xMEMS Labs announces first all-silicon active fan-on-a-chip for mobile devices

News
By
published

Active cooling for smartphones in thin package.

The xMEMS XMC-2400 beside a smartphone
(Image credit: xMEMS Lab)

The leading provider of solid-state micro-speaker technology, xMEMS Labs, has announced the first all-silicon active micro-cooling fan-on-a-chip for use with mobile devices. The innovative technology will allow manufacturers to integrate active cooling into their smartphones, tablets, and other advanced mobile devices without sacrificing size.

Since manufacturers are constantly trying to reduce the size of our mobile devices, space inside the case is always at a premium. On the other hand, thermal management is becoming more critical with the advent of running processor-intensive artificial intelligence (AI) apps on-device. Gaming and computational photography needs have also become very GPU-intensive, thus leading to even more heat.

Without a solution for active cooling in these devices, hardware and software designers face limitations in what they can allow smartphones and similar devices to do. With the xMEMS Labs’ new XMC-2400 micro-cooling chip, they have a potential solution.

The XMC-2400 measures 9.26mm by 7.6mm and is just 1.08mm thick. It weighs less than 150 milligrams but can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The fan is inaudible and draws no more than an estimated 30mW of power.

xMEMS Labs XMC-2400 micro-cooling fan atop a US quarter

xMEMS Labs XMC-2400 micro-cooling fan on top of a US quarter for illustration of its size (Image credit: xMEMS Labs)

xMEMS based the technology on the same fabrication process it uses for its Cypress full-range micro speaker for ANC in-ear wireless earbuds, like the Creative Aurvana Ace that debuted in December 2023.

Joseph Jiang, co-founder and CEO of xMEMS, says the innovation “comes at a critical time in mobile computing.” Offering a solution that can provide active cooling to the smallest handheld computing devices will help solve the heat problem generated by processor-intensive AI apps and games on ultra-mobile devices, he says.

In addition to smartphones, tablets, and laptops, xMEMS says the XMC-2400 could be used in external SSDs, wireless chargers, and virtual- and mixed-reality goggles. xMEMS plans live events in Shenzhen and Taipei beginning in September to demonstrate XMC-2400 to its customers and partners. The company plans to start production in the second quarter of 2025 and has several customers already committed to the device.

Jeff Butts
Jeff Butts
Contributing Writer

Jeff Butts has been covering tech news for more than a decade, and his IT experience predates the internet. Yes, he remembers when 9600 baud was “fast.” He especially enjoys covering DIY and Maker topics, along with anything on the bleeding edge of technology.

3 Comments Comment from the forums
  • gg83
    These appear smaller than the air jet mini. I think this type of cooling is awesome. Eventually I wanna see the heat turned back into power. I know groups have made some progress on that.
    Reply
  • bit_user
    Can we assume it supports a range of speeds?

    It'd be neat if it also turns out to be configurable for cooling specific hot spots. You could use temperature sensors embedded in the SoC to determine which spots are most in need of cooling. Perhaps this could further reduce power consumption (i.e. as opposed to just cooling the entire thing).
    Reply
  • kjfatl
    Camera sensors get noisy when they get hot. I can see using this to cool the camera in a cell phone, especially for night shots. I can also see it being used to circulate air within the case of a cell phone with no outside air source.
    Reply