Henkel Adhesive Technologies’ Post

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#HenkelElectronics Are your power devices charging ahead or lagging behind? If it’s the latter, your die attach could be the reason. Come visit the Henkel team at #SEMICON Taiwan and learn more about our high thermal die attach materials – from traditional pastes to next-gen #sintering – and why die attach is the key to achieving lower loss and greater efficiency. Whether you are designing and building devices with Si, SiC or GaN substrates for #5G or #automotive, Henkel has a material solution for your power device. Engage with our technology expert and discover how Henkel innovation can help fuel your AI ambitions and beyond at Conference Room 403, Hall 1, Nangang Exhibition Center. Do make plans to attend our expert sessions on each day of the show. Click here to learn more and register ➡️ http://ms.spr.ly/6042l2C66

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Puwanat Udomwutthikorn

"CHANGE is always just one decision away"

2mo

Amazing

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