Siemens EDA (Siemens Digital Industries Software)

While the AI industry is buzzing with excitement, the reality for EDA is far more complex. Generic AI solutions simply won't cut it when dealing with the extreme precision required for parts per billion (or trillion) error rates, and hallucinations are unacceptable. What you'll need is a Verifiable AI solution that delivers results that users can trust and that reduces the overall resources needed to complete a task. Join Sathishkumar Balasubramanian at the Electronic Design Process Symposium on Oct 3rd for an invited talk on AI in EDA - to accelerate virtually every aspect of the design and verification process. Link is in the comments! #Solido #AI #simulation

The exponential growth in compute demands of AI, and the move to Software Defined Products, means that more than ever workloads are defining the semiconductor requirements. The need to hit the restrictive power, performance, area and cost constraints of edge designs, mean that every element of the design needs to be optimized and co-designed with the workloads in mind. Additionally, the design needs to evolve even after semiconductor design is complete as it adapts to new demands. In this presentation, Ankur Gupta, Senior Vice President and General Manager, Siemens EDA (Siemens Digital Industries Software), shares his insights on how semiconductor design is changing to enable rapid development and deployment of custom, application optimized, system-on-chip designs – from concept through to in-life operation, as we chart the path to a sustainable compute future. Join Ankur at the AI Hardware & Edge AI Summit, on September 10th at 11:15AM at Signia by Hilton, San Jose, CA. Use SIEMENSPLATINUM20 for 20% off your registration - link is in the comments! #EDA #AIHWEdgeAISummit #AI #EdgeAI #AIHardware #Semiconductor

We're excited to announce that SiliconAuto TW has adopted PAVE360 software to accelerate pre-silicon ADAS SoC development. The software will help reduce development time for its range of state-of-the-art semiconductors for the automotive industry and offer a software development environment prior to silicon hardware availability, accelerating its silicon development and enabling potential customers to shift left development processes. SiliconAuto is dedicated to designing and selling a range of state-of-the-art semiconductors to supply the automotive industry. Their goal is to provide a virtual reference development environment for its forthcoming Advanced Driver-Assistance Systems (ADAS) System on a Chip (SoC) - prior to silicon hardware availability. The adoption of Siemens' PAVE360 enables the company to build an automotive standards-based multi-client, multi-fidelity, virtual development environment that mixes existing tooling and models with new virtual SoCs and real-world inputs to gain early insight, enable early software development and provide key metrics for decision criteria. “SiliconAuto’s commitment to driving innovation in the automotive industry is exemplified by our collaboration with Siemens. By leveraging PAVE360, we are not just accelerating development but also paving the way for future-ready vehicles that meets the highest standards of safety and performance,” said Shawn Tien, vice president of sales and marketing, SiliconAuto. “The pace of development for the advanced technologies required for next generation electric vehicles is accelerating - OEMs and suppliers need to be able to prove out, simulate and iterate software capabilities long before hardware becomes available,” said David Fritz, our vice president, Hybrid and Virtual Systems. “SiliconAuto’s selection of PAVE360 for its environment of choice for pre-silicon software development shows that our standards-based approach is enabling leaders in the automotive industries to accelerate their development processes and deliver the functionality that the next generation of vehicles are demanding.” https://sie.ag/6hU9ur #Automotive #semiconductors #news

While the digital twin will be part of the solution to deal with lead times and complexity in software-defined vehicles, what's not clear is how this can be implemented. Join David Fritz, Siemens EDA VP Hybrid and Virtual Systems, at Software-Defined Vehicles USA 2024 (Sept 9-11, Ann Arbor, MI) who will explain what "Employing a digital twin methodology for SDV" could look like. https://sie.ag/DaTDW #SDV #PAVE360 #digitaltwin

We sincerely thank Vijay Chachra for delivering an outstanding industry keynote presentation at the Hardware-assisted Verification Forum on July 25th Bangalore, India. Your insights and expertise left a lasting impression, sparking valuable discussions and inspiring new ideas.

Discover how LG Electronics' SoC Center successfully designed a highly complex video encoder IP in a short period by adopting Catapult HLS. By leveraging the high-level design and verification capabilities of Catapult HLS, LG was able to accelerate the design process and significantly reduce verification time. This resulted in greatly improved time and cost efficiency for IP development, and LG plans to increase the use of Catapult HLS in future development projects. https://sie.ag/6ESWdh

Join us at the Siemens EDA IC Tech Day Munich 2024! 🗓 Date: September 17, 2024 📍 Physical Location: Siemens AG - Siemens Campus, Otto-Hahn-Ring 6, 81244 Munich 💻 Hybrid Event: Join us in person or virtually! This event is a fantastic opportunity to explore the latest advancements in electronic design automation (EDA) for integrated circuits (IC). At the IC Day in Munich Siemens EDA technology experts will demonstrate how our tools help you to develop innovative ICs that drive digitalization worldwide. Sessions will touch upon the latest innovations in Analog/Mixed-Signal Verification, Calibre Design Solutions, Digital IC Implementation, Functional Design & Verification and Hardware-Assisted Verification. Don't miss out on the chance to network with industry experts, attend insightful sessions, and witness groundbreaking technologies. Register today: https://sie.ag/6Q3yq7. We look forward to seeing you there! #SiemensEDA #EDATechDay #Innovation #Technology

50 million+ pins? No problem. #Semiconductor #AdvancedPackaging #3DIC

1...2...3... Hat-trick achieved! The Siemens team in Villingen-Schwenningen has won the charity city run as the strongest team for the THIRD time in a row! Great job, team!

The performance bottleneck of modern compute systems is often the I/O throughput of internal memory and external storage. Consequently, Siemens proactively partners with customers to help them scale-up and innovate their storage interface protocol design and verification (D&V) flows to address this challenge. If you are in this segment of the D&V world, join us at the Future of Memory and Storage conference – #FMS2024 – this coming August 6-8 at the Santa Clara Convention Center. Our technical experts will be at booth 1051, and they will also be presenting the following conference papers: Verification Challenges and Solutions for Multi-Die Systems (UCIe) -- Prashant Dixit in the session “UCIC-101-1: UCIe Solution Technology Innovations” Tuesday, August 6, 8:30am – 9:35am, Ballroom G, Floor 1 Accelerating Verification of Computational Storage Designs (NVMe) -- Ujjwal Negi, Prashant Dixit in the session “COMP-102-1: CS Solution/Technology Innovations” Tuesday, August 6, 9:45am – 10:50am, Ballroom C, Floor 1 Conference Agenda: https://sie.ag/6ytL9x Registration: https://sie.ag/6zdbu6 Join us!