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Today Entegris announced that it has signed an agreement with the U.S. Department of Commerce to receive up to $75 million in federal funding incentives under the Chips and Science Act. The proposed CHIPS investment will support Entegris’ construction of our state-of-the-art manufacturing center in Colorado Springs, CO. “Today marked an important moment in the effort to strengthen the U.S. semiconductor manufacturing infrastructure,” said Bertrand Loy, president and chief executive officer of Entegris. “We have been a strategic partner to semiconductor companies for over 50 years and are proud to be among the first suppliers in the semiconductor industry to receive this important federal support.” The facility, which is targeted to begin commercial operation in 2025, will be built in multiple phases with the first phase to support the production of liquid filter membranes and Front-Opening-Unified Pods (FOUPs), an essential product that transports and protects silicon wafers during the semiconductor manufacturing process. These FOUPs are currently manufactured entirely overseas. Read more here https://bit.ly/4exOExT #chips #chipsact #semiconductor #engineering #manufacturing #construction #supplychain #technolgy

COMMERCE DEPT. ANNOUNCES $75M CHIPS DEAL WITH ENTEGRIS 📢 Exciting news in the semiconductor industry! The Department of Commerce has announced a preliminary agreement with Entegris for up to $75 million in Federal incentives under the CHIPS and Science Act to onshore critical semiconductor supply chain and manufacturing materials. This investment aims to support the construction of Entegris’ manufacturing center in Colorado Springs, Colo., creating nearly 600 manufacturing jobs and 500 construction jobs by 2030. Entegris, known for its innovative Front Opening Unified Pods (FOUPs), will utilize the funding to produce these specialized containers and liquid filter membranes domestically. The initiative also includes plans to expand Entegris' R&D capabilities in the U.S. This latest CHIPS grant highlights the ongoing efforts to bolster U.S. semiconductor infrastructure, thanks to the $52 billion CHIPS and Science Act signed by President Biden in 2022. Thanks again to MeriTalk for the full article with more background and insights click the source link in the comments below 💡 🙏👇 Visit International Semiconductor Executive Summits #Semiconductors #CHIPSAct #Manufacturing #TechNews #Entegris #ColoradoSprings

Micron Technology Secures $6.1 Billion Chips Act Funding For Developing Advanced Semiconductor Fabs in USA Read: https://lnkd.in/gMiRHbeR #microtechnology #chipsandscienceact #memorychips #memorymanufacturing #domesticmanufacturing #supplychain #governmentfunding #usmanufacturing #tech #semiconductors #idaho #newyork

Fueled by the #CHIPS Act, US domestic #semiconductor #manufacturing is expected to triple by 2032 according to the Semiconductor Industry Association. The largest projected increase in the world, this manufacturing boom requires experienced partners to succeed. ABM partners with many of the world's largest chip makers providing specialized #cleaning, #engineering, and other #ancillary solutions, helping solve for facility and operations challenges even before a new plant opens, including sourcing local #labor, #supplies, as well as #vendor and #project management. 💡 Learn more about ABM's specialized #semiconductor manufacturing solutions: https://bit.ly/49jEygN https://bit.ly/3URAlfK

“There are four key reasons why companies migrate to 'single-digit nanometers' (e.g., 5 nm, 7 nm): they want to get higher performance, they want to get lower power, they want to reduce their costs by reducing die size, and most often, they want a combination of all three factors. There could be other reasons too, such as support for lower voltages or necessity to reduce form-factor. For now, the best node that GlobalFoundries has to offer is its 12LP+ fabrication process which is substantially better than its 12LP and 14LPP process technologies and should be comparable to 10nm-class nodes of other foundries.”

The U.S. Department of Commerce is set to provide some $6.14bn of direct funding to Micron Technology under the CHIPS and Science Act to help it onshore leading edge #semiconductor manufacturing. The funding under the non-binding preliminary memorandum of terms (PMT) announced today would support the construction of two leading-edge Dynamic Random-Access Memory (DRAM) fabrication facilities in New York and unlock a $25bn investment in a DRAM fab in Idaho, which will be co-located with Micron’s R&D facilities in Boise. Together, these investments would advance the company’s plans for #onshoring approximately 40% of their #DRAM chip production in the USA over the next two decades. #CHIPSAct https://lnkd.in/gfBH8ReC

Congratulations Absolics Inc.! https://lnkd.in/g6aSAccC The U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership. The proposed CHIPS investment would support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging. The proposed investment with Absolics is the first proposed CHIPS investment in a commercial facility supporting the semiconductor supply chain by manufacturing a new advanced material.

The geography of #semiconductor production is entering a new era. Global semiconductor companies are rethinking their current footprints and increasingly emphasizing the importance of operational diversification in response to a variety of transformative forces. Kearney's extensive analysis of the factors influencing the selection of fabrication facility locations provides valuable insights for industry decision-makers. Find them here. Authors: Hieu Pham, Sangkyu Kim, PS Subramaniam, Arndt Heinrich, Bhavtosh Jadeja, and Shiven Mahajan

The geography of #semiconductor production is entering a new era. Global semiconductor companies are rethinking their current footprints and increasingly emphasizing the importance of operational diversification in response to a variety of transformative forces. Kearney's extensive analysis of the factors influencing the selection of fabrication facility locations provides valuable insights for industry decision-makers. Find them here. Authors: Hieu Pham, Sangkyu Kim, PS Subramaniam, Arndt Heinrich, Bhavtosh Jadeja, and Shiven Mahajan

🌟Advanced Packaging Matters🌟 Highlighted by Commerce Secretary Gina M. Raimondo, advanced packaging is central to the US government’s efforts to rejuvenate American semiconductor manufacturing. Amkor Technology, Inc. is investing approximately $2 billion to build an advanced packaging and test facility in Peoria, Arizona, expected to employ around 2,000 people upon completion. This new facility, set to be the largest outsourced advanced packaging facility in the US, aims to enhance America's advanced packaging capabilities and support the growth of the US semiconductor supply chain. It will provide high-volume, cutting-edge technologies for critical markets such as high-performance computing, automotive, and communications. Additionally, Amkor has applied for CHIPS funding under the CHIPS and Science Act to enhance US competitiveness, innovation, and national security in the semiconductor industry. #advancedpackaging #semiconductor #thermalmanagement #CHIPS https://lnkd.in/gp_snSxv