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Demand for large panel driver ICs is set to rise sequentially throughout 2024, with ample overall supply. However, uncertainty in end-user demand has led to conservative stocking practices in the supply chain, fostering a reliance on short-term, rush orders—a practice that threatens long-term supply chain health.
In 2023, mobile TDDI chips benefited significantly from active repair and second-hand markets, resulting in annual shipments far exceeding intial forecasts. The release of lower-cost capacities by Chinese wafer foundries has helped sustain robust demand for mobile TDDIs through 2023 to 2024. Nonetheless, intense comptition in this segment has escalated price wars.
For AMOLED driver ICs, the introduction of new production capacities has boosted demand as AMOLED smartphone panel penetration increases. Currently, the market faces no-short-term supply shortages. As more suppliers enter the AMOLED DDI market, prices continue to decline. Maintaining profitability in AMOLED DDI production remains a critical challenge for IC manufacturers, especially with stable wafer prices.
1. Different Types of Automotive Main Control Chips
2. MCU
3. Cockpit SoC
4. Autonomous Driving SoC
5. TRI’s View
The anticipation of AI-Generated Content (AIGC) applications approaching large-scale commercial deployment has triggered a sharp rise in demand for AI chips, significantly impacting the global high bandwidth (HBM) market. This report will provide analysis from two fronts: First, it will explore the development of AIGC applications and large language models (LLMs). Then, it will examine the evolving needs for ASICs, GPUs, and HBM crucial for AI-powered cloud computing.
The AI chip is undoubtedly the lifebuoy of the technology industry in 2023, creating new vitality in the industry downturn. In 2024, this wave will undoubtedly continue to sweep through the industry with more services being created under Gen AI. NVIDIA, as it dominated the AI chip market in 2023, will be facing additional challenges in 2024, including whether in-house chips from the six major CSPs, such as Microsoft, Google, and Amazon, will pose as potential threats.
Chinese players, who can only purchase downgraded versions of NVIDIA chips currently, have also turned to purchasing in-house chips from China. This report will analyze which Chinese suppliers are being driven by this trend. Advanced packaging CoWoS that was regarded as a bottleneck for the capacity of AI chips throughout 2023, as well as the additional of new suppliers for 2024, will also be covered in this report.
As global internet data transmission volume continues to reach new highs, the performance bottleneck of light communication solutions becomes increasingly apparent. This report, on the one hand, explores the shortcomings of existing light communication solutions. On the other hand, it focuses on silicon photonics and CPO technology, analyzing their competitive advantages in the field of light communication, and keeping track of the development dynamics of key manufacturers.
1. Key Developments in Generative AI Products, Services, and Regulatory Standards
2. Analysis of Major CSPs’ 4Q23 and Recent Financial Reports
3. Strategic Deployment of Generative AI by Major CSPs
4. TRI’s View
1. Supply-side Outlook: Server DRAM and CPUs
2. Demand-side Outlook: Server Brands and CSPs
3. Server DRAM Price Trends
4. TRI's View
1. Development of Global AI Industry Chain
2. Analysis of Cross-Modal Business Opportunities in AI
3. A Breakdown of Hardware Supply Chain
4. TRI’s View
1. Global Overview of the AI Market Development
2. The Necessity of Openness in AI Development
3. Current Applications and Development of AI
4. TRI’s View
Driven by advancements in AI and Generative Content (AIGC), the role of PCs is evolving to reshape how we use technology. PCs that offer a blend of computational power, efficiency, and security are becoming the preferred environment for AI computations and machine learning, enabling personalized AI applications on a large scale. At present, AI PCs are just beginning to emerge, with their development hinging on both hardware innovation and software advancements to propel the future of AI computing forward.