Europractice’s Post

#strategicmaterialsconference2024 organizing committee has done a wonderful job putting together a program relevant to current and future needs and approaches necessary to support the predicted growth to $1T industry. The unprecedented growth rate brings with it challenges as the industry moves to #newchemstries requiring #acceleratedmaterialsdiscovery . It is essentially a call for acceleration all around which is not possible without a closer #collaboration within the industry. I am looking forward to chairing a session on #MaterialScalingNeeds, #Yield, and #MetrologyChallenges and having a collaborative discussion on how we as an industry are going to address these challenges, each big in it's on way, an enable the next generation of growth. I invite you, my fellow industry colleagues, to join the discussion and make it even richer.

The National Science Foundation (NSF) awarded FuzeHub-led Upstate Makes a $1 million ”NSF Regional Innovation Engines Development Award” to further catalyze robust partnerships and align our materials innovation ecosystem in New York State with critical regional opportunities.   NSF Engines aspire to catalyze robust partnerships to positively impact the economy within a geographic region, address societal challenges, advance national competitiveness and create local, high-wage jobs. At next week’s New York State Innovation Summit, we are hosting an industry event to present the initial framework aimed at leveraging industry-leading materials expertise and regional assets. This initiative will accelerate the development of sustainable processing, emerging hardware needs, and un-tap the potential of glass substrates, empowering upstate microelectronics manufacturers to lead their markets with cutting-edge products. Join us and our distinguished panels as we shape the next stage of planning and explore how to overcome challenges in accessing research assets, securing support, and developing and commercializing new microelectronics products in this highly competitive market. With guest speakers: Dr. Robert Hull, Rensselaer Polytechnic Institute Dr. David speed, GlobalFoundries Kwame Amponsah, PhD, Xallent Dr. Christian Riesch, INFICON Angélique Raley, Tokyo Electron US David Gottfried, Alfred University Aric Shorey, Menlo Micro Jeff Fitzgerald, BAE Systems Register here: https://lnkd.in/dbTahA2h #InnovationEcosystem #Microelectronics #AdvancedManufacturing #SustainableTech #NYInnovation

The chip crisis has underscored the urgent need for leadership in electronic components and systems (ECS). Will we remain passive observers or become pioneers in shaping the future of technology? Introducing #CONCEPT, a new EU-funded project 💡🇪🇺 created to change and develop alternatives to the traditional silicon semiconductor technology. By harnessing the expertise of leading #European partners in chemistry, materials science, and device engineering, we're creating a different, sustainable approach to help the demand for powerful and energy-efficient devices. We will use atomic layer deposition (ALD) – enabling the integration of epitaxial functional complex oxides in neuromorphic and photonic devices at low temperatures. ⚛ Stay tuned for our upcoming developments. Our partners ⤵️ University of Oslo | Tyndall National Institute | National Center for Scientific Research "Demokritos" | CogniGron, University of Groningen (FSE) | Volatec Oy | Baldur Coatings AS | F6S Innovation | IBM Research | Lumiphase

▪ Starting today: PRiME ECS conference in Honolulu, with large ALD & ALE representation! ▪ Check the ALD Event Calendar for links to the event: https://lnkd.in/ecJtFAck ▪ Follow the daily blog on this event here: https://lnkd.in/eRcz3UYM Every 4 years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea.  This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry. The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.    The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” shows a wide range of ALD and ALE topics:   1.  Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;  2.  Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.; 3.  Interconnects and contacts: integration of ALD films with Cu and low-k materials;  4.  Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;  5.  New precursors and delivery systems;  6.  Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence; 7.  Coating of nanoporous materials by ALD;  8.  Molecular Layer Deposition (MLD) and hybrid ALD/MLD;  9.  ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;  10. ALD for energy storage applications;  11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;  12. Area-selective ALD;  13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.    Track record: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited),  plus 12 poster presentations.    In Hawaii, we will traditionally attract more attendants from the Far East, and we expect to be as successful this fall in Honolulu.

Looking forward to presenting how TESCAN TENSOR can speed up the development of next-generation semiconductor devices

Yesterday, we at the Nanonetworking Center in Catalunya (N3Cat) had the distinct pleasure of hosting Dr. Mario Lanza, Associate Professor of Materials Science and Engineering at the National University of Singapore. Dr. Lanza delivered a captivating talk on Hybrid 2D/CMOS Microchips for Memristive Applications. In his talk, Dr. Lanza presented exciting advances in integrating two-dimensional (2D) materials—valued for their unique physical, chemical, and thermal properties—into micro/nanoelectronic devices, circuits, and microchips. He provided a comprehensive overview of recent progress in the field and showcased the latest developments in hybrid 2D/CMOS applications. Dr. Lanza emphasized how this hybrid approach holds promise for memristive technologies, which are particularly valuable for data storage, computing, encryption, and communication. He shared insights into the specific challenges posed by 2D material integration at the wafer scale, especially in achieving seamless compatibility with silicon-based CMOS processes. While these technological hurdles are significant, the recent strides in this field suggest a promising path forward. Highlighting how leading companies are also advancing in this direction, Dr. Lanza discussed the path forward and offered strategic recommendations to help tackle these challenges, ensuring that future breakthroughs continue to unfold. Hearing about these advancements and future directions was truly inspiring, and we look forward to engaging with Dr. Lanza and his team on shared interests as the field continues to advance. #Nanoelectronics #Microelectronics #CMOS #2DMaterials #MemristiveTechnologies #Innovation #N3CAT #MaterialsScience #Semiconductors #Nanotechnology #AdvancedElectronics #HybridMicrochips #FutureTech #ResearchCollaboration #TechInnovation

🚀 New Research Spotlight! 🚀 A groundbreaking study featuring Chipmetrics' innovative PillarHall lateral high aspect ratio (LHAR) test structures has been published in the journal Applied Surface Science. This research, led by a team of scientists including Dr. Jennifer S. Emara, Dr. Alireza M. Kia, and Sascha Bönhardt from the Fraunhofer IPMS - CNT, with contributions from Clemens Mart, Kati Kühnel, Nora Haufe, and Dr.Riikka Puurunen, explores the deposition and characterization of lanthanum-doped hafnium oxide thin films using atomic layer deposition (ALD). 💡 Key findings from the study highlight how PillarHall LHAR test structures enhance the analysis of thin film uniformity and composition. Employing techniques like X-ray photoelectron spectroscopy (XPS) and time-of-flight secondary ion mass spectrometry, the team achieved detailed insights into the material properties essential for advancing micro- and opto-electronic devices. This research not only underscores the potential of lanthanum-doped hafnium oxide in ferroelectric applications but also demonstrates the capability of our LHAR structures to support complex material characterizations that push the boundaries of current technology. We are proud to see Chipmetrics' technology contribute to such significant advancements in the semiconductor industry. Link to the full article in the first comment 👇 :  #Chipmetrified #TestedWithPillarHall #PillarHall #ALDep

NanoLund and Lund Nano Lab have leading roles in the European Chips Act. Many in Europe have been eagerly awaiting the results of the first calls in the European Chips Act for pilot lines, with the aim to enhance existing and develop new advanced pilot lines across the Union to enable development and deployment of cutting-edge semiconductor technologies and next-generation semiconductor technologies. Also, we in NanoLund have our stake in the call, and have together with Swedish partners at Linköpings universitet, Chalmers tekniska högskola and Kungliga Tekniska högskolan been invited to be part of a pilot line for Wide Bandgap materials. We were very happy when the Chips Joint Undertaking (JU) announced that the Public Authorities Board approved all four pilot line proposals. Lund University and Vanya Darakchieva will lead the Workpackage on III- N radiofrequency and power device technologies of the Wide Bandgap pilot line. “It is a great honour to be internationally recognized for our leading role in research on wide-bandgap materials for power electronics. We are happy and eager to work together with European partners and industries for establishing a resilient wide band gap semiconductors ecosystem” says Vanya Darakchieva. The III-Nitride activities are focussed on the developments of state-of-the-art epitaxy, radiofrequency and power HEMTs and FinFETS. The target applications for power devices include smart grid, electric train traction, wind turbines, power components for propulsion and charging of electric vehicles. Through the industrial collaboration within the Centre for III-nitride technology (C3NiT), a Vinnova Competence Centre also led by Vanya Darakchieva, the pathway to innovation where these technologies lead to an actual benefit in society is facilitated. It will also be an important development of Lund Nano Lab. Vanya Darakchieva Niklas Rorsman Nerijus Armakavicius Peter Modh #semiconductors #ChipsAct #nanotechnology #Myfab #powerelectronics Lunds universitet • Lunds tekniska högskola

Colouring the future of ultra-thin semiconductors! Link to the paper: https://lnkd.in/dW3rJcCc Molybdenum disulfide (MoS₂) might not be as famous as other 2D materials like graphene, but it comes with the added benefit of having been widely used in industry for years as a lubricant. What sets MoS₂ apart, though, is that it’s a semiconductor—just like silicon, but thinner! This means it has huge potential for being used in transistors and sensors, helping the semiconductor industry push the boundaries of miniaturization and pave the way for faster electronics. However, moving this awesome material from the lab to real-world applications comes with challenges, and one of the biggest is producing it at scale. That’s why we took on the challenge of sputtering MoS₂, a widely used industrial technique. However, sputtering alters the structure of MoS₂, so we developed a colourimetric sensor to detect these changes by eye—no fancy instruments needed! Looking back, having this paper published truly feels like a full-circle moment. My journey with MoS₂ began 7 years ago as a master's student in the Netherlands. Now, seeing MoS₂ integrated into metamaterials—the central theme of my PhD and something I've likened to magic through my more recent science outreach adventures—brings everything together in the most fulfilling way. Shout-out to my coauthors: Rebecca Gallivan Henning Galinski Ramón Camilo Domínguez Ordóñez Nikolaus Porenta Arnold Milenko Müller, Christof Vockenhuber Ralph Spolenak and to the whole ETH Laboratory for Nanometallurgy! #MaterialsScience #ThinFilms #Semiconductor #Sensors #Nanotechnology