Inga S.’s Post

Let’s talk about your electronics supply chain ⚡️

I recently contributed to a paper of my colleagues Klaus Kainrath and Philipp Ortner with a chapter about V2X antenna placement / simulation. It is now available on IEEE Xplore: https://lnkd.in/dFpaWJy5

Interested to know more about the future of Failure Analysis? Please check out the EDFAS Technology Roadmap Session on October 29 at the #ISTFA2024 Conference. See you there!

Excited for European Test Symposium! We have Andrea Matteucci presenting our research With Luca Moriconi from ELES SEMICONDUCTOR EQUIPMENT on "In-chip Monitoring for Extended #Reliability #Testing and Mission Profile Monitoring Feedback Loop" and Nir Sever discussing our paper on #Chiplet Interconnect Testing using #InChip monitoring See you in The Hauge! IEEE #IEEE #ETS #EuropeanTestSymposium #ATE #Test #HeterogeneousIntegration #AdvancedPackaging

one more of our worked published. Here we study the thermal damage; also called splash, on integrated circuit due to laser leakage during the stealth dicing process. Making sure there is limited to no splash is critical in safeguarding the device electrical performance. The experimental studies are simulated using a thermally sensitive wafers. Micron Technology Nathaniel Simon George congratulations on the publication!!!

Today's action-packed newsletter (BAM! ZING!) spotlights #semiconductors, #MMICs, and #RFICs, starting off with our own John Oncea's look at ... well ... semiconductors, MMICs, and RFICs. Marki Microwave breaks down surface-mount packaging parasitic sources and solutions to combat these undesirable parasitics; Rohde & Schwarz explains why new semiconductor technologies and processes need to be commercialized to support technologies that are expanding into sub-THz frequencies in the D band and beyond; and Qorvo, Inc. lays out the advantages of the Qorvo SiC FET versus Sic MOSFETs. https://lnkd.in/errE6RNT

One of the most common questions we're getting at #NPE2024 is: "Can you help us modify melt flow?" The short answer: YES! Electron beam is revolutionizing how we manipulate melt flow in polymers. By precisely controlling the molecular structure, e-beam processing enhances material properties such as strength, durability, and processing stability. It's not just about improving products—it's about paving the way for new possibilities in manufacturing and beyond! If you're in Orlando, check us out at booth S29184 to learn more. (Or message us and we can set up a free chat to discuss your project!)

Exciting technology to make your design easier and quicker to market whilst significantly reducing BOM count. If you dont know Digi and would like to find out more why not sign up to this Webinar ?!

Happy to announce our newest paper, this one a review of nonlinear performance of semiconductor optical fibers, collaboratively written with Meng Huang and Anna Peacock from the ORC at the University of Southampton. What I particularly enjoy about these reviews is to see how far the technology has come since we pulled the first Si core fibers in 2007 (13 December 2007 to be exact!). As is typical, innovations start with materials and then process development, followed by early and usually simple device and application demonstrations. From there more sophisticated and diverse devices follow, which is where we are now, some 17 years later! Today, they rival and in some cases exceed the performance of on-chip analogs, but are in fiber form and compatible with telecom fibers. Enjoy! #silicon #semiconductor #fiberoptics #fibreoptics #glass #quantum #siliconphotonics #photonics #clemsonuniversity #light #nonlinear

Jenoptik is taking the next step towards automated PIC testing for high-volume manufacturing in the #semiconductor industry. How? We're enabling the integration of our opto-electronic UFO Probe® Card into an ATE system. Don't miss Christian Karras' presentation at #ITWS 2024: 📍 Munich, Germany 📅 September 16, 2024 🕕 6 p.m. CEST Be sure to discover more details on the new direct-probe PIC wafer-level test solution for fast wafer probing, such as: ✔ Application scenarios for integrating an opto-electronic probe card into an ATE system. ✔ Challenges of today's wafer sorting (drive to single instead of dual test insertion). ✔ Future standardization requirements for direct probe solutions (focus: high-volume PIC manufacturing). ITWS - European IS-Test Workshop is a technical conference with a focus on wafer probing, probe cards, and probing technologies to address challenges of the industry. We're looking forward to seeing you there! #MoreLight #photonics #innovation