Latest about High NA EUV
Analyst firm raises alarm about EUV chipmaking tool power consumption
Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.
Corning's Extreme ULE glass debuts for next-gen High-NA EUV chipmaking
Corning introduces new Extreme ULE glass for photomasks and mirrors to be used with next-generation EUV and High-NA EUV tools.
TSMC's first High-NA EUV litho tool to begin installation this month say industry insiders
TSMC to start installing High-NA EUV system for R&D purposes this month.
TSMC says it doesn't need High-NA EUV chipmaking tools for 1.6nm-class node, but Intel has championed the tech
TSMC says it will not need a high-NA litho tool for its A16 technology but will keep exploring it for A16 and beyond.
Intel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 14A process development in 2025
Intel Foundry announced it had completed the assembly of the industry's first commercial High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) machine in its D1X fab in Oregon.
ASML ships its second High-NA EUV litho tool to unspecified client
ASML begins to ship its High-NA EUV lithography system to the second customer
ASML sets density record with latest chipmaking tools — High-NA EUV equipment prints first patterns
ASML has reached another milestone with its Twinscan EXE:5000 lithography system.
Samsung rep says High-NA EUV is good for logic, but might have cost issues for memory fabrication
Samsung shares its views on High-NA EIV costs, while other companies present more bullish views.
