Deca Technologies

What makes Phoenix and Arizona such a hotbed for innovation for semiconductors and advanced packaging? Was it an overnight success? Our panel "CHIPS Act and the Arizona Innovation Economy" gave us a history lesson on where this ecosystem all started! Thank you to Chris Bailey, ASU Professor, Jason Conrad, COO of AZ SWAP Hub, Sean Fogarty, VP of International Business Development Greater Phoenix Economic Council, Scott Hayes, Technical Director at NXP Semiconductors, Tim Olson, CEO / Founder of DECA, and Curtis Zwenger, Treasurer, IMAPS/ VP, Engineering and Technical Marketing, Amkor Technology, Inc. I learned a lot about the history microelectronics in the Valley that dates almost 40 years ago. The future looks bright for Arizona, led by Arizona State University as the technology incubator and growing producer of technical graduates. Sandra Watson Arizona Commerce Authority Reference: https://lnkd.in/g5jMXZd3

Exciting discussions today at the Packaging Chips with CHIPS: West Coast Summit, where our founder & CEO, Tim Olson, participated in a panel on the CHIPS Act and the Arizona Innovation Economy. Alongside experts from ASU, NXP Semiconductors, Amkor, the Greater Phoenix Economic Council, and the Southwest Advanced Prototyping Hub, Tim shared insights on why Arizona is playing a growing role in the semiconductor industry. We’re excited to contribute to this dynamic ecosystem of innovation. #Semiconductors #ArizonaInnovation #AdvancedPackaging #ThinkDeca

We always have a great experience at iMAPS events, and this year's Symposium in Boston was no different! Throughout the week, we engaged in many meaningful conversations with both new and familiar faces. Craig Bishop, shared valuable insights on the future of RDL technology during the panel on RDL Packaging for High Performance Applications and Tim Olson, contributed to the discussion on Onshoring High Density Interposers and Fan-Out WLP/PLPs. We were also thrilled by the strong turnout for the DEI networking session chaired by Robin Davis, fostering a greater sense of inclusivity and belonging within our industry. Thank you to everyone who made this event a success! #IMAPS2024 #RDL #AdvancedPackaging #DEI #thinkdeca #shifthappens

🌟 We're on the Cover of ChipScale Review! 🌟 We are proud to announce that Deca Technologies has been featured in the latest issue of Chip Scale Review, with a cover articled authored by our very own Robin Davis and Tim Olson! The article, titled "RDL Technology: The Catalyst for Future Semiconductor Innovation," dives into how redistribution layer (RDL) technology is driving advancements in semiconductor packaging. 📖 Read the full article here: https://lnkd.in/gXFwXMJu #semiconductors #advancedpackaging #FanOut #HPC #AI #RDLTechnology #DecaTechnologies #ChipScaleReview #innovation

We are incredibly proud of Gaurang Gunde for winning the Best Presentation Award in the Advanced Multi-Die Packaging track at #CadenceLIVE! His insightful presentation on “Delivering the Full Benefits of Maskless Lithography and Adaptive Patterning with Comprehensive Design Automation” has been recognized for its excellence. Congratulations, Gaurang! 🌟 #DecaTechnologies #ThinkDeca #ShiftHappens #AdaptivePatterning

We're thrilled to be partnered with Arizona State University in pioneering North America’s first fan-out wafer-level packaging research and development center. Together, we're driving innovation in the semiconductor industry and shaping the future of semiconductor technology. Don't miss out - learn more about how we're leading the way here: https://lnkd.in/gfFy8N-Q

Exciting news! SkyWater Technology Foundry secured a $120M Department of Defense award to support their implementation of Deca’s advanced packaging technologies in Osceola County, Florida. This initiative aims to reshore semiconductor supply chains, fostering innovation and strengthening US technology. “We’re excited to collaborate with SkyWater on this groundbreaking opportunity to establish an industry leading domestic advanced packaging foundry supporting a secure U.S. microelectronics ecosystem as well as providing commercial customers with a compelling new supply chain option.” - Tim Olson Learn more: https://lnkd.in/gt3ET998. #Semiconductors #AdvancedPackaging #AdaptivePatterning #ShiftHappens

What a great time with International Microelectronics Assembly and Packaging Society Arizona Chapter members! A fantastic presentation on high-density die-to-die integration by DECA'S very own Clifford Sandstrom Sandstrom followed by great food and conversations. Proud to support such a worthwhile organization.