#CXL is an industry-standard interconnect that provides memory pooling capabilities for next-generation infrastructures. Learn about its evolution, its key features, & the role we're playing to support its advancements.
Synopsys Inc’s Post
More Relevant Posts
-
Navigating Data's New Frontier✈️ Introducing PUZZLE-9040, IEI's innovative 2U network appliance designed to revolutionize data management. With dual 4th Gen Intel® Xeon® Scalable processors, advanced DDR5 memory, and high-speed connectivity✨✨PUZZLE-9040 sets new standards in performance, scalability, and versatility. Discover new possibilities for: ✅AI integration ✅Big data analytics ✅Data center optimization ✅Virtual machine flexibility Embrace the power to meet challenges and seize opportunities in today's data-driven world. #DataManagement #Innovation #TechnologyRevolution
To view or add a comment, sign in
-
-
Navigating Data's New Frontier Introducing PUZZLE-9040, IEI's innovative 2U network appliance designed to revolutionize data management. With dual 4th Gen Intel® Xeon® Scalable processors, advanced DDR5 memory, and high-speed connectivity. PUZZLE-9040 sets new standards in performance, scalability, and versatility. Discover new possibilities for: ✅AI integration ✅Big data analytics ✅Data center optimization ✅Virtual machine flexibility Learn More: https://lnkd.in/gCaC4nDG Embrace the power to meet challenges and seize opportunities in today's data-driven world. #iei #DataManagement #Innovation #TechnologyRevolution
To view or add a comment, sign in
-
-
Today, we proudly demonstrate our industry leadership by enabling ecosystem partners with Micron 128GB high-capacity RDIMMS using a 32Gb monolithic die delivering best-in-class performance of up to 8000 MT/s to support data center workloads today and into the future. Powered by Micron’s 1β (1-beta) technology, the 128GB DDR5 RDIMM delivers: • More than 45% improved bit density, with up to 24% improved energy efficiency and up to 16% lower latency than competitive 3DS through-silicon via (TSV) products. • Up to a 28% improvement in AI training performance over competitive 3DS TSV-based DDR5 128GB. With this latest innovation, Micron is setting a new standard for high-capacity, high-speed memory in the data center. Discover more: https://bit.ly/467GBCf
To view or add a comment, sign in
-
-
Micron 128GB high-capacity RDIMMS using a 32Gb monolithic die delivering best-in-class performance of up to 8000 MT/s
Today, we proudly demonstrate our industry leadership by enabling ecosystem partners with Micron 128GB high-capacity RDIMMS using a 32Gb monolithic die delivering best-in-class performance of up to 8000 MT/s to support data center workloads today and into the future. Powered by Micron’s 1β (1-beta) technology, the 128GB DDR5 RDIMM delivers: • More than 45% improved bit density, with up to 24% improved energy efficiency and up to 16% lower latency than competitive 3DS through-silicon via (TSV) products. • Up to a 28% improvement in AI training performance over competitive 3DS TSV-based DDR5 128GB. With this latest innovation, Micron is setting a new standard for high-capacity, high-speed memory in the data center. Discover more: https://bit.ly/467GBCf
To view or add a comment, sign in
-
-
Scalable RISC-V Processing Technology Ready for Data Centre & 5G Deployment Aiming to accentuate the capabilities of systems that they are incorporated into and minimise the development periods involved, the 2nd generation of Veyron RISC-V processors have just been introduced by Ventana Micro Systems. Supplied either as chiplets or IP for subsequent customer integration, the Veyron V2 offering benefits from a more sophisticated processor fabric architecture, plus an improved cache hierarchy that boosts efficiency. Consequently, a 40% performance improvement on the previous generation is delivered. The chiplet options utilise a UCIe chiplet interconnect… https://lnkd.in/ehy7ftFe Balaji Baktha Mike Holland Travis Lanier Bill Giovino Omar Hassen Narayanan Kaniyur Greg Favor Paul Clarke
Scalable RISC-V Processing Technology Ready for Data Centre & 5G Deployment
epdtonthenet.net
To view or add a comment, sign in
-
Great presentation by Charlie on how Broadcom has a greater role in the AI infrastructure business where we are selling almost 90% of the components required ranging from XPUs(custom made) , PCIe interconnects, Ethernet switches, NICs, optical interconnects etc. And in an open, scalable and power efficient manner particularly with ethernet and PCIe technology. #AI_Infrastructure #Ethernet #PCIe #open #scalable #power_efficient
Here is the AI Infrastructure opportunity to build the cluster with XPUs, PCIe interconnects, NICs, Ethernet for front-end and back-end networking, and the optical interconnects that work in tandem to make the AI data center a reality. Episode #2 of our Enabling AI Video Series. #enablingAI #connectedbybroadcom
To view or add a comment, sign in
-
Check out this video from Broadcom President, Charlie Kawwas, about how Broadcom enables customers to make AI data centers a reality today! Broadcom solutions are architected throughout the scale-out architecture in his example in this short and insightful explainer video. Take 2 minutes to watch, totally worth it! #enablingAI #connectedbybroadcom
Here is the AI Infrastructure opportunity to build the cluster with XPUs, PCIe interconnects, NICs, Ethernet for front-end and back-end networking, and the optical interconnects that work in tandem to make the AI data center a reality. Episode #2 of our Enabling AI Video Series. #enablingAI #connectedbybroadcom
To view or add a comment, sign in
-
Exciting times ahead in AI infrastructure! 🚀 Episode #2 of Broadcom's Enabling AI Video Series dives into the cutting-edge technology behind building the ultimate AI data center. From XPUs and PCIe interconnects to advanced NICs and optical networking, Broadcom is at the forefront of revolutionizing AI with robust, high-performance solutions. Tune in to explore how we're shaping the future of AI! 💡 #AI #Infrastructure #Innovation #Broadcom #TechLeadership
Here is the AI Infrastructure opportunity to build the cluster with XPUs, PCIe interconnects, NICs, Ethernet for front-end and back-end networking, and the optical interconnects that work in tandem to make the AI data center a reality. Episode #2 of our Enabling AI Video Series. #enablingAI #connectedbybroadcom
To view or add a comment, sign in
-
Transforming the landscape of data processing! 🚀🔍 Explore H3's Memory Pooling Solution and its integration with DDR5 technology on our latest blog. From enhanced performance to broader applications, we're at the forefront of innovation. Join the conversation on LinkedIn for a deep dive into the future of computing. Blog link: https://lnkd.in/gHc4SKnB #CXLMemoryPooling #TechInnovation #DDR5
To view or add a comment, sign in
-
-
Data Centers | Accelerated Computing | Generative AI | Artificial Intelligence | IoT and Consumer Electronics | Global Business Development, Sales and Marketing | Creating Strategic Alliances | Angel Investor
Broadcom is at the heart of everything AI
Here is the AI Infrastructure opportunity to build the cluster with XPUs, PCIe interconnects, NICs, Ethernet for front-end and back-end networking, and the optical interconnects that work in tandem to make the AI data center a reality. Episode #2 of our Enabling AI Video Series. #enablingAI #connectedbybroadcom
To view or add a comment, sign in