FastLane EU

🚀 𝐄𝐱𝐜𝐢𝐭𝐢𝐧𝐠 𝐍𝐞𝐰𝐬 𝐟𝐫𝐨𝐦 𝐈𝐄𝐌𝐓 𝟐𝟎𝟐𝟒! We’re thrilled to announce that the FastLane EU project was featured by Alessio Greci of AMX Automatrix srl at the IEMT 2024 conference in Penang, Malaysia, held from October 16-18. Through the FastLane project, AMX Automatrix brings its advanced expertise in pressure sintering to the forefront, contributing to key process activities in the AMX Automatrix Labs. During his presentation, Alessio Greci highlighted the role of pressure sintering as today’s leading bonding solution for high-power Si and SiC applications, emphasizing its impressive advantages: - High Thermal Conductivity: ~300 W/m∘K - Low Electrical Resistivity: ~2 µΩcm - Extended Interconnect Life: Up to 100x longer than standard soldered interconnects. We’re proud to be pushing boundaries and setting new standards in high-power applications. Stay tuned for more updates as we continue to innovate! #ChipsJU #PressureSintering #IEMT2024 #InnovationInPower

𝐈𝐧𝐭𝐫𝐨𝐝𝐮𝐜𝐢𝐧𝐠 𝐄𝐄𝐌𝐂𝐎 𝐆𝐦𝐛𝐇 🚀 EEMCO GmbH is shaping the future of SiC technology by developing and providing next-generation 6” and 8” high-quality n-doped 4H-SiC ingots. Their advancements also include technology demonstrations for highly n-doped 4H-SiC ingot production, utilizing various SiC powder materials, and evaluating graphite recovery strategies. As part of the FastLane EU project, EEMCO integrates SiC substrate material data across the supply chain in collaboration with industry partners. They also contribute to developing advanced measurement techniques, including XRT, KOH etching combined with microscopy, and neural network-based defect quantification. #SiC #Innovation #SemiconductorTechnology #AdvancedMaterials #ChipsJU

𝐏𝐚𝐫𝐭𝐧𝐞𝐫 𝐇𝐢𝐠𝐡𝐥𝐢𝐠𝐡𝐭: 𝐒𝐥𝐨𝐯𝐚𝐤 𝐔𝐧𝐢𝐯𝐞𝐫𝐬𝐢𝐭𝐲 𝐨𝐟 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐲 𝐢𝐧 𝐁𝐫𝐚𝐭𝐢𝐬𝐥𝐚𝐯𝐚 (𝐒𝐓𝐔𝐁𝐀) 🚀 We are thrilled to collaborate with the Slovenská technická univerzita v Bratislave, one of the leading universities in education and R&D across the New Member States of the EU. The Institute of Electronics and Photonics at STUBA specializes in cutting-edge fields like: ▪️ Micro-/nanoelectronics and power electronics ▪️ Organic electronics and photonics ▪️ Sensors, IC, and smart system design and testing STUBA will apply its deep expertise in electrical characterization, reliability assessment, and numerical electrophysical modeling in the FastLane EU project. Their contributions will include: ▪️ Characterization and analysis of power SiC devices and modules ▪️ Investigating how harsh environments and repetitive switching conditions impact device performance ▪️ Performing advanced numerical simulations and experimental analysis to enhance device reliability We look forward to the innovative contributions STUBA will bring to this exciting project! #Innovation #PowerElectronics #R&D #SiCDevices #ChipsJUProject

🚀𝐄𝐱𝐜𝐢𝐭𝐢𝐧𝐠 𝐓𝐢𝐦𝐞𝐬 𝐟𝐨𝐫 𝐅𝐚𝐬𝐭𝐥𝐚𝐧𝐞 𝐚𝐭 𝐭𝐡𝐞 𝐈𝐏𝐂𝐄𝐈 𝐌𝐄/𝐂𝐓 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐑𝐞𝐧𝐝𝐞𝐳-𝐕𝐨𝐮𝐬 𝐢𝐧 𝐏𝐫𝐚𝐠𝐮𝐞! From October 8-10, 2024, the FastLane EU project coordinated by Valeo, proudly presented at the 𝐈𝐏𝐂𝐄𝐈 𝐌𝐄/𝐂𝐓 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐑𝐞𝐧𝐝𝐞𝐳-𝐕𝐨𝐮𝐬 among 10+ top European innovators in power electronics. 🌍✨ The Fastlane project, funded in France, strongly complements the IPCEI ME/CT initiative with a key focus on achieving a technological breakthrough: 𝐝𝐞𝐯𝐞𝐥𝐨𝐩𝐢𝐧𝐠 𝐚𝐧 𝐚𝐮𝐭𝐨𝐦𝐨𝐭𝐢𝐯𝐞 𝟖𝟎𝟎𝐕 𝐏𝐨𝐰𝐞𝐫𝐓𝐫𝐚𝐢𝐧 𝐒𝐲𝐬𝐭𝐞𝐦 𝐰𝐢𝐭𝐡 𝐒𝐢𝐂 (𝐒𝐢𝐥𝐢𝐜𝐨𝐧 𝐂𝐚𝐫𝐛𝐢𝐝𝐞)⚡🚗 This game-changing innovation will shape the future of automotive power systems, accelerating the transition to high-efficiency, eco-friendly vehicles. The event was a huge success, with over 𝟐𝟎𝟎 𝐚𝐭𝐭𝐞𝐧𝐝𝐞𝐞𝐬 engaging in speeches, panel discussions, and exhibitions near the Technical University of Prague. 🎤💡 Together, we are driving the future of technology and sustainability in Europe! The project is supported by the Chips Joint Undertaking (JU) and its members, including top-up funding by Austria, France, Germany, Romania, Slovakia, under grant agreement No 101139788. #IPCEIMECT #Fastlane #Bpifrance #DGE (DirectionGénéraledesEntreprise) #France2024 #ChipsJU #Semiconductors #PowerElectronics #AutomotiveTech

Let’s highlight Heraeus Electronics GmbH & Co. KG 🚀 Heraeus Electronics is a global leader in materials for device assembly and packaging within the electronics industry. With a diverse product portfolio serving the automotive, power electronics, and semiconductor markets, their solutions range from metal ceramic substrates and bonding wires to assembly and thick film materials. As part of the FastLane EU project, Heraeus Electronics is developing innovative Ag sintering materials for precious metal-free metallized AMB substrates and aluminum heat sinks. By reducing metallization steps and layers, they aim to simplify the production process, lower thermal interfaces, and minimize material complexity in power module stacks. The result? New, cost-efficient SiC power modules with higher power density, longer lifetimes, and improved reliability! ⚡🔋 #Innovation #Electronics #SiCPowerModules #PowerElectronics #Sustainability #Technology #Semiconductors

Partner Spotlight: Technische Universität Chemnitz (TUC) – Power Electronics Expertise 🌟 The Professorship of Power Electronics at TUC brings extensive expertise in ensuring the robustness and reliability of power semiconductor devices. Their work covers crucial aspects such as overload capability and power cycling ruggedness for semiconductors made from Silicon (Si), Silicon Carbide (SiC), and Gallium Nitride (GaN). Through advanced FEM simulations, they gain a detailed understanding of the internal physical processes affecting these devices. In the FastLane EU project, TUC's role is to enhance temperature sensing techniques to significantly improve the accuracy of lifetime predictions for power electronic chips and devices. As part of this mission, TUC will conduct rigorous tests to assess the reliability of innovative sensors in power electronic modules. Moreover, TUC collaborates closely with project partners to showcase integration at module and system levels, including extensive testing and characterization. Their standout contribution is developing the patent-pending "CoolStar" thermal connection technology. #PowerElectronics #SemiconductorReliability #Si #SiC #GaN #TemperatureSensing #CoolStarTechnology #ThermalConnection #Innovation #Research #Collaboration

🌐 Introducing Ion Beam Services (IBS): Leading the Way in Ion Implantation Since 1987! 🌐 IBS is a leading French SME recognized as the European expert in ion implantation technology. With over three decades of experience, IBS offers a comprehensive range of equipment and services tailored for the semiconductor industry, including: 🔹 Ion Implanters: High-quality solutions for both production and R&D needs. 🔹 Maintenance, Retrofit & Refurbishment: Extending the life and efficiency of second-hand implanters. 💡 Their cutting-edge technology allows them to implant over 65 different species on various substrates, operating in conditions from cryogenic to high temperatures. This flexibility ensures optimal solutions for diverse applications. IBS has expanded its capabilities with two advanced tools: 🔹PULSION: An innovative Plasma Immersion Ion Implantation tool. 🔹FLEXion: A specialized beamline implanter for compound substrates (SiC, AsGa, and more). 💼 Their clean room is equipped with several ion implanters capable of handling everything from coupons to 300 mm wafers, supporting R&D and high-volume production. IBS is excited to collaborate with CEA-LETI and other partners within the FastLane EU project to develop advanced ion implantation processes. Together, they aim to enhance SiC device performance using their Beamline (FLEXion-P implanter) and Plasma Immersion Ion Implantation (PULSION implanter) for improved MOSFET gate channel mobility and super junctions. #Semiconductor #IonImplantation #SiC #Innovation

Partner Spotlight: Fraunhofer IISB 🌍 We're excited to collaborate with the Fraunhofer IISB, located in Erlangen, Germany! Fraunhofer IISB specializes in wide and ultra-wide bandgap (WBG/UWBG) semiconductors and efficient power electronics, merging materials and device know-how with advanced system development for e-mobility and sustainable energy applications. As part of the FastLane EU project, IISB lends its expertise to developing and analyzing novel SiC substrates and epitaxial layers. Additionally, with its self-controlled turn-off mechanism, their monolithically integrated 900 V SiC circuit breaker technology ensures fault-current clearance on a nanosecond time scale, contributing to one of our flagship demonstrators. We're looking forward to the exciting contributions from Fraunhofer IISB as we move forward in this collaboration! 🚀 #PowerElectronics #SiC #SustainableEnergy #eMobility #Semiconductors

AMX Automatrix srl proudly announces a significant contribution to the FastLane consortium! 💡 Read more here: https://lnkd.in/grxURtuX

𝐄𝐱𝐜𝐢𝐭𝐢𝐧𝐠 𝐔𝐩𝐝𝐚𝐭𝐞𝐬 𝐟𝐫𝐨𝐦 𝐑𝐖𝐓𝐇 𝐀𝐚𝐜𝐡𝐞𝐧 𝐔𝐧𝐢𝐯𝐞𝐫𝐬𝐢𝐭𝐲 - 𝐈𝐒𝐄𝐀 𝐈𝐧𝐬𝐭𝐢𝐭𝐮𝐭𝐞 🌟 The ISEA Institute at RWTH Aachen University has been at the forefront of research in power electronics, electric drives, electrochemical energy conversion, and storage system technologies for over 50 years⚡ The work spans across a broad range of industries, including traction and automotive technology, energy supply, industrial technology, and household technology, through numerous groundbreaking projects. In addition to publicly funded research, they collaborate closely with national and international industrial partners, driving innovation and progress in the field. As part of the FastLane EU project, ISEA will lead Work Package 5, focusing on developing use case demonstrators. The team will pioneer innovative multi-level and resonant inverter topologies with a novel chip placement to optimize the topology-specific power modules. Additionally, they will enhance electrical drive control with advanced inverters and perform in-depth modeling and optimization from electrical drives to the power module level. ⚙️🔋