SÜSS MicroTec

We have asked Björn Böckle, our Director of Software Engineering, three questions on the topics of software as a unique selling point and the requirements for software developers. ⤵️ 1️⃣ Can you differentiate yourself with software?    Yes. And we do: We can be very responsive to customer needs. Some of our software is extremely customisable and can be assembled like Lego bricks.  Not only can features be turned on or off, but the entire logic can be changed or added through pure configuration. On other platforms, we can use a scripting language to add new functionality via easily customisable 'apps', allowing us to respond very quickly to customer requirements - often without having to modify the software. 2️⃣ You have a very large, broad-based team in Germany, the US and Taiwan. How do the tasks within the team differ?    ➡️ On the one hand, we have colleagues who look after the tool controller, i.e. the interface between our cluster systems and the customer. They ensure, for example, that the processes are perfectly synchronised and that the load ports are correctly controlled.  ➡️ Other team members focus on tool automation, such as ensuring that the robots work smoothly and that process data is written to databases.  ➡️ Some of us also program the process control software that regulates the temperature, moves the motors or measures the thickness and characteristics of a wafer, for example. 3️⃣ The wide range of tasks requires our software developers to have not only technical knowledge, but also good communication skills. This begs the question of what other soft skills are needed.   Empathy is also very important. Our software developers need to empathise not only with the service providers, but also with our customers. This requires an independent way of working and an analytical approach. In addition, a software developer must be eager to learn and open to constant development - our pulse is fast, which is what makes our job so attractive. → Would you like to be part of an innovative company in the semiconductor industry? We offer a wide range of exciting opportunities. Take a look at our current vacancies.    🔗 You can find the link in the comments.     #sussmicrotec #semiconductor #career

Taking a look back at the SUSS MJB3 mask aligner and how far we've come. ⤵️ In 1963, SÜSS MicroTec introduced a revolutionary device that would change the semiconductor industry forever - the MJB3 mask aligner. This groundbreaking technology enabled the precise alignment and exposure of photomasks on wafers. As an entry-level system, it still plays a central role in the introduction of lithography in the academic sector. While the MJB3 set the standard over years, SÜSS MicroTec has continued to innovate. The successor model, MJB4, shows just how far we've come. Nevertheless, it was a journey from MJB3 to MJB4, which was launched in 2003, with several stops and technical improvements over the years. Since the 1960s, more than 2000 systems have been installed. Let's take a look at the top advancements: ➡️ Ability to handle wafers up to 4 inches, compared to the 3-inch limit of the MJB3.   ➡️ Switch from mercury vapour lamps to environmentally friendly LED light sources few years ago.  ➡️ Transition from analogue cameras with a direct view to digital cameras with a monitor display and a zoom function. These improvements highlight our commitment to the development of cutting-edge technologies that drive the semiconductor industry forward. 💬 What memories or insights do you have from the early days of semiconductor manufacturing? We’d love to hear about the technology and innovations that made an impression on you. Please share your perspectives in the comments.  #sussmicrotec #semiconductor

How big will the semiconductor industry be in 2030? In meetings with analysts and investors, it is not unusual for our CEO, Burkhardt Frick, and our VP Investor Relations and Communications, Sven Köpsel, to be asked this particular question about expected market growth. With the global semiconductor market poised for massive growth over the next decade, the question remains: how fast and to what new heights? Experts have long predicted that the market will reach $1,000bn by 2030. Some analysts are now upping the ante, predicting $1,300bn, or even more. Technologies such as generative AI, data storage, communications, high-performance computing and automotive electronics are driving future chip demand. As an equipment manufacturer, we keep a close eye on the semiconductor market as a whole. Because the growth of the semiconductor equipment market is inherently linked to the (expected) growth of the semiconductor end market. The math is very simple: The larger the growth of end markets and applications, the greater the incremental demand for (our) production tools and technologies. There is no crystal ball, but the direction is clear: An insatiable demand for microchips that drive innovation. Finally, we would like to emphasize again: The semiconductors of tomorrow need the equipment of today! 💬 We are curious and interested in your opinion on this topic. Feel free to share your thoughts in the comments. #sussmicrotec #semiconductor #innovation

Resting on our laurels after a very good first half year? Certainly not, if you listen to our CEO Burkhardt Frick. ➡️ From the beginning of the year, we emphasized that it would be particularly important to use the high order book for profitable growth in 2024. 🙌🏼 We did that very well in the first half of the year, with sales growth of 45.6% and gross profit and EBIT margin improvements of 4.2 and 6.9 percentage points, respectively. 📈 We are confident that we can continue this positive sales and margin momentum in the second half of the year and have consequently raised our guidance for all three key forecast figures already three weeks ago. Interested in reading the full half-year report?  You will find the link in the comments. #sussmicrotec #semiconductor  

Are you heading to #SEMICONTaiwan? Together with over 1100 exhibitors at 3700 stands, SÜSS MicroTec will be represented at SEMICON Taiwan 2024. 🗓️ September 4 – 6  📍 TaiNEX 1&2, Taipei | Booth N0476 ➡️ The theme of this industry event is "Breaking Limits: Powering the AI Era" - exploring how collaboration within the semiconductor community is driving AI innovation. And as we delve into the future of AI, we are also taking a moment to honor our past. 🎂 We are celebrating our 75th birthday at the trade fair! Come by on September 4, at 2 pm and enjoy a piece of cake or some German beer in a festive atmosphere. Meet our team and have many good conversations at our party! Will we see you at the SÜSS MicroTec booth? Let us know that you are coming and what you are most looking forward to! SEMICON Taiwan 2024 promises to be an exciting and memorable event. #sussmicrotec #semiconductor #SemiconTaiwan

"Ever wondered how we make sure every part of a microchip is perfectly coated? Let's dive into the world of spray coating!" ⤵️ The term “spray coating” is often used in the semiconductor and electronics industry. For all industry experts, the term is probably clear. For everyone else, we want to explain it very simply today so that everyone can really understand what is happening here. Imagine you want to frost a cake. 🎂  Instead of simply pouring the icing over it, use a spray bottle to spread it evenly. This way, every corner and all sides of the cake will be evenly covered, no matter what shape it is. That's basically what we do with spray coating - but instead of icing on cakes, we spray special solutions on wafers! With spray coating, the solution is sprayed onto the wafer through a nozzle. The nozzle moves in such a way that the solution is evenly distributed over all shapes on a pattern surface. These solutions are very thin, so that tiny droplets are created and form an even layer. Why is this important? Sometimes the wafers we coat have small bumps and pits. With spray coating, we can ensure that the coating is everywhere, even if the surface is not completely flat. Spray coating is a great way to apply even layers to wafers - no matter how complicated their shape or surface.   💬 Do you have any other suggestions on how to explain spray coating simply? Feel free to write them in the comments. We are looking forward to your creative suggestions. #sussmicrotec #semiconductor 

It's a bittersweet moment as we honor the journey of someone who has grown with us and is now moving on to take on a new opportunity. We have some news to share: After 16 years with our company, Stefan Lutter has decided to leave SÜSS MicroTec at the end of July to pursue a new career opportunity. He is taking over the position as CTO at Manz AG. As we say goodbye to Stefan Lutter, we are sad to see him go, but at the same time very grateful and proud of everything he has done for us. Looking at his impressive development is a great example for the growth stories that are possible within our company. Stefan has been an integral part of the SÜSS MicroTec family for over a decade and a half. After earning degrees from the University of Applied Sciences Regensburg and Steinbeis University Berlin, he first joined us back in 2008. He held positions as Product Manager and Business Unit Manager for the Coater/Developer and Bonding business units. Most recently, he served as Senior Vice President of R&D and Managing Director of SUSS MicroTec Solutions GmbH & Co. KG. Stefan's vision and leadership qualities have been vital in driving our company forward. Under his guidance, over the years we have launched many innovative new solutions onto the market, such as the temporary bonder and debonder platform. Of course, we wish him all the best. His commitment and talent will undoubtedly bring him great success in his new role. Stefan's legacy at SÜSS MicroTec will live on through the many innovations he has driven and the culture he has helped to create. With this we would like to say: Thank you for everything, Stefan Lutter and best of luck for your next chapter. Don’t be a stranger. #sussmicrotec #semiconductor #career

Solving complex engineering challenges can seem daunting. The theoretical knowledge doesn't always translate easily into practical solutions. But with persistence and the right mindset, these hurdles can be overcome. Huiju Byeon found this to be true in her role as a Field Service Engineer at SÜSS MicroTec in Korea. With a Bachelor's degree in Semiconductor Display Engineering, she was eager to apply her academic knowledge. However, she quickly realized that real-world equipment issues require a different approach than textbook scenarios. We wanted to find out more about Huiju Byeon and her job as a Field Service Engineer and asked her 3 questions: 1️⃣ What makes your work so challenging? HuiJu: I work with our Korean customers to ensure that our photomask manufacturing and cleaning equipment is installed or up and running quickly in the event of a failure. In doing that, I have to solve challenges that are on a different level and have a different urgency than what I knew from textbooks. I have to understand the tool. I need to understand the process. The search for solutions can be exhausting, but it makes you all the happier when a system runs reliably for the customer. 2️⃣ What is your approach, to keep going until a solution is found? HuiJu: My recipe is curiosity and enthusiasm. Teamwork is also part of it. Sharing experience and knowledge in a team is incredibly important, especially for new colleagues like me. It's all the more rewarding to achieve this together. I look forward to the opportunity to continue growing. I'm sure that SUSS MicroTec and our customers will benefit from new skills and more experience. 3️⃣ What is your favourite project to look back on? HuiJu: That was the installation of a new mask cleaner. We prepared and rehearsed for a long time. To see a satisfied customer at the end was an indescribable feeling and the perfect reward for my efforts! ➡️ HuiJu's story shows that persistence and passion, combined with collaboration, can conquer the toughest on-the-job challenges. Her hunger to continuously improve will undoubtedly lead to further success and growth in her engineering career. Her experience proves that with the right mindset, early career engineers can thrive when faced with daunting real-world problems. Do you also want to become part of an innovative company in the semiconductor industry? SÜSS MicroTec offers a wide range of exciting jobs. Take a look at our current vacancies. 🔗 You can find the link in the comments. #sussmicrotec #semiconductor #career

We recently reported about our new ECD8. We want to give you more insights into this tool and find out from an expert what makes the new ECD8 so special in his eyes. ⤵️  We therefore asked Manuel Schmutz, Product Manager Coating Systems at SÜSS MicroTec: “The ECD8 impresses with its simple, intuitive operation and quick installation. The integrated media cabinet eliminates the need for an additional external cabinet. Particularly noteworthy is the one hand centering system, which makes centering round wafers much easier. Even the basic model is equipped with a programmable dispense arm, which makes the ECD8 extremely versatile. The excellent visibility of the process allows the operator precise control. Last but not least, the fast delivery time ensures that our customers can quickly integrate this advanced tool into their processes.” If you're still wondering what exactly we're talking about, we've summarised everything for you: ⤵️ The ECD8 platform is an enhanced tool that opens up a wide range of applications. It is available as coater or developer and can be perfectly customized. The four op- tions range from a semi-automated open-bowl spin coa- ter to a coater with either GYRSET® cover or air barrier plate and a puddle developer tool. Thanks to its versa- tility the ECD8 is perfect for use in R&D as well as series production. With the large number of variants and configurations available, substrates from 2" to 200mm as well as square ones up to 6" edge length can be coated or developed on the ECD8. The platform can be equipped with up to two well proven dispense lines and pump configurations for processing resists with vis- cosities from <1 cps up to 4000 cps. ➡️ UNIQUE GYRSET®:  As an additional option the GYRSET® rotating cover can be integrated into the ECD8 spin coating module. For various photoresists and applications, the GYRSET® technology enables a wider process window. Furthermore, square substrates and pieces can be coated all the way to the corners with a homo- genous resist thickness. ➡️ AIR BARRIER PLATE:  The air barrier plate is an alternative to the GYRSET® rotating cover. Positioned above the chuck surface, this static plate is designed to minimize turbulence across the wafer. All standard chucks can be used with this technology. The air barrier plate is particularly suitable for applications with high spin rates. ➡️ SOFTWARE:  The Linux-based software installed on the ECD8 is charac- terized by a particular user-friendly graphical user interface. The intuitive icon-based software makes operation of the ECD8 easy. Basic information such as the status of the supply media as well as the current performance values can be checked in real time on the touchscreen monitor. 💬 We are interested: Do you like insights into our tools? What exactly would interest you? #sussmicrotec #semiconductor #coater #developer 

Simply explained: What is spin coating? ⤵️ Spin coating is the process of evenly coating a spinning substrate with a solution. The solution, for instance, a photosensitive resist, is typically dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film. ➡️ For all those who do not deal with this topic on a daily basis, we have tried to make the whole thing even clearer using an easy example: A spin coater is used to apply uniform and ultra-thin layers of photosensitive resist liquids onto the flat surface of wafers. This is crucial for manufacturing microchips and other high-precision components in semiconductor, micro- and nanotechnology industries. The process ensures the layers are uniform, which is critical for the functionality and performance of these technologies. Imagine a plate spinning very fast. When you pour a special liquid, like a thin paint, onto the middle of the plate, it spreads out evenly because of the spinning. As it spins, the extra liquid flies off the edges, leaving behind a smooth and even layer on the plate. The speed at which the plate spins, how fast it speeds up, and how long it spins all work together to make sure the layer of liquid is just the right thickness. The type of liquid you use also affects how thick the layer becomes. Understandable? By the way: Our spin coaters, spray- and inkjet coaters have become synonymous with premium performance, ease of use, flexibility, and enhanced coating mastery. With a complete line of compact and user-friendly resist coating equipment from economic low-volume laboratory tools to high-end production systems up to 300 mm SUSS MicroTec coaters and developers enable the formation of resist layers ranging from below 1 µm to over 500 µm.  Since we only talked about spin coating today, there will of course be a posting about spray- and inkjet coating soon. Be sure to follow our account SÜSS MicroTec so you don't miss it. 💬 Do you have any other suggestions on how to explain spin coating simply?  Feel free to share in the comments. We are curious!    #sussmicrotec #semiconductor