Siemens EDA (Siemens Digital Industries Software)

We are excited to introduce the new Tessent In-System Test software, a groundbreaking design-for-test (DFT) solution that enhances in-system test capabilities for next generation integrated circuits (ICs). “Tessent In-System Test is a major step forward in helping our customers achieve their Silicon Lifecycle Management goals,” said Ankur Gupta, our senior vice president and general manager, Digital Design Creation Platform. “Aging and environmental factors are impacting today’s designs at a greater rate. Tessent In-System Test delivers smart solutions that address these challenges, ultimately providing customers improved performance, security and productivity.” Highlights 📣 » Tessent In-System Test is the industry's first in-system test controller designed specifically to work with Siemens’ industry-leading Tessent Streaming Scan Network software, enabling customers to apply embedded deterministic test patterns in-system throughout a product's lifecycle, and keep their ICs and the applications they power reliable, secure and fully functional. » Tessent In-System Test software is engineered to address critical challenges like aging and environmental factors, which can lead to Silent Data Corruption or Errors (SDC/SDE) » Tessent In-System Test enables customers to reuse existing IJTAG- and SSN-based patterns for in-system applications while improving overall chip planning and reducing test time »Tessent In-System Test allows for seamless integration of deterministic test patterns generated with Siemens' Tessent™ TestKompress™ software, and enables customers to embed deterministic test patterns generated using Tessent TestKompress with Tessent SSN directly to the in-system test controller via industry-standard APB or AXI bus interfaces, providing the highest level of test quality within a pre-defined test window, as well as the ability to change test content as devices mature or age through their lifecycle. In-system test with embedded deterministic patterns also supports re-use of existing test infrastructure. These capabilities are particularly key for industries focused on safety-critical applications such as the automotive, aerospace, and medical devices spaces. What users are saying 📣 “Tessent In-System Test technology allows us to reuse our extensive test infrastructure and patterns already utilized in our manufacturing tests for our data center fleet,” said Dan Trock, senior DFT manager at Amazon Web Services (AWS). “This enables high-quality in-field testing of our data centers. Continuous monitoring of silicon devices throughout their lifecycle helps to ensure AWS customers benefit from infrastructure and services of the highest quality and reliability.” To learn more please visit our newsroom (link in comments). #IC #IntegratedCircuitDesign #Tessent

We're excited to announce our collaboration with CELUS to transform the PCB design landscape and empower engineers and small- and medium-sized businesses with intelligent, accessible tools. 🙌🤝 Combining Siemens’ industry-leading PCB design expertise with CELUS' innovative #AI automation platform creates a powerful, user-friendly and cost-effective solution tailored to the real-world needs of engineers. The integration of CELUS’ AI-driven automation with Siemens’ next-generation PCB design solution aims to deliver a fully integrated design environment that accelerates design processes, minimizes errors and brings innovative products to market faster and more efficiently. "We are extremely excited to work with Siemens to bring our AI-driven automation to a wider audience," said Tobias Pohl, CEO of CELUS. "This collaboration is about empowering engineers by simplifying their workflows, reducing errors and making advanced PCB design more accessible. Together, we're leveling the playing field for SMBs and independent engineers." “At Siemens EDA, our mission is to enable innovation and make advanced design tools accessible to businesses of all sizes,” said AJ Incorvaia, our senior vice president, Electronic Board Systems. “Collaborating with CELUS allows us to combine our proven PCB design solutions with front-end, cutting-edge AI automation, providing engineers with the tools they need to innovate efficiently and compete effectively in today's fast-paced market." More details about this #News in our newsroom: https://sie.ag/3nUTgf 📰 #PCBDesign #AI

As a longtime IMEC collaborator, we are proud to be among the first industry leaders to be participating in the imec Automotive Chiplet Program to contribute our EDA expertise. Initiatives such as this are critical for the automotive ecosystem to adapt to meet the needs of the software defined vehicle (SDV). Chiplets can facilitate the fast customization and upgrades required for the SDV, and partnership is key to overcoming the significant investment burden of moving to a chiplet architecture. #Partnership #Automotive #SoftwareDefinedVehicles Find all the details here: https://sie.ag/6RSKky

The semiconductor industry is undergoing a monumental transformation, and artificial intelligence (AI) is at the heart of it. From design to verification, #AI is revolutionizing every aspect of the process. But it's not as simple as just plugging in a generic AI solution and expecting magic to happen - the stakes are too high. That's where Verifiable AI comes in. By leveraging this technology, we can harness the power of AI while ensuring the accuracy and reliability that #semiconductor design needs. In the latest EE Times | Electronic Engineering Times Current podcast episode, our Senior Director of Product Management Satish Balasubramanian discusses the impact of AI on EDA: • Using machine learning to optimize complex designs • Accelerating verification and physical design with verifiable AI • Improving design reliability by predicting issues early • Getting products to market faster with AI-assisted tools Head over to the link in our comments for the full episode!

The rapid increase in compute demands of AI, combined with the trend toward software-defined products, means that the specific demands of workloads are now more important than ever in defining semiconductor requirements. Furthermore, the design needs to be flexible enough to adapt to new demands even after the semiconductor design is complete. In this keynote, Ankur Gupta, Senior Vice President and General Manager, shared his insights on how semiconductor design is changing to enable rapid development and deployment of custom, application optimized, system-on-chip designs – from concept through to in-life operation, as we chart the path to a sustainable compute future. Head over to the link in our comments to catch the whole keynote from AI Hardware & Systems. #EDA #AI #Semiconductor

Exciting #NEWS for the advancement of integrated circuit and systems design! 📣 Siemens is extending our collaboration with TSMC through a number of new development projects, product certifications and innovative tech enablement for the foundry's newest process technologies. This means that mutual customers can now confidently develop highly differentiated end products with our best-in-class EDA solutions together with TSMC's industry-leading silicon process and advanced packaging technologies. Here are just some of the highlights: » N2/N3 certification updates include Calibre nmPlatform, Solido Simulation Suite and Aprisa » Additional collaboration includes the realm of silicon photonics, thermal analysis solutions for verification and debugging, and also into the services realm -- Siemens has officially joined the TSMC Design Center Alliance. » We and TSMC have successfully demonstrated the Calibre, mPower and AFS toolsets running in the AWS Cloud "Strengthening our ongoing alliance with Open Innovation Platform® (OIP) ecosystem partners like Siemens keeps us at the forefront in accelerating advancements in 3D IC design for AI innovation," said Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC. "Our longtime collaboration with Siemens allows our mutual customers to fully harness the power, performance, and efficiency of TSMC's cutting-edge technologies." “Siemens EDA’s extensive and successful collaboration with TSMC enables advanced solution certifications for the latest process technologies required by our mutual customers,” said Mike Ellow, our CEO, Silicon Systems. "By integrating Siemens' top-tier IC design tools with TSMC's state-of-the-art packaging technology, we empower our shared customers to achieve groundbreaking and transformative innovations." https://sie.ag/6GcdR4 #SystemDesign #EDA #IC

AI is everywhere - especially in technology sectors, like processors, requiring new ways to manage power. Leaders in deep learning and AI technology, such as Preferred Networks, Inc. (PFN) need to optimize the power efficiency of their next generation processors. How does PFN do it? PFN uses Siemens' PowerPro software's broad set of power-saving register-transfer-level (RTL) features to develop a new generation of AI integrated circuits (ICs) that deliver exceptional performance and low power consumption. With PowerPro, PFN can also quickly conduct accurate power estimation for both RTL and gate-level designs. This helps the design teams quickly find and address power issues, and dramatically enhance the power efficiency of PFN's next gen AI semiconductor designs. “Siemens’ PowerPro software enables us to design low-power and energy efficient AI chips that meet the stringent standards that our customers demand,” said Junichiro Makino, chief technology officer for Computer Architecture at PFN, and Professor-at-Large at Kobe University. “This advanced technology allows us to take our project to the next level, while helping our customers develop compelling and highly differentiated end-products based on our next-generation AI semiconductors.” “Siemens is pleased that PFN has adopted our PowerPro software to enhance the power efficiency of their next-generation AI processor designs,” said Ankur Gupta, our senior vice president and general manager, Digital Design Creation Platform. “PowerPro improves the power efficiency of next-generation designs, and we look forward to the innovation that PFN’s next generation AI processors will unleash.” More about this #news update is in our newsroom: https://sie.ag/2tbmu5

While the AI industry is buzzing with excitement, the reality for EDA is far more complex. Generic AI solutions simply won't cut it when dealing with the extreme precision required for parts per billion (or trillion) error rates, and hallucinations are unacceptable. What you'll need is a Verifiable AI solution that delivers results that users can trust and that reduces the overall resources needed to complete a task. Join Sathishkumar Balasubramanian at the Electronic Design Process Symposium on Oct 3rd for an invited talk on AI in EDA - to accelerate virtually every aspect of the design and verification process. Link is in the comments! #Solido #AI #simulation

The exponential growth in compute demands of AI, and the move to Software Defined Products, means that more than ever workloads are defining the semiconductor requirements. The need to hit the restrictive power, performance, area and cost constraints of edge designs, mean that every element of the design needs to be optimized and co-designed with the workloads in mind. Additionally, the design needs to evolve even after semiconductor design is complete as it adapts to new demands. In this presentation, Ankur Gupta, Senior Vice President and General Manager, Siemens EDA (Siemens Digital Industries Software), shares his insights on how semiconductor design is changing to enable rapid development and deployment of custom, application optimized, system-on-chip designs – from concept through to in-life operation, as we chart the path to a sustainable compute future. Join Ankur at the AI Hardware & Edge AI Summit, on September 10th at 11:15AM at Signia by Hilton, San Jose, CA. Use SIEMENSPLATINUM20 for 20% off your registration - link is in the comments! #EDA #AIHWEdgeAISummit #AI #EdgeAI #AIHardware #Semiconductor

We're excited to announce that SiliconAuto TW has adopted PAVE360 software to accelerate pre-silicon ADAS SoC development. The software will help reduce development time for its range of state-of-the-art semiconductors for the automotive industry and offer a software development environment prior to silicon hardware availability, accelerating its silicon development and enabling potential customers to shift left development processes. SiliconAuto is dedicated to designing and selling a range of state-of-the-art semiconductors to supply the automotive industry. Their goal is to provide a virtual reference development environment for its forthcoming Advanced Driver-Assistance Systems (ADAS) System on a Chip (SoC) - prior to silicon hardware availability. The adoption of Siemens' PAVE360 enables the company to build an automotive standards-based multi-client, multi-fidelity, virtual development environment that mixes existing tooling and models with new virtual SoCs and real-world inputs to gain early insight, enable early software development and provide key metrics for decision criteria. “SiliconAuto’s commitment to driving innovation in the automotive industry is exemplified by our collaboration with Siemens. By leveraging PAVE360, we are not just accelerating development but also paving the way for future-ready vehicles that meets the highest standards of safety and performance,” said Shawn Tien, vice president of sales and marketing, SiliconAuto. “The pace of development for the advanced technologies required for next generation electric vehicles is accelerating - OEMs and suppliers need to be able to prove out, simulate and iterate software capabilities long before hardware becomes available,” said David Fritz, our vice president, Hybrid and Virtual Systems. “SiliconAuto’s selection of PAVE360 for its environment of choice for pre-silicon software development shows that our standards-based approach is enabling leaders in the automotive industries to accelerate their development processes and deliver the functionality that the next generation of vehicles are demanding.” https://sie.ag/6hU9ur #Automotive #semiconductors #news