viaPhoton’s Post

View organization page for viaPhoton, graphic

4,635 followers

We are thrilled to showcase our latest innovations designed specifically to address the ultra-high density requirements of HPC/GenAI/ML applications at the 2024 OFC Conference. You can find our solutions in our trusted partner booths - Senko Advanced Components, US Conec Ltd., and 3M. Connect with Nathan Benton, Jeff Jones, and Chris Hasley at the show to learn how we have revolutionized the rapid deployment of hyper-scale data center fiber connectivity. #OFC2024 #viaPhoton #GenAI #MachineLearning #HPC #HyperReach #AI #FiberConnectivity #DataCenters #MadeinUSA

  • No alternative text description for this image

To view or add a comment, sign in

Explore topics