JTEKT North America Corporation reposted this
Simultaneously grind both sides of silicon wafers to +/- 1 µ from as-sliced condition, with equal stock removal on both sides of the disc. Includes automatic in-process wheel positioning through high accuracy air gauging, while the use of pure water instead of coolant is environmentally friendly. This is your solution for more efficient #wafer grinding, from the world leaders in precision grinding technology. Read more in American Machinist magazine with this link: https://lnkd.in/gZNy-gDw
Director of Production Engineering, JTEKT North America
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