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Rigid Substrate Market: Key Growth Drivers and Trends Learn more :https://lnkd.in/epTTRuuu The Rigid Substrate market is experiencing rapid growth due to the increasing demand for reliable and durable electronic components. The rise of advanced technologies in industries such as automotive, consumer electronics, and telecommunications is fueling the demand for rigid substrates. Additionally, the trend toward miniaturization of devices and the growing adoption of 5G technology further boosts market expansion. Key Players in the Rigid Substrate Market: Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Intel Corporation, STMicroelectronics, NXP Semiconductors, Broadcom, Qualcomm, Microchip Technology Inc., Infineon Technologies, Analog Devices, Murata Manufacturing, LG Display, KYOCERA Global, Sony, Panasonic North America, ROHM Semiconductor Americas, LG Electronics, Power Ase Technology, Inc., Xilinx, ZF Group, TE Connectivity, Cypress Semiconductor Corporation, ASEM - Advanced Semiconductor Academy of Malaysia Engineering, Amkor Technology, Inc., ASE Group, Jabil Circuit, Flex, China National Electronics I, onsemi, Texas Instruments, Avnet Technology Solutions, Toshiba Corporation #RigidSubstrate #ElectronicComponents #MarketGrowth #Semiconductor #5GTechnology

💡Innovation the KEY to future-proofing Australia’s electronics industry! 💡 Hendon Semiconductors, a leading microelectronics manufacturer in South Australia, recently partnered with ANFF-SA to tackle a critical challenge in their manufacturing process. The challenge: Inspecting electronic circuitry housed in plastic without damaging the component. The solution: ANFF-SA's advanced X-ray Micro XCT-Zeiss Xradia 400 imaging technology together with ANFF-SA's expertise and state-of-the-art equipment provided crucial insights for Hendon Semiconductors. The partnership showcases the power of industry-research collaboration in driving innovation and how access to advanced technology helps companies like Hendon Semiconductors stay competitive in a rapidly evolving market. “The ANFF-SA team were responsive and flexible, and despite our short notice and tight-turnaround time, their experts provided us with essential insights which were critical to advancing the project and, ultimately, it’s success," said Angelynn Lim, Customer Account Manager, at Hendon Semiconductors. "Our partnership with ANFF-SA not only elevates Hendon Semiconductors' capabilities but also demonstrates the extraordinary potential of collaboration within the Australian electronics industry," said Brenton Judge, Executive General Manager at Hendon Semiconductors. This collaboration is a prime example of how innovation and partnerships are helping to shape the future of Australia's electronics industry. #Innovation #Electronics #Manufacturing #Collaboration #AustralianTechnology #industryresearch University of South Australia Flinders University University of Adelaide Judy Halliday Department of State Development Jason Clare MP Australian Government Department of Education The Australian National Fabrication Facility (ANFF) Chief Scientist for South Australia Marnie Hughes-Warrington AO

𝗘𝗺𝗽𝗼𝘄𝗲𝗿𝗶𝗻𝗴 𝘁𝗵𝗲 𝗙𝘂𝘁𝘂𝗿𝗲 𝗼𝗳 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝘆 𝘄𝗶𝘁𝗵 𝗖𝘂𝘁𝘁𝗶𝗻𝗴-𝗘𝗱𝗴𝗲 𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝗦𝗼𝗹𝘂𝘁𝗶𝗼𝗻𝘀 𝗗𝗼𝘄𝗻𝗹𝗼𝗮𝗱 𝗣𝗗𝗙 𝗦𝗮𝗺𝗽𝗹𝗲 𝗖𝗼𝗽𝘆: https://bit.ly/4bqQ8qL Report describes the global market size of Advanced Semiconductor Packaging from 2018 to 2021 and its CAGR from 2018 to 2021, and also forecasts its market size to the end of 2030 and its expected to grow with a CAGR of 9.1% from 2023 to 2030. Advanced Semiconductor Packaging refers to a range of innovative techniques and technologies used to encase semiconductor devices, providing them with mechanical support, electrical connectivity, and protection from environmental factors. These packaging methods go beyond traditional approaches, aiming to enhance the performance, efficiency, and integration density of electronic devices. Key aspects include 3D stacking, system-in-package (SiP) integration, fan-out wafer-level packaging (FOWLP), and chip-scale packaging (CSP). These advancements are critical for the development of smaller, faster, and more energy-efficient electronic products. 𝗕𝘆 𝗔𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀 Consumer Electronics Automotive Healthcare IT & Telecommunication Others 𝗕𝘆 𝗖𝗼𝗺𝗽𝗮𝗻𝗶𝗲𝘀 Amkor Technology, Inc. SPIL Intel Corporation JCET Group ASE TFMEDICAL LLC TSMC HUATIAN Investment Trading Co., ltd. PowerTech System UTAC #AdvancedSemiconductorPackaging #SemiconductorInnovation #TechPackaging #ElectronicsEngineering #ChipPackaging #3DStacking #SystemInPackage #WaferLevelPackaging #ChipScalePackaging #TechAdvancements #Amkor #SPIL #IntelCorp #JCET #ASE #TFME #TSMC #Huatian #PowertechTechnologylnc #UTAC #SNR #statsandresearch Stats And Research

🚀 Great News! We are thrilled to share the outstanding sales and revenue performance of our Optoelectronics BU for the first half of 2024, especially with sensing system and display system products have reached new sales highs, demonstrating the strong market demand and the success of our innovative solutions! Key Highlights: - 📈The sales revenue of our TFT Array Chips and Compatible Matrix Readout Systems soared by 137% year-on-year, exceeded its total revenue of last year. - 📈The sales revenue of our TFT Array Chips and Compatible Matrix Driver Systems increased by 112% year-on-year. - 🌍The precent of overseas business increased by 60% year-on-year. We also actively participate in global academic conferences and exhibitions to connect with scientific enterprises, universities, and research institutions worldwide. It's thrilling to see our products supporting over 200 customers in publishing more than a hundred high-impact scientific papers. Read more in the picture below👇 Positive results in H1 2024 clear the way for a solid full-year performance. We will continue to accelerate the development of our R&D capabilities and expand our presence in overseas markets. Looking forward, we are excited to explore the application potential of TFT semiconductors in interdisciplinary fields and promoting the joint development of the international academic and industrial communities. #H1Report #TFT #LinkZill #semiconductor

Exciting news in the semiconductor world! The European Union has just launched the Chips JU pilot lines - a €3.7BN initiative aimed at boosting innovation and production in Europe's semiconductor industry. This is a huge step to strengthen Europe's position as a leader in semiconductor research and manufacturing. With five pioneering pilot lines, this initiative targets key areas: - ✅ FD-SOI technology for non-volatile memories and 3D integration (FAMES) - ✅ Heterogeneous system integration and packaging (APECS) - ✅ Ultra-advanced chips from 1nm to 7A (NanoIC) - ✅ Next-gen Wide Band Gap materials (WBG) - ✅ Photonic integrated circuits (PIXEurope) These pilot lines will help bridge the gap between research and large-scale production, ensuring Europe remains competitive in the global semiconductor market. The involvement of high-profile stakeholders and leading research institutes underscores the commitment to advancing Europe's semiconductor ecosystem. For everyone in the Tech and Engineering sectors, this initiative not only promises more innovation but also fresh opportunities in the job market. What are your thoughts on this bold move by the EU? Share your views in the comments! #semiconductors #innovation #europe Visit https://lnkd.in/eiHhmQHg for more industry insights and career opportunities.

🛩 Electronic News! 🗞 Substrate supplier IQE is gearing up to apply for funding under the US Chips Act to enhance its gallium nitride epi wafer production. Chief technology officer Rodney Pelzel mentioned that there was an initial education hurdle on compound semiconductors and the supply chain, but they have been actively engaging with the authorities. Moreover, IQE is exploring the possibility of establishing a site in Europe with support from the EU Chips Act. Locations such as Dresden in Germany, Crolles in France, and Barcelona have already secured funding under the Chips Act. Pelzel stated, We have discussions with major places that are actively pursuing us. We are looking for a strategic location in the UK or EU that aligns with our manufacturing and development strategy. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Vietnam has announced its semiconductor roadmap for 2025-2050, outlining ambitious goals for the industry's growth. The plan involves the establishment of three Wafer fabs, 20 integrated circuit (IC) backend houses, and 300 IC design houses across three distinct phases. The roadmap for the industry development follows the formula C = SET + 1 whereas C = Chip Design and Manufacturing S = Specialized Chips to meet the demand of the core technologies under Fourth Industrial Revolution(4IR) E = Electronics Industry Growth T = Talent Development +1 (or X+1) = Vietnam's goal of becoming a new and safe destination for global semiconductor supply chain #Vietnam #SemiconductorIndustry #Roadmap #Waferfabs #Electronics #ICdesign Source: https://lnkd.in/gwt5wVMX *Correction: Projected revenue for 2024~US$ 18.2b

Semiconductor Bonding Market to reach USD 1239.97 Million by 2032 𝐆𝐞𝐭 𝐅𝐫𝐞𝐞 𝐒𝐚𝐦𝐩𝐥𝐞 𝐏𝐃𝐅: https://lnkd.in/gxMhas7x The semiconductor bonding market is experiencing significant growth due to various factors driving demand for advanced semiconductor technologies. The scope of this market includes the production and development of bonding materials and techniques used in integrated circuits, optoelectronic devices, and power electronic modules. Key growth drivers include the increasing adoption of advanced packaging technologies in sectors such as automotive, consumer electronics, telecommunications, and healthcare. Additionally, the growing demand for miniaturization of electronic devices, coupled with the need for higher performance and reliability, is fueling the expansion of the semiconductor bonding market. Moreover, advancements in material science and nanotechnology are further enhancing the capabilities of semiconductor bonding processes, leading to improved efficiency and cost-effectiveness in manufacturing processes. As a result, companies operating in this industry are focusing on research and development initiatives to capitalize on these opportunities and drive innovation within the semiconductor bonding market. Leading Market Players are: ASM Pacific Technology Kulicke & Soffa Besi Netherlands B.V. TDK Panasonic SUSS microTECH Global LTD Mycronic Shinkawa Electric Co. Ltd. Palomar Technologies Advantest Nordson Corporation Hesse Mechatronics, Inc. F & K DELVOTEC Bondtechnik GmbH Hybond Mitsubishi Electric MRSI SYSTEMS Toray Engineering Co., Ltd. Tokyo Electron US EV Group ASMPT SEMI Solutions MRSI SYSTEMS. Dr. Tresky AG Fasford DIAS Shibaura Machine Company, America #SemiconductorBonding #ChipTechnology #SemiconductorMarket #AdvancedPackaging #TechInnovation #Microelectronics #ChipManufacturing #BondingSolutions #3DIntegration #WaferBonding #SemiconductorIndustry #TechTrends #FutureOfElectronics #Nanotechnology #ElectronicComponents

The 40th International Electronics Manufacturing Technology (IEMT) Conference 2024 will take place in George Town, Penang, Malaysia on October 16 – 18.  #IEMT2024 Conference is the premier #IEEE event devoted to the manufacture of electronic, opto-electronic and #MEMS/sensors devices and systems. IEMT is an established international conference of long standing organized by the Electronics Packaging Society (EPS) Society of IEEE. The 2024 Conference is organized by the IEEE EPS Malaysia Chapter with co-sponsorship from IEEE Santa Clara Valley Chapter. About IEEE: IEEE and its members inspire a global community to innovate for a better tomorrow through highly cited publications, conferences, technology standards, and professional and educational activities. IEEE is the trusted “voice” for engineering, computing, and technology information around the globe. This year’s IEMT event is comprised of personal development courses, paper and or poster presentations, invited speakers, and nine distinguished keynote speakers.  E. Jan Vardaman, President of TechSearch International, Inc. will present a Keynote on Friday, October 18th; 8:30 AM – 9:00 AM in the Grand Ballroom.  Description: Why Are Legacy Packages So Important?  While Advanced Packaging has taken the spotlight, the important role of legacy packaging has been ignored.  Much of the packaging for the #automotive sector depends on legacy packages including power packages and modules.  Electric vehicles (#EV) and charging stations are driving adoption of wide band gap materials and leadframe packages and modules.  Many packages are leadframe-based packages.  #QFN remains the workhorse of the industry.  Demand for #Cuclip packages is strong.  What are the package choices for these application areas and what are the issues associated with these packages for the future.  This presentation discusses these growth drivers and legacy packaging trends. For more information about the conference please visit: https://lnkd.in/gGTUqKxn We look forward to meeting with you this week in Malaysia!

Samsung Electronics and soulbrain holdings co., ltd. Collaborate to Advance Glass Substrate Technology Samsung Electro-Mechanics has partnered with South Korean materials manufacturer SoulBrain to develop next-generation glass substrates, aiming for mass production by 2027. This collaboration reflects Samsung's commitment to enhancing its supply chain ecosystem and advancing semiconductor technology. Glass substrates offer distinct advantages over traditional plastics, such as enabling intricate circuit designs, reducing thickness, and lowering power consumption by more than 30%. Additionally, their scalability to larger sizes positions them as a critical component for future semiconductor advancements. According to MarketsandMarkets, the glass substrate market is projected to grow from $7.1 billion in 2023 to $8.4 billion by 2028. Samsung has already initiated a pilot production line at its Sejong factory, with sample production planned for 2024. The company is actively engaging with potential clients in preparation for mass production. This partnership isn't the first between the two companies—SoulBrain previously supplied etching solutions for Samsung's OLED displays, sparking interest in glass substrate applications. Together, they aim to push boundaries in materials innovation and strengthen South Korea’s semiconductor supply chain. What are your thoughts on the growing role of glass substrates in semiconductor manufacturing? Thanks again to Evertiq - Global for the full article with more background and insights click the source link in the comments below. #SemiconductorInnovation #SoulBrain #NextGenTechnology #SemiconductorManufacturing #FutureOfSemiconductors