About
Amkor’s power packages are optimized to enable a wide range of applications, meeting market demands from automotive to communications to industrial. Enhanced for power-sensitive and mobile applications, our high-performance power devices include innovative packaging, advanced copper clip attach and modules.
Amkor’s experienced engineering team delivers full turnkey services, including test, for all power products. Let us put more than 40 years of experience and innovation in power packaging to work for your application!
This product is intended for
- Semiconductor Engineer
- Engineer
- Design Engineer
- Electrical Engineer
- Mechanical Engineer
- Mechanical Design Engineer
- Senior Engineer
- Electronic Engineer
- Automotive Engineer
- Power Engineer
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TOLL
Amkor's TOLL (TO-Leadless) is a highly efficient space-saving package designed for currents up to 300A in automotive applications and is suitable for high-power applications, designed for low on-resistance and high-speed-switching MOSFETs.
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D2PAK (TO-263)
Amkor’s D2PAK follows the JEDEC standard (TO-263) for high-power discrete products. Our D2PAK package is suitable for high-power applications (over 100A available), designed for low on-resistance and high-speed switching MOSFETs such as motor drivers, power supply circuits, DC-DC converters, and key applications for automotive in body, safety and lighting.
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PowerCSP™
PowerCSP™ is an innovative chip-scale power transistor package. It has a simple structure, excellent electrical and thermal properties, and a high-density form factor that suits the challenges of discrete or integrated packaging.
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PQFN
The PQFN (Power Quad Flat No-lead) is a highly efficient space-saving package designed for a wide range of higher power applications. A “Smart Power” option in today’s power electronic world, the PQFN is a step above the standard low-power sawn QFN package, while being more flexible (IC control die integrated designs) than other power discrete packages.
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PSMC
The PSMC power discrete package from Amkor is part of our FLAT series of compact surface-mount packages that is thinner and thermally enhanced, allowing for miniaturization. The copper clip interconnects structure of the PSMC package reduces electrical resistance and enhances thermal performance as compared to wire-bonded products.