Robert Quinn’s Post

Today Entegris announced that it has signed an agreement with the U.S. Department of Commerce to receive up to $75 million in federal funding incentives under the Chips and Science Act. The proposed CHIPS investment will support Entegris’ construction of our state-of-the-art manufacturing center in Colorado Springs, CO. “Today marked an important moment in the effort to strengthen the U.S. semiconductor manufacturing infrastructure,” said Bertrand Loy, president and chief executive officer of Entegris. “We have been a strategic partner to semiconductor companies for over 50 years and are proud to be among the first suppliers in the semiconductor industry to receive this important federal support.” The facility, which is targeted to begin commercial operation in 2025, will be built in multiple phases with the first phase to support the production of liquid filter membranes and Front-Opening-Unified Pods (FOUPs), an essential product that transports and protects silicon wafers during the semiconductor manufacturing process. These FOUPs are currently manufactured entirely overseas. Read more here https://bit.ly/4exOExT #chips #chipsact #semiconductor #engineering #manufacturing #construction #supplychain #technolgy

In a significant move to bolster the U.S. semiconductor industry, the Biden-Harris Administration has reached preliminary terms with Entegris. This partnership, under the CHIPS Act, aims to onshore critical supply chain materials, enhance domestic chip production, and create over 1,100 jobs in Colorado. #BidenHarrisAdministration #chipproduction #ColoradoSprings #domesticsupplychain #Entegrispartnership #federalincentives #Jobcreation #SemiconductorManufacturing #supplychainmaterials #thxnews

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Texas Instruments (TI) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to strengthen domestic supply chain resilience, advance our national security, and bolster U.S. competitiveness in current-generation and mature-node semiconductor production. President Biden and Vice President Harris championed the CHIPS and Science Act, a key component of the Investing in America agenda, to usher in a new era of semiconductor manufacturing in the United States, bringing with it a revitalized domestic supply chain, good-paying jobs, and investments in the industries of the future. The proposed funding would support TI’s investment of more than $18 billion through the end of decade to construct three new state-of-the-art facilities, including two in Texas and one in Utah, and is estimated to create over 2,000 manufacturing jobs and thousands of construction jobs over time.  Read the full press release: https://lnkd.in/e-q_qhDi #Semiconductor #Manufacturing #SupplyChain

Applied Materials' ambitious $4B R&D center in Sunnyvale, CA, won't receive funding under the Chips Act, a setback for its plans to enhance US semiconductor capabilities. The Commerce Department determined the project didn't meet criteria for large-scale manufacturing funding, despite its alignment with national objectives. This decision underscores the intense competition and challenges in securing government support amid efforts to diversify global supply chains. Learn more about the implications and future prospects at https://lnkd.in/dHsqYyKF #Semiconductors #ChipsAct #TechIndustry #AppliedMaterials #R&D #GovernmentFunding

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the construction of a new silicon carbide wafer manufacturing facility in Siler City, North Carolina, helping to secure a reliable domestic supply of the semiconductors that will underpin the future energy economy and AI boom. The proposed CHIPS investment is also expected to catalyze the company’s planned expansion of its device manufacturing facility in Marcy, New York. The projects together are estimated to create over 2,000 manufacturing jobs and 3,000 construction jobs and are part of the company’s previously announced more than $6 billion capacity expansion plan.  Read the full press release: https://lnkd.in/gBU_veRV #ArtificialIntelligence #SupplyChain #Semiconductors #Manufacturing #ChipsAct #AI #Energy

TI to invest $18 billion on three new semiconductor facilities. Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Texas Instruments (TI) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $1.6 billion in proposed direct funding under the CHIPS and Science Act. The proposed funding would support TI’s investment of more than $18 billion through the end of decade to construct three new state-of-the-art facilities, including two in Texas and one in Utah, and is estimated to create over 2,000 manufacturing jobs and thousands of construction jobs over time.

The geography of #semiconductor production is entering a new era. Global semiconductor companies are rethinking their current footprints and increasingly emphasizing the importance of operational diversification in response to a variety of transformative forces. Kearney's extensive analysis of the factors influencing the selection of fabrication facility locations provides valuable insights for industry decision-makers. Find them here: https://bit.ly/48j67Wq Authors: Hieu (Hugh) Pham, Sangkyu Kim, Subramaniam P.S., Arndt Heinrich, Bhavtosh Jadeja, and Shiven Mahajan

Very compelling analysis of country attractiveness for #semiconductor production by my colleagues.

Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate projected through 2028, SEMI, TECHCET and the Critical Materials Council and TechSearch International announced today in the latest Global Semiconductor Packaging Materials Outlook (GSPMO) report.   “After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, MS/MBA, TECHCET President and CEO.   “Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth,” said E. Jan Vardaman, President of TechSearch International.   Learn more about the GSPMO report. https://bit.ly/3TQBp2z   #semiconductorindustry #advancedpackaging

Multiple #Semiconductor #Manufacturing Projects Delayed in the U.S. Announced semiconductor projects woth over $84 billion face significant delays, highlighting the obstacles that even substantial U.S. government incentives cannot fully overcome. These delays will no doubt impact both U.S. goals for semiconductor independence and global supply chains in this crucial industry. Here's some summary points from the article: - The U.S. semiconductor manufacturing industry has received a significant boost from the CHIPS and Science Act and other polcies/tax incentives. - While many large projects, in total $84 billion worth, have been negotiated, many are facing long delays. - **TSMC's Arizona plant**: Delayed due to labor shortages and extended construction timelines. - **Intel's Ohio fabs**: Slowed by delays in receiving key equipment. - **Samsung's Texas site**: Facing prolonged timelines as it navigates supply chain and infrastructure issues. This situation underscores the complexity of building domestic manufacturing capacity in general, suggesting that policy support, while critical, must be coupled with solutions for labor, supply chain, and infrastructure challenges. #emergingtech #semiconductors #microelectronics #defensetech