American Semiconductor is the industry leader in physically flexible ICs and Flexible Hybrid Electronics. Our Silicon-on-Polymer™ process transforms standard silicon wafers into physically flexible FleX-ICs™. Flexible Hybrid Electronics are created by combining FleX-ICs with printed electronics and other additive manufacturing techniques. American Semiconductor is your complete services provider for flexible ICs, from concept to fabrication. Whether you have just sketched your concept on the back of a napkin or have a product to replicate, American Semiconductor goes beyond typical manufacturers to ensure your product needs are met. American Semiconductor offers a complete suite of engineering and manufacturing services that enable you to realize your product. We support all aspects of IC design, FleX Silicon-on-Polymer flexible wafer processing, and Flexible Hybrid Systems design & manufacturing. IC & ASIC services include design, verification, layout, foundry selection, foundry management, and test. Engineering support for flexible hybrid systems includes printed electronics design and fabrication, antenna design and fabrication, FleX integration, prototype development, and production.
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6987 W. Targee St
Boise, ID 83709, US
Join American Semiconductor at SEMI-FLEX today.
I'm excited to speak at #SEMI_FLEX today on Dynamic Harsh Environmental FHE Reliability Testing (DHERT) at 1:30, Moscone South, Level 3, Room 301. Discover new startups and innovation, and networking at both #SEMI_FLEX and #SEMICONWest! https://lnkd.in/g42h93aH
American Semiconductor reposted this
Going Extreme & AI. In celebration of NextFlex #innovationdays2024 "more and further directive" we are previewing two new product categories. To meet the challenges of thermo-mechanical testing in extreme hostile environments (i.e. minus 40'c/f operating conditions), we have a new "eXtreme series" of tools for easy integration in existing chambers. Bayflex Solutions, LLC took the original mechanical soul of the award winning YUASA SYSTEM CO., LTD. interchangeable mechanical jigs, with 70% new parts for a range of tension-free torsion, compression, folding, elongation and simple bending tools. (FS-NX, FT-X, P150-X) You can still go to Alaska but only if you have to. Our sincere thanks to FlexTech, a SEMI Strategic Association Partner & NextFlex in association with American Semiconductor and Auburn University for their continued support. We previewed the latest version of flexdata, a lab automation & analytics firmware - more instruments, more meters, more imaging systems, more predictive operations and data visualization compatible. Happy to do more. Even the greats in Silicon Valley call us for domain expertise, no software programming and deep analytics capabilities. More over at our Bayflex Solutions, LLC channel. We presented a potential workforce development component to our flexdata platform. Project Bobbi - is for lab technicians where you might have forgotten how to test a certain sample (when your colleague is away, or training someone new) - by accessing secure documents and videos which you control, Bobbi will not only prompt you, but show you from our expanding library of assessment algorithms which one to choose (or edit) and off you go. Project Leonardo is all about visual anomoly detection. We'll be happy to collaborate with any SEMI/Nextflex partners to develop these productivity enhancements further. Finally a rare sighting of our Flexdata architect in the wild. "If you want to go far, go together." We're grateful to you all. #printedelectronics #additivemanufacturing #cmse @testingnovi @testingeurope
American Semiconductor will be at IMAPS Medical Workshop 2024 - IMAPS will host an Advanced Technical Workshop in Fountain Hills, Arizona on Advanced Packaging for Medical Microelectronics on March 21-22, 2024. Come join American Semiconductor at IMAPS as technologists in semiconductor packaging join with life science experts interested in applying advanced packaging and assembly methods to enable the next generation of medical microelectronic devices. Doug Hackler will present “Advanced Assembly Enabling Next Generation Medical Devices” on Friday, March 22, at 9:30 a.m.
American Semiconductor reposted this
American Semiconductor is attending IMAPS DPC 2024 - Doug Hackler will present “P-WLCSP Advanced Packaging Enabling Next Generation Medical Device Applications” at IMAPs DPC 2024 in Fountain Hills, AZ at 10:00 Thursday, March 21. His presentation is part of the Next Gen Applications Track: Packaging for Evolving Markets and Needs. This presentation will include examples of new medical devices being enabled by ultra-thin SoP-TM packaged ICs including ocular, embedded, implants, and labeling. Reliability and thermal testing are key areas of investigation reported for the new P-WLCSP technology. The presentation will also include an update for ultra-thin device reliability test methods under consideration for new SEMI standards.
American Semiconductor is attending IMAPS DPC 2024 - Doug Hackler will present “P-WLCSP Advanced Packaging Enabling Next Generation Medical Device Applications” at IMAPs DPC 2024 in Fountain Hills, AZ at 10:00 Thursday, March 21. His presentation is part of the Next Gen Applications Track: Packaging for Evolving Markets and Needs. This presentation will include examples of new medical devices being enabled by ultra-thin SoP-TM packaged ICs including ocular, embedded, implants, and labeling. Reliability and thermal testing are key areas of investigation reported for the new P-WLCSP technology. The presentation will also include an update for ultra-thin device reliability test methods under consideration for new SEMI standards.
American Semiconductor reposted this
This could be big. Setting up for IMAPS 2023 in San Diego. With more sensors, haptics and printed electronics in medical, automobile and military applications, the need for commercial grade reliability tools is clear. It's so wonderful being back in San Diego with our friends American Semiconductor to showcase our total reliability systems for microelectronics at Town & Country San Diego for our last scheduled event in North America this year. Come see us if you can at Booth#109. #nextflex #printedelectronics #imaps2023 #bayflexsolutions
Doug Hackler, American Semiconductor, will present “P-WLCSP Fully Protected Fan In Reliability” at IMAPS 2023 in San Diego. The P-WLCSP process incorporates the best of DCA (simplicity) and FO (protection) while incorporating advanced manufacturing processes to lower cost and improve performance. Attend this session on Thursday, October 5 at 11 a.m., Town and Country Ballroom A.
American Semiconductor reposted this
Doug Hackler will be participating in the ASTN Workshop. An NSF Engines Development Award, ASTN leverages federal, regional, state, private and public institutions in its vision to develop a regional innovation ecosystem that advances use-inspired semiconductors, invents scalable nanofabrication manufacturing processes, innovates in energy-efficient, memory-centric computing architectures, increases functionality via More than Moore, develops innovative computation tools, expands innovation, entrepreneurship and creates training programs to enable a diverse workforce. Led by Oregon State University, Oregon Business Council, City of Hillsboro, Boise State University, and the University of Washington, ASTN includes partners, including American Semiconductor, from Oregon, Idaho and Washington. More information can be found at: https://lnkd.in/gNxPa29E
Doug Hackler will be participating in the ASTN Workshop. An NSF Engines Development Award, ASTN leverages federal, regional, state, private and public institutions in its vision to develop a regional innovation ecosystem that advances use-inspired semiconductors, invents scalable nanofabrication manufacturing processes, innovates in energy-efficient, memory-centric computing architectures, increases functionality via More than Moore, develops innovative computation tools, expands innovation, entrepreneurship and creates training programs to enable a diverse workforce. Led by Oregon State University, Oregon Business Council, City of Hillsboro, Boise State University, and the University of Washington, ASTN includes partners, including American Semiconductor, from Oregon, Idaho and Washington. More information can be found at: https://lnkd.in/gNxPa29E