ASML
Latest about ASML
Intel CEO Gelsinger says China is ten years behind in chipmaking capabilities
By Anton Shilov published
Intel CEO Pat Gelsinger says China's semiconductor industry is a decade behind, and it is going to stay this way.
Taiwanese 'CHIPS Act'-Line law enacted
By Anton Shilov published
Taiwan is set to subsidize semiconductor-related R&D as well as production CapEx.
China commerce minister frustrated by US 'interfering' in international lithography exports via third countries
By Anton Shilov published
China accuses the U.S. of instrumentalizing and weaponizing third-party country exports of advanced chipmaking tools.
TSMC won't adopt advanced High-NA EUV chipmaking tools until 2030 or later
By Anton Shilov published
According to China Renaissance, TSMC might adopt High-NA EUV lithography for a post-1nm process technology in 2030 or later.
Intel receives first High-NA EUV chipmaking tool from ASML
By Anton Shilov published
Intel receives the first components of ASML's High-NA EUV scanner.
Dutch government bans even simpler chipmaking tools from export to China
By Anton Shilov published
ASML can no longer sell its Twinscan NXT:2050i and NXT:2100i DUV lithography systems to Chinese clients. The impact isn't expected to be significant, given existing restrictions.
China's chipmaking tool purchases increase 1,050% in November
By Anton Shilov published
Shipments of litho tools accelerate by a whopping 1,050% year-over-year.
ASML ships groundbreaking new chipmaking tool to Intel — High-NA lithography tool needed for next-gen process nodes could cost ~$400 million
By Anton Shilov published
ASML on Thursday announced that it had begun shipping the industry's first extreme ultraviolet (EUV) lithography tool with a 0.55 numerical aperture (High-NA) to Intel.
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