Onto Innovation

We're #hiring a new Senior Hardware Systems Engineer in Wilmington, Massachusetts. Apply today or share this post with your network.

We're #hiring a new Sales, Inventory and Operation Planning Sr Manager in Milpitas, California. Apply today or share this post with your network.

Exciting times are ahead for India’s rapidly growing semiconductor industry, with headlines announcing new initiatives and investments signaling a watershed moment for the country. Next week brings SEMI’s inaugural SEMICON India in New Delhi, and the Onto Innovation team will be there to meet new customers and build new relationships. Onto invites attendees to Booth H1U11 to discuss their challenges and goals, while learning about the Company’s portfolio of integrated process and process control solutions. For more information about Onto, please visit: www.ontoinnovation.com or reach out to our sales team.

We're #hiring a new Contract Electro-Mechanical Technician in Bloomington, Minnesota. Apply today or share this post with your network.

Looking forward to another great event and catching up with leaders in the Power Semiconductor space!

Exciting Speaker Announcement! We are thrilled to announce that Jiangtao Hu, Sr. Director of Product Marketing at Onto Innovation, will be speaking at I.S.E.S. USA Power 2024! With his extensive experience in product marketing and process control technologies, Jiangtao will provide invaluable insights into the industry's latest advancements and challenges. About Jiangtao Hu: Jiangtao Hu is the Sr. Director of Product Marketing at Onto Innovation, responsible for Metrology. Prior to this, he worked at Lam Research, leading product marketing teams in advanced process and equipment controls. Jiangtao started his career at Nanometrics in 2001, received his Ph.D. in Chemistry from Harvard University in 1999, and his bachelor’s degree in Applied Physics from Tsinghua University in 1995. About Onto Innovation: Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include un-patterned wafer quality, 3D metrology spanning chip features from nanometer-scale transistors to large die interconnects, macro defect inspection of wafers and packages, elemental layer composition, overlay metrology, factory analytics, and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster, and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Don't miss this opportunity to hear from industry leaders like Jiangtao! Sign up to join us now at www.ises-power.com/us or contact our team at info@isesglobal.com for more information. #ISESUSAPower2024 

We're #hiring a new Embedded Software Developer, (Contractor) in Bloomington, Minnesota. Apply today or share this post with your network.

The Onto Innovation team is at the 2024 Korea Electronics Packaging and Circuits Association (KPCA) show in Incheon, Korea. Stop by Booth L401 to learn about the many unique and powerful process control technologies Onto offers the semiconductor market. For more on Onto Innovation, please visit: https://lnkd.in/eWuWEgq8.

Greetings from SEMICON Taiwan: Onto Innovation invites attendees to Booth #N0270 to learn about the Company’s portfolio of integrated process and process control solutions being used to support our customers’ ramp of AI products. For more information about Onto, please visit: www.ontoinnovation.com or reach out to our sales team.

Onto Innovation has announced the grand opening of the company’s Packaging Applications Center of Excellence (PACE). Located at the company’s Wilmington, Massachusetts headquarters, PACE is a first-of-its-kind facility in the U.S. dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages. Collaborating partners represent key process steps across the supply chain, ranging from panel package and IC substrate manufacturers to process equipment and material suppliers, and include: • ASMPT Ltd • Corning Incorporated • Evatec AG • Lam Research • LPKF Laser & Electronics SE • MKS Instruments • Resonac • Taiyo Ink Mfg. Co., Ltd. • And multiple others At PACE, Onto and its collaborators will use their expert knowledge of lithography, plating, thin film deposition, laser processes for through glass via (TGV) formation, and new material developments in photoresist, dielectric and plating chemistry to work toward sub-1.5µm line/space panel interconnects. In addition, PACE participants will explore novel organic damascene process innovations for maintaining proper interconnect line widths, a critical requirement as the line/space feature size shrinks, in an effort to replace the conventional semi-additive process for advanced IC substrates. “With the need for finer, denser interconnects and larger package sizes to support new AI and chiplet architectures, customers and collaborators need to accelerate their technology roadmaps and shorten the time to market,” says Michael Plisinski, chief executive officer of Onto Innovation. “Together, we will develop new panel-level packaging solutions in support of glass core substrates and the rapidly evolving AI landscape.” If your company is interested in becoming a collaborating partner or attending the grand opening event on September 30, 2024, at Onto’s headquarters, please contact us or reach out to your local sales team. To learn more about PACE, please visit: https://lnkd.in/gJ6QbX7W. For more about Onto Innovation, please visit: www.ontoinnovation.com.