TD SYNNEX North America’s Post

Begin the new year with precision ✅ The BLUM repair service is on hand to assist if a device is damaged or in unlikely event that it no longer operates properly. Repair your devices ready for 2024 ➡️ https://lnkd.in/e8JpeUw8 #Repairs #BLUM #digilog #EngineeringServices #Innovation #ukmfg #ukmanufacturing

Unlock Maximum Performance for the #IntelligentFactory with SIPLACE TX: The Ultimate High-End Placement Solution! 🚀 The SIPLACE TX is breaking all performance records with the new Placement Head CP20 and its component camera for high-resolution images and new SIPLACE SmartFeeder Xi. In SMT mass production, every square centimeter counts, and this is exactly where our state-of-the-art hardware comes in. The SIPLACE TX was developed to meet the throughput requirements of the industry while making optimum use of production space. Why Choose SIPLACE TX? 📌 Impressive Placement Capacity: Handle up to 96,000 components per hour (with two placement heads) on a footprint of just 1 × 2.23 meters. 📌 Benchmark for components: The Placement Head CP20 achieves 48,000 cph and sets the standard for components up to 8.2 mm × 8.2 mm. 📌 Industry Leadership: The SIPLACE TX has proven itself as an industry leader in speed and efficiency. If you are looking to optimize your manufacturing processes and increase floorspace performance, the SIPLACE TX is the solution you are looking for! Learn more about the SIPLACE TX here 👉 https://lnkd.in/eqH8Zkux #ElectronicsManufacturing #SIPLACETX #SMT #Innovation #HighPerformance

Are you tired of juggling multiple marking tools for different tasks? Introducing the Connect.series Combo—the ultimate 2-in-1 dot peen marking station that combines portability with precision. Seamlessly switch between bench and handheld modes in less than 10 seconds, allowing you to mark both small parts on a bench and large, hard-to-reach components on the go. Why You’ll Love It: ➡ Mark anything from alphanumeric text to logos and datamatrix\QR codes with ease. ➡ Enjoy wireless freedom with a secure 10m Wi-Fi range and a long-lasting 22V lithium-ion battery when using in handheld mode. ➡ Effortlessly handle uneven surfaces with our patented IDI feature that adjusts to surface height differences on the component automatically for perfect marks every time. Discover how this versatile system can elevate your marking process to the next level: https://lnkd.in/eStbyX7F #manufacturing #markingtechnology #connectseries #technomark

The built-in versatility of our Glasswing chip-to-chip solution is one of its greatest strengths. Designed to utilize CNRZ-5 Chord™ Signaling, Glasswing can be used to create a bespoke ecosystem, connecting chips in any configuration with high performance and ultra-short SerDes. This allows you to divide your chip more flexibly, assembling multiple dies or chiplets in the best configuration for your design. You can reduce the size of your largest die to enhance its yield or address reticle size limits, with a whole ecosystem of existing users to share insights with and learn from. That’s what we call versatility. https://lnkd.in/dmdDnigR #ConnectivitySolutions #IPSolutions #Interconnect #Glasswing

Heterogeneously integrated SiP devices offer considerable benefits, including higher performance, lower power usage, smaller area, lower cost, and faster time to market. However, thus far they are designed and produced by only a few advanced users. Broad industry proliferation will require a standardization of chiplet models and die-to-die connectivity IP — efforts currently underway — supported by new workflows. This 3D InCites article by Kevin Rinebold explains five workflows that are essential for planning, implementing, verifying, and co-designing heterogeneous designs. https://sie.ag/7LBeyE #Semiconductor #SemiconductorIndustry #AdvancedPackaging

Why do we recommend the #NeuX304? Check out our unboxing! Technology's cutting edge is always advancing, and the Neu-X304 from #NEXCOM is leading the charge. This marvel of innovation is set to revolutionize business landscapes, harnessing the true capabilities of AI for an unparalleled transformation. Key Features: 🎤 High-Octane Performance: Powered by Intel® Core™ 13th/12th Gen. CPUs, the Neu-X304 delivers unmatched processing speed. 🎤 Brilliant Visuals: Equipped with three HDMI 2.0 ports, the Neu-X304 ensures stunning display output. 🎤 Comprehensive Connectivity: Versatile I/O options support a wide range of peripherals, making integration a breeze. 🎤 Seamless Network Integration: Dual LANs, Wi-Fi, and LTE/5G expansion slots guarantee smooth and reliable connectivity in any network setup. Watch the Unboxing: https://lnkd.in/gCZVZh6f #SmartCity #NEXCOM #INTEL #Retail #Automation #FanlessBox

Heterogeneously integrated SiP devices offer considerable benefits, including higher performance, lower power usage, smaller area, lower cost, and faster time to market. However, thus far they are designed and produced by only a few advanced users. Broad industry proliferation will require a standardization of chiplet models and die-to-die connectivity IP — efforts currently underway — supported by new workflows. This 3D InCites article explains five workflows that are essential for planning, implementing, verifying, and co-designing heterogeneous designs. https://sie.ag/ZZZae #Semiconductor #SemiconductorIndustry #AdvancedPackaging

Heterogeneously integrated SiP devices offer considerable benefits, including higher performance, lower power usage, smaller area, lower cost, and faster time to market. However, thus far they are designed and produced by only a few advanced users. Broad industry proliferation will require a standardization of chiplet models and die-to-die connectivity IP — efforts currently underway — supported by new workflows. This 3D InCites article explains five workflows that are essential for planning, implementing, verifying, and co-designing heterogeneous designs. https://sie.ag/ZZZae #Semiconductor #SemiconductorIndustry #AdvancedPackaging

xDIM enables users to complete projects once thought impossible. With over 100,000 SKUs needing to be dimensioned, this customer took xDIM up into the top level of shelving for even faster captures! For more real-world examples, register for our upcoming webinar (and to receive a recording) with Intel Corporation RealSense >> https://bit.ly/49jNhPb #mobiledimensioning #IamIntel #artificialintelligence

Envision 🔮 the future with the HP Color LaserJet Enterprise 5000-6000 Series, designed with the productivity of your hybrid business in mind. Watch this video.📹 #HPColorLaserJet