That's a wrap! #SensorsConverge 2024 was an incredible experience with 130+ speakers, 200+ exhibitors and sponsors, partners, and our wonderful attendees - making for an incredible platform for important discussion, collaboration, and innovation. Thanks to everyone who participated as we explored the future roadmap for sensing, processing and connectivity. Check out the photos here: https://lnkd.in/gr5Ffa7A Save the date for our 40th Anniversary on June 24-26, 2025 in Santa Clara! #sensors #electronics #design #engineering #processing #embedded #connectivity #siliconvalley
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Explore the potential of fiber optics across industries! Dive into Molex's on-demand webinar with expert Peter Kontros. Discover how fiber optics transcend telecoms, impacting medical tech, automotive, and aerospace. Don't miss out, watch now while it's still available: 👉 https://bit.ly/3PopUxr #technology #tech #electronics #sensing #sensingtechnology #engineering #fiberoptics #fiberoptic
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Highly sensitive electronic components are at the core of today’s technology. ⚙️✨ At Fraunhofer IPMS, we offer specialized development services to help our customers bring innovative products to life. 💡🤝 From design to final module, we support projects starting from just one unit. Our expertise in chip-package co-design and micro-assembly allows us to integrate MEMS, electronics, optics, and photonic components seamlessly. 🔗🔬 Possible applications are MEMS and MOEMS of any kind, optical devices like laser or photodiodes, sensor or bio applications and many more. Find out everything in our video. 📹 --- #FraunhoferIPMS #TechInnovation #DevelopmentServices #Fraunhofer #whatsnext
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Curious to learn more about how automated Double Pulse Testbenches can be used to generate more realistic simulation models? Christian Lottis will be presenting a joint project of Hochschule Bonn-Rhein-Sieg and Fraunhofer IEE. Join us and register today: https://lnkd.in/eR-QXX6K Designing power circuits and the selection of semiconductors for a particular application have become two of the main challenges for engineers. The data given by the manufacturers in the form of data sheets often doesn't fit the complete area of further application. Double Pulse Testing is one of the oldest and most established methods to characterize power semiconductors and to measure their losses. In this talk, we discuss the benefits of automated Double Pulse Testbenches and the automated extraction of application-related data for the purpose of generating more realistic simulation models. The methodology and an exemplary practical implementation enable precise loss estimations for the application-oriented simulation and design of power electronics. Illustration by Fraunhofer IEE #PLECS #plexim #powerelectronics #simulationsoftware #thermal #simulations #conference #conference2024 #semiconductors #infineon #onsemi #hitachienergy #nexperia #fraunhofer #microchip #vitescotechnologies #danfoss #semikron #bmw #hilti
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𝐎𝐯𝐞𝐫𝐜𝐨𝐦𝐢𝐧𝐠 𝐂𝐡𝐚𝐥𝐥𝐞𝐧𝐠𝐞𝐬 𝐢𝐧 𝐈𝐧𝐝𝐢𝐮𝐦 𝐁𝐮𝐦𝐩 𝐈𝐧𝐭𝐞𝐫𝐜𝐨𝐧𝐧𝐞𝐜𝐭 (𝐈𝐁𝐈) 𝐁𝐨𝐧𝐝𝐢𝐧𝐠 𝐟𝐨𝐫 𝐃𝐞𝐦𝐚𝐧𝐝𝐢𝐧𝐠 𝐇𝐲𝐛𝐫𝐢𝐝𝐢𝐳𝐚𝐭𝐢𝐨𝐧 𝐏𝐫𝐨𝐜𝐞𝐬𝐬𝐞𝐬 In the advancing fields of imaging, computing, and display technologies, the need for sophisticated components like IR thermal imaging sensors, quantum computing processors, and micro LED displays is surging. These elements are crucial for innovation in areas like R&D, military, industrial, and consumer electronics. Central to these developments is fine pitch micro Indium bump array interconnect bonding, a preferred method for its superior properties, vital for hybridization in creating advanced IR sensors and more. Yet, achieving high-performance, large-scale, and efficient devices faces notable challenges, especially with Indium bump bonding, affecting performance, manufacturing, and scalability. At Finetech, we're overcoming these obstacles. Our technical paper presents our research, insights, and innovative solutions for Indium Bump Interconnect (IBI) Flip Chip Bonding, aiming to advance the production of next-gen IR devices, quantum processors, and micro LEDs. Discover how our solutions can enhance your projects, adhering to and surpassing current industry standards. Join us in tackling the complexities of next-gen device production. Your feedback and inquiries are encouraged as we progress in this technological journey. Get our paper here: https://lnkd.in/enTmEyzK #IndiumBumpBonding #IRSensor #SensorManufacturing #QuantumProcessor #MicroLED #FlipChipBonding #Finetech #DieBonder #DieAttach
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There's some pretty exciting stuff happening!✨ A cool new method has been developed to link different types of #photonic #chips. They're using something called a 3D-nanoprinted interposer. 💡Now, you might be wondering,𝐰𝐡𝐚𝐭 𝐞𝐱𝐚𝐜𝐭𝐥𝐲 𝐚𝐫𝐞 𝐩𝐡𝐨𝐭𝐨𝐧𝐢𝐜 𝐜𝐡𝐢𝐩𝐬? 🚩Well, photonic chips are like regular computer chips, but instead of using electricity to process information, they use light, and 3D-nanoprinted interposer, it's like a small connector that helps these photonic chips communicate more effectively. If you want to learn more about this exciting innovation, check out the PDF file attached. 📂 https://lnkd.in/efeXm-wU or read here ▶https://lnkd.in/eP8NnCit And don't forget to follow our page Start With WCPGW for more updates on photonics and technology! #Photonics #Technology #Innovation #Chiplets #SemiconductorInsights #SemiconductorInsights #WCPGW #connection #startwithwcpgw #infosec #technology
Photonic Chiplet Interconnection via 3D-Nanoprinted Interposer
chiplet-marketplace.com
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Unveil the unseen world of silicon wafer applications! From microwaves to satellites, these wafers are the unsung heroes of modern electronics. Curious to learn more? Dive into the science behind them and their versatile applications. #waferworld #transistors #technology #tool #innovation #tech #wafers #semiconductors #germanium #siliconwafers #technologyapplications #engineers #engineering #digital #voltage
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The Amazing Power of Laser Cleaning on IC Chips In this video, we delve into the incredible world of laser cleaning and its impact on IC chips. Watch as we demonstrate the process and reveal how this cutting-edge technology effectively removes contaminants from delicate electronic components. Discover the science behind laser cleaning and witness the impressive results for yourself! #LaserCleaning #ICChips #Technology #Innovation #Electronics #CleanTech #TechTrends #Engineering
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Wake up. Check your entire process, not only qualitaty wise also quantitatively and above all, financially! #finetech #diebonding #submicronbonding #diebonder #dieattach #photonics #IndiumBumpBonding #IRSensor #SensorManufacturing
𝐎𝐯𝐞𝐫𝐜𝐨𝐦𝐢𝐧𝐠 𝐂𝐡𝐚𝐥𝐥𝐞𝐧𝐠𝐞𝐬 𝐢𝐧 𝐈𝐧𝐝𝐢𝐮𝐦 𝐁𝐮𝐦𝐩 𝐈𝐧𝐭𝐞𝐫𝐜𝐨𝐧𝐧𝐞𝐜𝐭 (𝐈𝐁𝐈) 𝐁𝐨𝐧𝐝𝐢𝐧𝐠 𝐟𝐨𝐫 𝐃𝐞𝐦𝐚𝐧𝐝𝐢𝐧𝐠 𝐇𝐲𝐛𝐫𝐢𝐝𝐢𝐳𝐚𝐭𝐢𝐨𝐧 𝐏𝐫𝐨𝐜𝐞𝐬𝐬𝐞𝐬 In the advancing fields of imaging, computing, and display technologies, the need for sophisticated components like IR thermal imaging sensors, quantum computing processors, and micro LED displays is surging. These elements are crucial for innovation in areas like R&D, military, industrial, and consumer electronics. Central to these developments is fine pitch micro Indium bump array interconnect bonding, a preferred method for its superior properties, vital for hybridization in creating advanced IR sensors and more. Yet, achieving high-performance, large-scale, and efficient devices faces notable challenges, especially with Indium bump bonding, affecting performance, manufacturing, and scalability. At Finetech, we're overcoming these obstacles. Our technical paper presents our research, insights, and innovative solutions for Indium Bump Interconnect (IBI) Flip Chip Bonding, aiming to advance the production of next-gen IR devices, quantum processors, and micro LEDs. Discover how our solutions can enhance your projects, adhering to and surpassing current industry standards. Join us in tackling the complexities of next-gen device production. Your feedback and inquiries are encouraged as we progress in this technological journey. Get our paper here: https://lnkd.in/enTmEyzK #IndiumBumpBonding #IRSensor #SensorManufacturing #QuantumProcessor #MicroLED #FlipChipBonding #Finetech #DieBonder #DieAttach
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Explore the fascinating interaction between temperature and electronics! This thermistor demonstrates how a decrease in temperature can dim an LED. Delve into the science behind these everyday wonders. #ThermistorScience #ElectronicsEngineering #Innovation
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Cornell engineers have developed the first dual-sided – or “dualtronic” – chip that combines its photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices and make them more energy efficient. It could also incorporate lasers instead of LEDs for “LiFi” – i.e., light-based – transmissions. “You’re essentially limited by your imagination in terms of what you could do, and unexplored functionalities can emerge when we try them in the future.” https://lnkd.in/g44iSHmE
There’s two sides to this semiconductor, and many simultaneous functions | Cornell Chronicle
news.cornell.edu
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