EV Group

In light of our unabated growth, we have expanded our management team and are delighted to announce its newest member: Alexander Rank, who has been with us for over 10 years, will support EVG as Executive Corporate Functions Director effective immediately. He will be responsible for finance and controlling, purchasing and human resources as well as other corporate functions. The new role follows our growth path and continued investments in expanding development and production capacities as well as further improving our global infrastructure to serve and support our manufacturing customers and development partners. Head over to our website to read the full announcement. #evginsider #evgroup #growth

Be part of the EVG NIL Technology Day in Amsterdam 2024 and experience the latest Trends in AR/VR, Silicon Photonics, Automotive and Meta Lenses. The event on December 04th in the Meet Berlage next to Beurs van Berlage immediately follows the first edition of the PHABULOuS Pilot Line Micro-Optics Summit & Expo on December 02nd-3rd, conveniently set in the same location. Find out more and register on our website until Nov 22nd, 2024: https://lnkd.in/d9zVNxUi

🚀 Unlocking the Future of Power Devices with Cost-Effective SiC Substrates! 🚀   We’re excited to share our latest article in Power Electronics World, authored by Dielacher Bernd and Peter Kerepesi. Discover how oxide-free wafer bonding is revolutionizing the manufacturing of Silicon Carbide (SiC) substrates, enabling cost-efficient and advanced vertical power device architectures. These developments will contribute to pave the way for a SiC-based future of the EV industry.   🔗 Read the full article here https://lnkd.in/dFG-33sp   #EVGROUP #PowerElectronics #SiC #Innovation #EV #AutomotiveIndustry #TechNews

Mark November 5th on your calendars and register now for this upcoming virtual conference with DELO Industrial Adhesives https://lnkd.in/dE9wa8_i

At the forthcoming "5th SW Test Asia" conference, our insider Ksenija Varga will be presenting a paper entitled "The Process of Integrating MLOs Manufactured on Digital Lithography Systems".   Ksenija will be discussing the benefits of the EVG LITHOSCALE® system in the manufacturing of fine pitch probe cards.   In addition to achieving high resolution of the MLOs, the technology provides full design flexibility and enables a rapid transition from R&D to HVM in the rapidly expanding probe card market.   The conference provides a forum for academics and industry professionals to present and discuss the latest developments in semiconductor test equipment for logic, memory, MEMS, co–packaged optics and other devices. The event is scheduled for 24th and 25th of October 2024 held in Fukuoka, Japan.   https://lnkd.in/f7EYBEz

As innovations are constantly being made in semiconductor packaging, one of the most promising that have come to light are modular chiplets.   Join us for A Holistic Approach for Chiplet Packaging, a seminar part of our Semicon Meets Sustainability virtual conference. Karl Becker of Fraunhofer IZM will present the many packaging technologies available for chiplets, including encapsulation and module assembly.   Find out more and join our virtual conference! 👉 November 5, 2024 👉 8:00 a.m. – 10:15 a.m. (CET) or 5:00 p.m. – 6:40 p.m. (CET) 👉 Presentations by Fraunhofer IZM, EV Group, OIP Technology Pte. Ltd., IDTechEx and #DELO 👉Register now for free: https://lnkd.in/dNWt-naN #Semiconductor #Conference #Sustainability #PIC #OpticalCommunications #Chiplets #SiliconPhotonics

This year’s SEMI MEMS and Sensors Executive Congress #SEMI_MSEC in Quebec, Canada is just around the corner. As a proud platinum sponsor of the event, we’re looking forward to your participation and meeting you at this high-level event. EV Group. Register today: https://lnkd.in/gz-6R62G To find out more about how EVG’s technologies can support your #MEMS manufacturing needs, head over to our website: https://lnkd.in/dfAsSKVG

INSIDERS on the go! Glorious sunshine and delicious food waiting at the destination - reason enough for over 50 INSIDERS to swing their legs over their bikes and together with their colleagues explore the beautiful Upper Austrian landscape at the EVG Bike Day last Friday. Several different routes led to the same destination, and the discussion how the individual groups got there was just one of many topics discussed during lunch - team building made fun! If you want to attend the next EVG Bike Day - you'll need to become an INSIDER first. Head over to www.evgroup.com/jobs now to check out our open positions!

This week, we're proud to be present at an exclusive conference and workshop hosted by FUJIFILM Electronic Materials (Europe) GmbH. Our Insider Ksenija Varga will talk at the Advanced Lithography Workshop about “EVG’s Maskless Exposure™ and LayerRelease™ Technologies Enable Novel Semiconductor Development ” The conference is a venue for academics and industry to present and discuss the latest development in Digital Lithography and newest IR Laser LayerRelease™ processes.   The Advanced Lithography Workshop is taking place in the heart of the quickly growing semiconductor industry hub in Dresden, Germany, which is also called Germany's Silicon Valley, from September 19th to 20th 2024.   Additionally, our insider and regional sales manager Andreas Pichler leads EVG's sponsoring and networking efforts at the event and is available for discussions. We're looking forward to seeing you in Dresden!

Recently a colleague and I visited EV Group, one of our longest standing partners, going back many years. We discussed topics such as the #semiconductor market and wafer-level optics, as well as how we are strategizing within these areas.   As #adhesives - namely functional materials - and processes have to be coordinated with each other, to really come up with helpful solutions for the industry, partnerships like ours are indispensable.   A joint goal we are working on is enabling up-and-coming optical devices and applications like biometric authentication or miniaturized image projection modules to be used in the automotive and consumer electronics markets, utilizing EVG’s leading lens molding and nanoimprint lithography (NIL) equipment and DELO’s adhesives and resist materials.