American Semiconductor

Taking outdoor reliability, indoors. Our recent efforts on developing continuous mechanical motions in extreme conditions are now complete & commercially available. The below chart shows the extended operating ranges and conditions, so we can integrate them into existing legacy or multi-climate chambers; for medical wearables, mobility, military and other flexible, additive electronics applications. Our sincere thanks to FlexTech, a SEMI Strategic Association Partner (with American Semiconductor) and NextFlex (with Auburn University) #printedelectronics #autotestnovi #etextiles. Further details at Bayflex Solutions, LLC site from next week.

Bayflex Flexdata lab automation & analytics v2.1 dropped today; - Extreme Hostile Environment support (mechatronics, sensors, data) - Hi-resolution, multi-camera capture & cloud storage (Dinolite & Logitech) - Test status Alerts via email - Multi-channel resistance synchronization on single Keithley/ASI custom meter - Enhanced Korean/Japanese language support We thank FlexTech, a SEMI Strategic Association Partner, American Semiconductor, NextFlex, Auburn University for their continued support. Details will be updated daily over at Bayflex Solutions, LLC all this week. #printedelectronics #printeddisplays #medicalwearables #autotestdetroit

Join American Semiconductor at SEMI-FLEX today.

Going Extreme & AI. In celebration of NextFlex #innovationdays2024 "more and further directive" we are previewing two new product categories. To meet the challenges of thermo-mechanical testing in extreme hostile environments (i.e. minus 40'c/f operating conditions), we have a new "eXtreme series" of tools for easy integration in existing chambers. Bayflex Solutions, LLC took the original mechanical soul of the award winning YUASA SYSTEM CO., LTD. interchangeable mechanical jigs, with 70% new parts for a range of tension-free torsion, compression, folding, elongation and simple bending tools. (FS-NX, FT-X, P150-X) You can still go to Alaska but only if you have to. Our sincere thanks to FlexTech, a SEMI Strategic Association Partner & NextFlex in association with American Semiconductor and Auburn University for their continued support. We previewed the latest version of flexdata, a lab automation & analytics firmware - more instruments, more meters, more imaging systems, more predictive operations and data visualization compatible. Happy to do more. Even the greats in Silicon Valley call us for domain expertise, no software programming and deep analytics capabilities. More over at our Bayflex Solutions, LLC channel. We presented a potential workforce development component to our flexdata platform. Project Bobbi - is for lab technicians where you might have forgotten how to test a certain sample (when your colleague is away, or training someone new) - by accessing secure documents and videos which you control, Bobbi will not only prompt you, but show you from our expanding library of assessment algorithms which one to choose (or edit) and off you go. Project Leonardo is all about visual anomoly detection. We'll be happy to collaborate with any SEMI/Nextflex partners to develop these productivity enhancements further. Finally a rare sighting of our Flexdata architect in the wild. "If you want to go far, go together." We're grateful to you all. #printedelectronics #additivemanufacturing #cmse @testingnovi @testingeurope

American Semiconductor will be at IMAPS Medical Workshop 2024 - IMAPS will host an Advanced Technical Workshop in Fountain Hills, Arizona on Advanced Packaging for Medical Microelectronics on March 21-22, 2024. Come join American Semiconductor at IMAPS as technologists in semiconductor packaging join with life science experts interested in applying advanced packaging and assembly methods to enable the next generation of medical microelectronic devices.  Doug Hackler will present “Advanced Assembly Enabling Next Generation Medical Devices” on Friday, March 22, at 9:30 a.m.

American Semiconductor is attending IMAPS DPC 2024 - Doug Hackler will present “P-WLCSP Advanced Packaging Enabling Next Generation Medical Device Applications” at IMAPs DPC 2024 in Fountain Hills, AZ at 10:00 Thursday, March 21. His presentation is part of the Next Gen Applications Track: Packaging for Evolving Markets and Needs. This presentation will include examples of new medical devices being enabled by ultra-thin SoP-TM packaged ICs including ocular, embedded, implants, and labeling. Reliability and thermal testing are key areas of investigation reported for the new P-WLCSP technology. The presentation will also include an update for ultra-thin device reliability test methods under consideration for new SEMI standards.

American Semiconductor is attending IMAPS DPC 2024 - Doug Hackler will present “P-WLCSP Advanced Packaging Enabling Next Generation Medical Device Applications” at IMAPs DPC 2024 in Fountain Hills, AZ at 10:00 Thursday, March 21. His presentation is part of the Next Gen Applications Track: Packaging for Evolving Markets and Needs. This presentation will include examples of new medical devices being enabled by ultra-thin SoP-TM packaged ICs including ocular, embedded, implants, and labeling. Reliability and thermal testing are key areas of investigation reported for the new P-WLCSP technology. The presentation will also include an update for ultra-thin device reliability test methods under consideration for new SEMI standards.