ASMPT ALSI

Beuningen: Enabling the Semiconductor Advanced Packaging Roadmap 💠 Adjacent to the oldest city of Netherlands lies Beuningen, home to ASMPT ALSI. Founded in 2001, the Beuningen office is also where we invented the multi-beam laser dicing and grooving technology. It has since emerged to become a market leader in wafer processing and one of our key R&D centres for identifying new innovation opportunities. Swipe through to learn more about our Beuningen office and see how our colleagues play an integral part in #EnablingTheDigitalWorld. What do you like best at the Beuningen ASMPT site? ASMPT AEi, Inc. ASMPT AMICRA ASMPT NEXX, Inc. ASMPT SMT Solutions ASMPT SEMI Solutions #Semiconductor #Innovation #AdvancedPackaging #LaserDicing

Below you see an overview of the valuable activities during our Vitality Week 2024 at AMSPT ALSI of last week. Thanks to our great HR-team for all the effort. 🤩🙌🏼

The #PowerAutomotive industry strives for ‘the most efficient power conversion’ in their devices. By using #SiCWafer material that operates at high temperatures and high voltages, the power conversion is highly efficient and therefore longer driving ranges and shorter charging times can be achieved. Laser full-cut your #SiC wafers with ASMPT ALSI leading advanced V-DOE technology and be empowered to 💪 Achieve a higher amount of dies per wafer 💪 Reach a better die quality 💪 Have a lower yield loss Here for more info: https://lnkd.in/gwNzZcTY #LaserSeparation #Laserablation #LaserDicing #VDOE #Automotivetrends #SiCDicing #Laserequipment #Semiconductor 

A special thank you to Kees-Jan Leliveld, Managing Director at ASMPT ALSI, for his enlightening session at I.S.E.S. EU Power 2024! Session Title: SiC Wafer Dicing with Multi-Beam Laser: Optimal Process Quality and Minimized Cost Abstract: Kees Jan Leliveld highlighted the limitations of traditional blade sawing for power wafers, including issues like side wall cracks, passivation chipping, wafer cracks, metal peeling, and high consumable costs. As the industry moves towards thinner wafers, thicker backside metallization, and materials like SiC and GaN, these issues become more pronounced. Traditional solutions, such as reducing blade saw speed, are not sustainable due to increased equipment and fab space costs. Kees Jan presented ASMPT ALSI's innovative multi-beam laser dicing technology, which outperforms traditional blade sawing in both process quality and cost of ownership. He showcased several examples demonstrating the superior performance and efficiency of this advanced technology. Thank you, Kees Jan, for sharing your expertise and innovative solutions that are shaping the future of power wafer dicing! #ISESEUPower2024

It was a pleasure to participate and contibute with a presentation to the I.S.E.S. EU Power 2024 in Porto. Excellent opportunity to exchange ideas, get inspired and build new relationships. Thanks to International Semiconductor Executive Summits for organizing the summit. #ASMPT SEMI Solutions #ASMPT ALSI #ISESEUPower2024

🔥The first days of PCIM Europe in Nuremberg were a wrap! The team of experts at the ASMPT booth already had a lot of interesting talks about the future of Power Electronics. 🔋 🚀We present our special laser process at the booth: V-DOE. This process enables you to achieve low to zero burr after laser separation. With a modified beam the sidewalls of the dicing kerf will be cleaned up so the Heat Affected Zone (HAZ) created after the process will be increased. 💥For the first time in Europe, our ASMPT SMT Solutions colleagues introduced the POWER VECTOR machine, a very innovative platform for die and module binding! It can be used for dry paste, wet paste and die transfer film. 💪🏽 Today is already the last day of PCIM. We are available to connect with you and look forward to your visit to our booth! 📣 #WeArePCIM #PCIMEurope2024 #Laserdicing #VDOE #ASMPTALSI #ASMPTSEMI #ASMPTSMT

We are excited to welcome Kees-Jan Leliveld, Managing Director of ASMPT ALSI and Vice President of ASMPT Ltd Semiconductor Solutions, to the I.S.E.S. EU Power 2024 stage! About the speaker: Kees Jan Leliveld leads the global ASMPT ALSI team in developing and supplying advanced wafer separation solutions using laser dicing and laser grooving technology. His focus areas include power, thin Si, SiC, GaN, advanced packaging, and memory. With a Ph.D. in Applied Physics from the Technical University of Delft, Kees Jan brings a wealth of experience from his previous roles at Bosch Rexroth and Philips Healthcare. About the company: Founded in 1975 and headquartered in Singapore, ASMPT Limited is a leader in providing high-quality equipment for the entire electronics manufacturing process. With innovative solutions and a strong focus on customer value creation, ASMPT has established itself as the leading player in the back-end assembly and packaging market. 🗓️ Schedule of Session: 26 June Join Kees Jan Leliveld on June 26th to explore cutting-edge advancements in wafer separation solutions for the semiconductor industry. Don't miss this opportunity to learn from a leading expert in semiconductor solutions! Secure your spot at I.S.E.S. EU Power 2024: https://lnkd.in/g7CTk_Xq #ISESEUPower2024

This June 2024 ASMPT ALSI will participate in several key semiconductor events. Here's where you'll find us: 📅 4-6 June: Stuttgarter Laser Technology Forum (event of University of Stuttgart), Pfungstadt. Principal Process Engineer Kees Biesheuvel will be there to engage with industry leaders and share insights on the latest trends in laser technology. 📅 11-13 June: PCIM Europe, Nuremberg. We're eager to discuss our innovative solutions and connect with fellow professionals in the power electronics sector. 📅 25-26 June: ISES EU Power 2024 (event of International Semiconductor Executive Summits ), Porto. Catch Kees-Jan Leliveld presenting our cutting-edge laser solutions. Don't miss this opportunity to learn about our pioneering approaches and how they're shaping the future of semiconductor processing. Looking forward to a month filled with knowledge sharing, networking, and innovation. Let's push the boundaries of semiconductor technology together! 🚀🔬 #SLT2024 #PCIM #ISESEUPower2024 #LaserDicing #LaserGrooving #LaserTechnology #ASMPT #ASMPTALSI

LASER1205 – SiC Wafer: Separation / Multi-Beam Laser Dicing Visit us at #pcim EUROPE 2024 in Hall 6, Booth 6-450 and learn more about the ASMPT ALSI LASER1205 laser dicing platform and the patented V-DOE. With the unique V-DOE, users can reduce their loss rate when processing highly sensitive SiC wafers and improve their quality (e.g. die strength) while lowering their cost of ownership. The innovative system processes wafers ranging from 10 to 250 microns in thickness with a positioning accuracy of less than 1.5 microns, all while being 50% faster than traditional methods. Get your ticket here: https://lnkd.in/gz3qvYU4 #LaserDicing #WaferSeparation #SiCWafer

🔌 Power modules based on SiC are ideal for electric vehicles due to their high efficiency and thermal conductivity. To connect these dies and mount the modules on heat sinks, silver sintering is the best technology. Introducing POWER VECTOR, ASMPT's innovative die and module bonding platform for the first time to a European audience at PCIM Europe, manufacturers now have everything needed to build a modern and efficient power module manufacturing line: 👉 DEK NeoHorizon: Stencil printer 👉 POWER VECTOR: Die, clip and component tacking tool 👉 SilverSAM: Sintering platform 👉 3GeP: Universal transfer molding system Additionally, with ASMPT's ALSI LASER1205 laser dicing platform and patented V-DOE , manufacturers can reduce their loss rate and improve quality while lowering cost of ownership when dicing thin and sensitive SiC wafers. Join ASMPT at PCIM Europe to learn more about how our solutions can help you tap into the rapidly growing electromobility market." 🚗 #PowerElectronics #ElectricVehicles #Innovation #ASMPT #PCIM ASMPT SMT Solutions ASMPT SEMI Solutions ASMPT ALSI