Henkel Adhesive Technologies’ Post

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#HenkelElectronics Pushing the boundaries of Moore’s Law, fan-out wafer-level packaging (#FOWLP) overcomes the connection limitations of traditional technologies to enable the rise of more complex, miniaturized, high-density interconnect semiconductor devices. This #advancedpackaging technique relies on sophisticated molding compounds to embed the die, provide handling stability, and deliver multi-side die protection. Liquid compression molding (#LCM) materials are key to miniaturization, reliability, and performance. In other words, the #molding matters! LCM material fine-line filling, faster processing, and reduced warpage capabilities are difference-makers for next-gen wafer-level integration. Discover why ➡️ http://ms.spr.ly/6044l5Hcy

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