The Photonic Enabled Cloud Computing (PECC) Summit just wrapped up today, and here are my personal takeaways from the event:
1.) It is clear that optical interconnects are a key enabling technology for AI Datacenters (but we all knew that, that's why we were there)
2.) There's been a lot of talk over the years about different approaches like Linear Pluggable Optics (LPO), Near Packaged Optics (NPO) and Co-Packaged Optics (CPO). This event cleared up that it's not a question of one or the other, but rather that each will have its place. Some applications require the flexibility LPO offers, while others need the higher performance that CPO provides, so all of these solutions will coexist depending on the use case.
3.) The real question is: What copper interconnects will be replaced by optical interconnects? It's thought that optics could replace copper for meter-scale GPU-to-GPU connections (like NVLink), this is still to be proven but there are many are working on it. Meanwhile, copper is expected to remain dominant for shorter, mm-scale connections like GPU-to-HBM3.
4.) Silicon photonics is being implemented at scale, but we need more end users demanding standardization around PDKs and testing from the industry to push us to that next level of maturity and drive broader adoption.
At VPIphotonics, we’re helping solve these challenges by offering simulation tools that allow you to model and simulate photonic integrated circuits (PICs) within a full optical transmission system together in a single interface. You can then extend that solution to simulate the entire electrical-optical-electrical (EOE) link using our joint solution with Keysight Technologies ADS, enabling electrical-optical co-design and full end-to-end link validation.
Check out a short demo of our EOE solution here: https://lnkd.in/ePBw9aiy
Thanks to the Optica team, Jose Pozo, Olga Raz, Jon Pugh and Melissa Kallos with the Advanced Photonics Coalition for putting on such an exciting and informative event.