Texas Institute for Electronics

3D Glass Solutions is very pleased to be part of the Texas Institute of Electronics' team to build a DOD microelectronics manufacturing center to advance the domestic supply chain for semiconductors and electronic packaging for 3DHI. This facility will bring advanced packaging to the forefront of systems integration and we are happy that glass is playing a crucial role! https://lnkd.in/gzpZMcSt

 I am excited to announce that Defense Advanced Research Projects Agency (DARPA) has selected the Texas Institute for Electronics at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the United States Department of Defense. The $840M award is among the most significant ever to UT or UT System institutions. TIE will establish a national, open access R&D and prototyping fabrication that will enable DOD to create higher performance, lower power, light weight and compact defense systems such as radar, satellite imaging and unmanned aerial vehicles. The old Wayne Gretzky quote is “skate to where the puck is going,” and we worked with the state of Texas to do just that and to compete, and it paid off. We have a significant opportunity to not only give our military a competitive edge, but also create jobs, attract businesses, grow Austin’s innovation ecosystem and cement Texas as a leader in microsystems innovation. I am grateful to U.S. Sen. John Cornyn, to DARPA for recognizing our talent and facilities as a worthy investment and for Prof. S.V. Sreenivasan , one of the world’s leading experts in semiconductors, for his vision and leadership and constructing a team that will achieve great things. My sincere thanks to our Texas Delegation, especially U.S. Sen. John Cornyn, a great example of our delegation working together. Learn more about how this new center will build upon the strengths of UT and Cockrell School of Engineering, The University of Texas at Austin, plus the investments made by the great state of Texas: https://utex.as/3y4u2gg

 I am excited to announce that Defense Advanced Research Projects Agency (DARPA) has selected the Texas Institute for Electronics at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the United States Department of Defense. The $840M award is among the most significant ever to UT or UT System institutions. TIE will establish a national, open access R&D and prototyping fabrication that will enable DOD to create higher performance, lower power, light weight and compact defense systems such as radar, satellite imaging and unmanned aerial vehicles. The old Wayne Gretzky quote is “skate to where the puck is going,” and we worked with the state of Texas to do just that and to compete, and it paid off. We have a significant opportunity to not only give our military a competitive edge, but also create jobs, attract businesses, grow Austin’s innovation ecosystem and cement Texas as a leader in microsystems innovation. I am grateful to U.S. Sen. John Cornyn, to DARPA for recognizing our talent and facilities as a worthy investment and for Prof. S.V. Sreenivasan , one of the world’s leading experts in semiconductors, for his vision and leadership and constructing a team that will achieve great things. My sincere thanks to our Texas Delegation, especially U.S. Sen. John Cornyn, a great example of our delegation working together. Learn more about how this new center will build upon the strengths of UT and Cockrell School of Engineering, The University of Texas at Austin, plus the investments made by the great state of Texas: https://utex.as/3y4u2gg

 I am excited to announce that Defense Advanced Research Projects Agency (DARPA) has selected the Texas Institute for Electronics at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the United States Department of Defense. The $840M award is among the most significant ever to UT or UT System institutions. TIE will establish a national, open access R&D and prototyping fabrication that will enable DOD to create higher performance, lower power, light weight and compact defense systems such as radar, satellite imaging and unmanned aerial vehicles. The old Wayne Gretzky quote is “skate to where the puck is going,” and we worked with the state of Texas to do just that and to compete, and it paid off. We have a significant opportunity to not only give our military a competitive edge, but also create jobs, attract businesses, grow Austin’s innovation ecosystem and cement Texas as a leader in microsystems innovation. I am grateful to U.S. Sen. John Cornyn, to DARPA for recognizing our talent and facilities as a worthy investment and for Prof. S.V. Sreenivasan , one of the world’s leading experts in semiconductors, for his vision and leadership and constructing a team that will achieve great things. My sincere thanks to our Texas Delegation, especially U.S. Sen. John Cornyn, a great example of our delegation working together. Learn more about how this new center will build upon the strengths of UT and Cockrell School of Engineering, The University of Texas at Austin, plus the investments made by the great state of Texas: https://utex.as/3y4u2gg