AT&S

Empowering Young Minds in Nanjangud 🎓✨ Education is the key to progress. AT&S India is proud to support the opening of a new building for Nagamma’s Girl School in Nanjangud. Our team joined the school community to celebrate this milestone and reinforce our commitment to supporting young minds. “Under the AT&S CSR initiative, we are not just constructing walls and roofs, but shaping futures and empowering young minds”, says R S SIMHA, Senior Director Finance in India. With over 10.000 lives positively impacted, our journey of supporting education, healthcare, and community well-being continues. 💙 #ATS #oneATS #EducateTheFuture #BuildingFutures #CSR

Strengthening Sustainable Growth with IFC 🌍🤝 Yesterday, AT&S and the International Finance Corporation (IFC) signed a $250 million sustainability-linked loan agreement at our headquarters in Hinterberg. This funding will support our state-of-the-art IC substrate plant in Kulim, Malaysia – an important step in our expansion despite challenging market conditions. “We are delighted to have the support of IFC as partner in our growth,” says CFO Petra Preining. Carsten Mueller, Regional Industry Director at IFC, added: “We’re excited to partner with AT&S on this financing, which ranks as one of the first sustainability-linked loans in Malaysia’s electrical and electronics products industry.” A big thank you to IFC for their trust in our vision! #ATS #oneATS #SustainableFinance #Innovation

Part of the AT&S Malaysia Team from Day 1 – The Inspiring Journey of Nur Shazana Mohd Faisal 🌟 Hailing from Kulim, Malaysia, 'Zana' has been with AT&S from the very beginning and has been an essential part of our pioneering team. Since her early days at AT&S, she has made a significant impact in the microelectronics and construction sectors. In her role as Document Controller, Zana ensures the accuracy and integrity of company documents, handling approvals, submissions, and interactions with local authorities and contractors. What makes AT&S so special for Zana? 🔷 A strong culture of collaboration and team spirit 🔷 Continuous opportunities for growth and learning Learn more about Zana's story: https://lnkd.in/dCxyBsgc

Advancements in miniaturization and performance through SiP technology System in Package (SiP) technology combines multiple integrated circuits and components into a single package, driving innovation in miniaturization and performance. This is essential for the future of AI, high-performance computing, and IoT. Learn how SiP is transforming the electronics industry – read the full article now! 📦⚡

Exciting milestone for AT&S in South Korea! 🌏 We are excited to announce that our new sales office in Seoul is finally open – an important milestone in our global growth strategy. This new location strengthens our ability to collaborate even more closely with our partners in South Korea. The inauguration was honored by the presence of Dr. Wolfgang Angerholzer, Ambassador of the Republic of Austria to Korea, and Wolfgang Köstinger, Trade Commissioner of Advantage Austria. Ambassador Angerholzer said: “The opening of the new AT&S sales office in Seoul shows the company’s commitment to the Korean market. The continued presence of AT&S highlights the importance of industrial cooperation and the leading edge of Austrian high-tech companies like AT&S.” “With the new sales office in Seoul, we are creating the foundation to deepen our partnerships with famous South Korean conglomerates in the Electronics and Automotive Industry and to offer innovative solutions for key industries such as AI, automotive, and wireless communication,” emphasized Andreas Wippel, Vice President Sales Electronics Solutions, in his opening speech. We look forward to an exciting future in one of the world’s most dynamic high-tech regions. Thank you to everyone who joined us for the official opening. #ATS #oneATS #SeoulOpening #Partnerships #Innovation #HighTech

The world of IC substrates is evolving – and it’s transforming faster than ever! 🚀🌍 Meet our expert Gerald Weis at IMAPS 21st Device Packaging Conference 2025. Listen to his presentation of his latest paper, where he highlights the key findings and methodologies that address challenges associated with power delivery losses, thermal management, and the overall architectural design of IC substrates. With the growing demand for higher current capacities and faster data transmission, IC substrates need to be reimagined. The key to the future lies in innovative solutions like integrating power delivery and optical interfaces. 📅 When? March 4 at 2:00 pm 📍 Where? IMAPS 21st DPC 2025, Arizona, USA Don’t miss the opportunity to listen to our session. See you in Arizona. #ATS #oneATS #IMAPS #icsubstrates #electronics

Advancing Network Efficiency: The European-Funded PUNCH Project 🌐 AT&S is proud to host the yearly face-to-face meeting in Leoben, Austria. The PUNCH consortium comprises seven partners from all over Europe: imec, PHIX Photonics Assembly, NVIDIA, Ericsson, Fraunhofer IZM, Innolume GmbH, University of Cambridge, Ghent University and AT&S. The PUNCH project focuses on important industrial requirements, such as low-latency communication, reduced power consumption, and advanced photonic integration. PUNCH addresses these needs with the aim to enable agility and adaptiveness of data center networks. AT&S contributes by integrating a fan-out waver level package (FOWLP) on and into an IC substrate using either flip-chip - or embedding technology. Both integration technologies will be further developed with the aim of delivering cutting-edge solutions that meet the stringent requirements of our customers. We would like to thank all project partners for the great collaboration. Let's continue to support and celebrate such initiatives that contribute to a more connected world. 🤝 #ATS #oneATS #PUNCHproject #Photonics #5G #datacenter

📢 Exciting news from AT&S! As of May 1, 2025, Dr. Michael Mertin will take over as CEO for the next three years. With a strong background in leadership, technology, and innovation – including 10 years as CEO of JENOPTIK AG – he brings a wealth of experience to drive AT&S forward. “AT&S is an internationally renowned high-tech company that makes important electronic products for everyday life possible with its innovative customers and technologies. I myself have spent my training and my professional life in different fields of technology and with leading technology companies. Shaping the future through innovation and entrepreneurship will always be an exciting challenge – and I am thrilled to take up this challenge,” says Dr. Michael Mertin. The AT&S Supervisory Board is confident that with his expertise and vision, Dr. Mertin will lead the company to new heights in the global microelectronics industry. Join us in giving him a warm welcome! 🎉🤝 #ATS #oneATS #Leadership #Innovation #Future

With Heart and Passion for AT&S – The Career Success Story of Manfred Fastl 🚀🔧 For 25 years, Manfred Fastl has been shaping his career with AT&S – an inspiring journey from process technician to leadership team member. His deep connection to his local community and relentless commitment to efficiency and team spirit have made him a valued leader. What makes AT&S so special to Manfred? 🔹 International success combined with a grounded corporate culture 🔹 Technological progress with a clear focus on people 🔹 A strong sense of collaboration that fosters growth and success Learn more about Manfred's inspiring journey and his passion for AT&S: https://lnkd.in/dCf86AD5 #ATS #oneATS #teamATS #AdvancedTeamSpirit

Time to get ready for OFC Conference 📆 We are excited to be part of the Technology Showcases series at the upcoming OFC Conference. Mily Hu, Director Business Development & Application Strategy BU ES will hold a keynote on “Advanced Circuit Board Technology for High Speed Optical Interconnects” on April 2nd at 11:00 am. Visit us at Booth 5580 and listen to her speech to find out how AT&S's advanced circuit board empowers such high-speed solutions in all types of optical interconnects, e.g., pluggable, OBO, Co-Packaged, non-standard form factor, etc. We look forward to seeing you there! 🤝 #ATS #oneATS #innovation #OFC2025