Electronic Product Design & Test [EPDT]’s Post

Electronica 2024: Automotive-Grade SoCs Renesas Electronics is introducing a series of next-generation system-on-chip (SoC) devices at the show. These will be aimed at use in vehicle infotainment, cockpit and advanced driver assistance system (ADAS) applications. Employing the latest process technology innovations, the new SoCs will provide single-chip cross-domain solutions with chiplet extensions available for added performance. They’ll deliver superior TOPS/W efficiency and reliability, alongside assured safety. Compatible with the company’s previous-generation devices, customers can re-use the same software and tools, thereby maximising prior engineering investments. Renesas B4.179 www.renesas.com Akiko Ishiyama Ture Nielsen Tetiana F. Don Parkman Jean Lasseuguette Alexandra Janetzko Makie U. Kyoko Okamoto Miguel Mendoza Edel Griffith Graeme Clark Ro Chawla Nathan John Josh Broline

Axiom Looks to Continue Growth Trajectory Newbridge-based contract manufacturer Axiom Manufacturing Services expects to see double-digit growth when its 2024 revenue figures are compiled. This follows on from a year of ongoing investment, alongside a series of lucrative new customer gains. The company has made a £1.8 million financial outlay on the latest surface mount technology (SMT) - in order to augment its high-mix printed circuit board assembly (PCBA) and box build production capabilities. Also, a major strengthening of the company’s customer facing teams has helped to accelerate turnaround times, etc. Commenting on the Axiom’s ongoing commercial progression, Managing Director Chris Nye states; “Axiom's achievements during this period are... READ MORE https://lnkd.in/eCF6Zi_a Jason Arnold Jacob Morrissey Olivia Jones Zac Lenton-Johnson Ieuan Webber William Hawkins-Smith Rob Taylor Gareth Beckett Brendon MacCarthy Leanne Powell Matthew Parr Darren Hegarty

Rethinking Soft Switching for Enhanced Power Efficiency By Mike Zhu - Applications Engineer, Qorvo, Inc. The quest for higher efficiency and density levels in power conversion is critical and unceasing. Each element contributing to energy loss will, by definition, become a heat source - necessitating expensive, energy-intensive cooling systems. The push for higher power supply density requires minimising the size and quantity of passive components used for energy storage and smoothing the output of switched-mode converters. This, in turn, drives the need for higher switching frequencies. However, all that complicates heat dissipation in denser systems and amplifies demands in relation to efficiency. Silicon technology has historically seen an increase in switching frequencies, enhancing efficiency and density. This progress was partly due to the shift towards soft switching, moving away from simpler hard switching power converter designs. Soft switching lowers the losses during power transistor turn-on and turn-off by optimising the timing of voltage and current swings. Hard switching, on the other hand, is where drain-to-source voltage and current change concurrently - leading to significant losses as switching frequencies rise. Zero-voltage switching (ZVS) is the most common soft switching... READ MORE https://lnkd.in/enMzUgvT Cindy Warschauer Paul von Wupperfeld Brandi Frye Luc Darmon Brent Dietz Chitra Mysore Scott Lewis (He/Him) Maggie Lefor Andy Wilson Frank Urbe

The Shift-Left Paradigm By Chetan Arvind Patil - Contributing Writer, EPDT The semiconductor industry has historically grappled with high costs and delays, often caused by defects which have been detected late in production cycles. Studies have shown that defect resolution costs increase by up to 100x when identified in later stages compared to early detection during design. At the same time, the traditional approach to testing, which emphasises validation towards the end of development, frequently results in expensive and time-consuming rework. Consider a ground-breaking approach that could transform the semiconductor industry - slashing costs, speeding up time-to-market and nurturing a more collaborative and efficient … READ MORE https://lnkd.in/e8iUgnJG

Live from EDS: Level Sensing Technology During the event in Coventry, Matt Cook, Product Group Manager at Solsta, showed EPDT's Mike Green examples of the various potential sensing methods that can be used to determine liquid levels, depending on accuracy, cost and robustness requirements. See the full video here: https://lnkd.in/eHc6X5Pc Solsta - formerly Solid State Supplies Ltd Wendy Vinson John Macmichael Jon Baxter Fay Wild Danica Williams Pete Greenslade John Fitzpatrick Geoff North Derek Stewart Ryan McIlravey Chris Bowers Tom Freeman

During the Engineering Design Show (EDS) yesterday, EPDT's Mike Green got to speak with Steven Edwards, Switching Product Manager at Pickering Interfaces, about the new simulation capabilities of the company's microwave switching development platform. See the full video here: https://lnkd.in/gqztGTXC Keith Moore Daniela Rudolph Kimberly O. Nick Hickford Sue Baker Steve Baker Mark Gradwell Nick Foot

Electronica 2024: Discover New Enclosure Possibilities Respected enclosures manufacturer OKW Odenwälder Kunststoffwerke Gehäusesysteme GmbH will be showcasing its 2024 models at electronicaFair - including the robust SOLID-BOX units. Available in IP66, IP67 and IK08 rated versions, these safeguard wall/pole-mount and table-top electronics in challenging industrial environments. Also on the company’s stand will be SMART-PANEL units for intelligent building control systems. Their elegant screw-less housings fit standard flush-mount/cavity wall boxes. There’s the MINI-DATA-BOX fast-fit IoT/IIoT sensor enclosures too, which are available with/without flanges that enable them to be cable-tied or screwed into place quickly and easily. OKW B3.163 www.okw.co.uk Robert Cox Robert Osborne OKW Enclosures, Inc. OKW Enclosures, Inc. Darren Shepherd Sean Bailey Christoph Volker Schneider, Dipl.-Ing. Kerstin Riedling Patricia Hart

EPDT’s latest video interview.

Another High-Profile Appointment at Sondrel Custom IC solutions provider Sondrel has made Mat Rowe FAPM its new Head of Projects. Having graduated from the University of Southampton, Rowe has extensive industry experience - with roles at NASA, the European Space Agency (ESA), AllSpace, Oxford Space Systems, Spire Global, the Atomic Energy Authority (AEA) and AWE.    “Mat brings an impressive wealth of experience in delivering technically complex systems, especially within the nuclear and space sectors. With a proven track record in managing multidisciplinary engineering projects, operations and commercial management, Mat will be instrumental in driving our projects forward and helping us achieve our strategic goals,” John Chubb, CEO of Sondrel, states. “There can be few more challenging areas to project manage than satellites except perhaps for atomic energy and he has spent nearly 40 years doing both.” “I am delighted to be part of the new leadership team that.. READ MORE https://lnkd.in/egHK66x7 Nigel Robson Sean Moynagh Graham Curren Ian Walsh Hilary Rico Pete Davy Oliver Jones Paul Martin

EPDT's Editor Mike Green was at the European edition of AutoSens yesterday - which was held in Barcelona. Among the various people he got to talk to while there were Paul Wu (Head of Product Management at OMNIVISION), Udit Budhia (indie Semiconductor's Senior Director of Product Marketing) and Yaniv Sulkes (VP for Automotive at Hailo). Check out the video material here: https://lnkd.in/e5V8Vs2a Ellie Hardy Kim Gysemans Chet Babla Paul Hollingworth Sandy Fewkes Phillip Bendall Julie Connelly Andreas Lambauer Danya Golan Yosi Brosh