Betsie Carrow’s Post

#HenkelElectronics Pushing the boundaries of Moore’s Law, fan-out wafer-level packaging (#FOWLP) overcomes the connection limitations of traditional technologies to enable the rise of more complex, miniaturized, high-density interconnect semiconductor devices. This #advancedpackaging technique relies on sophisticated molding compounds to embed the die, provide handling stability, and deliver multi-side die protection. Liquid compression molding (#LCM) materials are key to miniaturization, reliability, and performance. In other words, the #molding matters! LCM material fine-line filling, faster processing, and reduced warpage capabilities are difference-makers for next-gen wafer-level integration. Discover why ➡️ http://ms.spr.ly/6044l5Hcy

Fixed axis semiconductor processing, 2mm wall thickness molding, deformation control at 0.048, qualified delivery #cncmilling #cnclathed #cncturning #cncrapidprototype #injectiomolding

🔬🏭 Are you in the semiconductor industry? Do you prioritize cleanroom standards, chemical resistance, weldability, antistatic properties (EDS), or flame retardancy (FM4910, UL94)? When manufacturing highly sensitive IC chips, two aspects are critically important: First, the applications & devices must meet the highest requirements and second, the production processes must precisely fit to the sensitive manufacturing process. 👉🏻 We support you with a wide range of thermoplastic materials that are precisely tailored to the requirements of your applications. #roechling #roechlingindustrial #pioneeringtoether #highperformancesupplier #empoweringindustry #semiconductor #semiconductorindustry

Here’s a summary of my discovery from Sam Zeelof’s YouTube video on semiconductor fabrication To establish a low-cost semiconductor fabrication setup, begin by creating a cleanroom environment and acquiring necessary chemicals and materials. Utilize photolithography to pattern silicon wafers, followed by etching, doping, and deposition processes. Anneal the wafers for improved crystal quality, then test and package the fabricated chips. Implement quality control measures throughout the process. This undertaking requires expertise, resources, and adherence to safety protocols. #100daysAmpDesign #Day4

🔬 In the semiconductor industry, particles, scratching, ion contamination and static will cause damage in delicate electronic parts. Vacuum manipulation poses additional challenges. That's why wafer packaging solution providers and IC design companies are turning to DuPont™ Tyvek® for improved packaging solutions. Here’s why Tyvek® material is the superior choice: ✅ Tear resistance ensures secure protection between wafers. ✅ Low linting and smooth surfaces prevent particles and scratching. ✅ Anti-static treatment minimizes ESD (Electrostatic Discharge). Elevate your wafer packaging with Tyvek® and experience unparalleled protection! More about DuPont™ Tyvek® for industrial packaging:https://lnkd.in/gY5xdRX5 #Tyvek #Semiconductor #WaferSpacer #ElectronicsProtection #protectivepackaging #protectivematerial

Graco Posi-Ratio® (PR) technology has extreme variability (-Xv) for micro dispense, especially in #electronics #industrial #assembly. The PR-Xv brings +/- 1 percent shot repeatability to two component (2K) adhesives and sealants. No new hardware is needed to adapt to bonding, potting, sealing, gasketing and thermal management applications.

🟡 End effector pads 🟡 ⬆️ Maximize the efficiency of your semiconductor processes using our end effector pads. 🛡️ They provide a secure grip, preventing wafer slippage during critical operations. 🛠️ Easy to install and available in a multitude of shapes, sizes, and materials, these pads are designed to match your specific needs. Contact us to discover how our custom solutions can optimize your semiconductor manufacturing! #EndEffector #Pads #Semiconductor #Efficiency #SemiconductorIndustry

As semiconductor fabrication processes get ever more precise and more demanding, we heard your needs: More yield from your wafers. Longer lifetimes for your pad conditioners. Lower metal contamination for advanced nodes. Precisely controlled co-planarity and flatness. Explore the latest 3M solutions. #cmp #3Mer https://dy.si/jrEGmP

As semiconductor fabrication processes get ever more precise and more demanding, we heard your needs: More yield from your wafers. Longer lifetimes for your pad conditioners. Lower metal contamination for advanced nodes. Precisely controlled co-planarity and flatness. Explore the latest 3M solutions. #cmp #3Mer https://dy.si/hoWL6

Cost: how does Ultra HDI compare to subtractive etch? UHDI has the potential to lower your overall cost. A key benefit of our unique fabrication technology: reduced layer count and lamination cycles. Improved circuit density and better yield also contribute to lower overall cost. #hdi #pcbdesign #pcbfabrication #lamination #electronicsengineering