting to refer to this as #AdvancedIntegration.   Enjoy the read, and as we always say - Watch. This. Space! Whenever you’re ready to Accelerate Chip Innovation on your next brilliant idea, we’re ready to chat. 💬 #AdvancedPackaging #AdvancedIntegration #MulticolumnEBeamLithography #Multibeam https://lnkd.in/g9p75Kgk