aSpect Systems GmbH

Semiconductor Industry is full of great technologies. One thing is “Stitching” which allows to fabricate devices larger than the single exposure filed of the stepper. This allows for example to realize very large image sensors, up to wafer scale image sensors with just one die per wafer or very long line sensors. To support wafer test services for large CIS or CCDs is one of our key expertise. The image shows a wafer test setup for a 200mm wafer with one die per wafer. Does not matter how large and fast your image sensor is, we can test it at speed and temperature on Wafer Level and also on Dicing Frame Level. Please challenge us with your probing request! By the way, isn't it amazing how complicated we make our lives by using so many different terms for one and the same thing? Especially in such standardized semiconductor processes? I have come across the following terms for wafer and/or frame level tests in the last 3 decades: Probing in General: Wafer Probing Wafer Testing Wafer Test Wafer Electrical Test Wafer-Level Test Wafer-Level Validation Wafer-Level Screening Wafer-Level Functional Testing Wafer Quality Test Wafer Mapping Wafer Performance Testing Probing Probe Testing Die Sort Die Probe Testing Die-Level Wafer Test Advanced Wafer Testing Automated Wafer Testing Defect Density Wafer Test Functional Wafer Test High-Volume Wafer Testing Non-Destructive Wafer Test On-Wafer Testing Semiconductor Wafer Test Front End: Wafer Acceptance Testing Parametric Wafer Test Wafer Process Monitoring Some Special Tests: Wafer-Level Reliability Test Wafer-Level Burn-In Know Good Die (KGD) Perhaps you have come across many more terms? 😊 aSpect web: https://lnkd.in/ez_rWQUw aSpect @ LinkedIn: https://lnkd.in/epNEMEsh #OSAT #WaferTesting #EWS #aSpectTestService #siliconsaxony #flanderssemiconductors

🌟 Exciting News! 🌟 We are thrilled to announce the addition of our new Accretech AP3000 Probe Station to our semiconductor wafer test services lineup! 🎉 This advanced prober, equipped with the ATT L300T-60-LN Low Noise Thermal Chuck, significantly enhances our testing capabilities. Here are some key features: 🔹 Wide Temperature Range: Supports a temperature range from -60°C to 200°C, allowing for comprehensive testing under various conditions. 🔹 Low Noise and Vibration: Ensures stable and precise measurements with minimal electrical noise and vibration, crucial for high-precision applications. 🔹 Tilt Compensation: Allows for better probe-to-pad alignment, improving accuracy and reliability in our testing processes. 🔹 High Precision and Stability: With a temperature resolution of 0.01°C and stability of ±0.1°C, our system guarantees consistent and accurate temperature control. With these cutting-edge features, we are set to deliver even more precise and reliable semiconductor wafer testing services, meeting the highest industry standards. So, we can perform even more wafer test and these system features are very beneficial for wafer scale image sensors, ultra-high-speed CIS, low noise detectors and sensors, stacked and high dynamic range imagers. Stay tuned for more updates as we continue to expand and enhance our testing capabilities. Thank you for your continued support! aSpect web: https://lnkd.in/ez_rWQUw aSpect @ LinkedIn: https://lnkd.in/epNEMEsh #OSAT #WaferTesting #EWS #aSpectTestService #siliconsaxony #flanderssemiconductors

Next week Image Sensor Europe will take place in London, as every year aSpect will be exhibiting again and we are looking forward to meeting old friends and new faces from the image sensor scene. The technical committee has once again put together a very informative programme with top-class speakers and the exhibitors are only too happy to inform conference delegates about their latest products and services for the development and manufacture of the next generation of sensors and imaging systems.  Agenda: https://lnkd.in/dsmvThz aSpect web: https://lnkd.in/ez_rWQUw aSpect @ LinkedIn: https://lnkd.in/epNEMEsh #aSpectTestService #siliconsaxony #flanderssemiconductors

Semiconductor backend industry is full of fantastic commercial-off-the-shelf vendors, the evolved efficiency of these tools is part of all over semiconductor success since the 1960s in terms of performance, reliability and cost. But there is always a need in this industry for custom equipment to support new ideas, specific niche processes or simply to go new ways in established manufacturing. aSpect has a long track record to realize custom equipment in the fields of test systems, active alignment solutions for cameras, visual inspection systems for wafers or pick & place machines for electro-optical components. The video shows an example of a system that can transfer dies between dicing frames and waffle/gel- packs. There are many applications were such automated processes are necessary for development and low/mid high end production. aSpect is using such a system for test services, we receive devices in Waffle/Gel-pack, transfer them onto frames and perform automated die test with a Accretech Frame Prober. We use it also for supply chain management to transfer or sort dies between dicing frames and waffle/gel- packs. Please do not hesitate to contact us to discuss your custom equipment requirements with us! Please note, we are in good cooperation with other automation companies, together with partners we have realized full automated inline production processes for cameras or end of line test solution.   https://lnkd.in/ez_rWQUw https://lnkd.in/epNEMEsh #aSpectTestService #siliconsaxony #flanderssemiconductors

Elevating CMOS Image Sensor Packaging with our COB Expertise In the realm of semiconductor packaging, precision and innovation are the keys to unlocking the full potential of CMOS image sensors. At aSpect, we're proud to share our specialized expertise in designing Chip on Board (COB) packages tailored specifically for CMOS image sensors, whether they're small format, large format, or even wafer-scale imagers!   Why Our COB Packages for CMOS Image Sensors Stand Out: Precision Engineering: We understand that the heart of imaging systems lies in the CMOS image sensor. Our COB packages are meticulously designed to ensure minimal signal interference and maximum image quality, whether it's for small, large, or wafer-scale imagers. Miniaturization Mastery: Shrinking the form factor of imaging devices while maintaining performance is our forte. Our COB solutions enable compact, high-resolution imaging solutions for a wide range of applications. Optimized Thermal Management: CMOS image sensors can generate significant heat. Our COB packages are engineered for superior thermal dissipation, guaranteeing consistent performance in demanding conditions. Reliability Redefined: With fewer interconnects and robust design, our COB packages enhance product reliability, critical in applications from smartphones to large-scale industrial imaging systems.   Our Specialized Focus: CMOS Image Sensors, Large Format, and Wafer-Scale Imagers At aSpect, we have dedicated ourselves to perfecting the art of COB packaging, not only for standard CMOS image sensors but also for large format imagers and wafer-scale imagers. Whether you're working on advanced surveillance systems, cutting-edge smartphones, or groundbreaking industrial imagers, our expertise can elevate your project.   Are you an engineer or project manager seeking top-tier CMOS image sensor packaging solutions, including large format and wafer-scale applications? Connect with us today, and let's explore how our COB expertise can enhance your imaging applications!   #SemiconductorPackaging #CMOSImageSensors #LargeFormatImagers #WaferScaleImagers #COBPackages #Engineering #Innovation