Uživatel Czech National Semiconductor Cluster to přesdílel
Heterogeneous integration is full of promise, but anyone working in microelectronics knows the challenges that come with it. Combining CMOS, InP, GaAs, and SiPh into a single system is not just about technology, it’s about overcoming design, manufacturing, and scalability hurdles. 🔷 Navigating complexity in design and manufacturing Design complexity is a constant challenge. Managing electrical and optical coupling, ensuring thermal stability, and making co-design efficient require precision at every step. The lack of standardization makes things even harder. Without universal design rules, common interfaces, and clear reliability benchmarks, every integration project faces unnecessary roadblocks. Manufacturing is another critical barrier. Achieving sub-micron alignment, developing high-density interposers, and ensuring stress-free bonding demand advanced engineering and rigorous process control. Without scalable solutions, costs rise, yield suffers, and supplier dependencies grow. 🔷 From breakthrough ideas to industrial-scale solutions Addressing these challenges is essential for European microelectronics to remain competitive. The APECS pilot line, developed under the EU Chips Act, is designed to provide access to advanced packaging and heterogeneous integration technologies, helping companies, SMEs, and researchers bridge the gap between innovation and large-scale manufacturing. For those developing the next generation of microelectronics, finding the right expertise and infrastructure is key. How can new designs move from concept to production? The APECS pilot line is ready to support your transition from prototype to scalable manufacturing. Discover how it can help accelerate your development at https://lnkd.in/erGyYTd6 Technische Universität Graz, imec, VTT, CEA-Leti, Fraunhofer-Gesellschaft, Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, IHP, Foundation for Research and Technology - Hellas (FORTH), Institut de Microelectrònica de Barcelona (IMB-CNM, CSIC), INL - International Iberian Nanotechnology Laboratory, FMD - Forschungsfabrik Mikroelektronik Deutschland, Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Fraunhofer EMFT, Fraunhofer ENAS, Fraunhofer FHR, Fraunhofer Heinrich Hertz Institute HHI, Fraunhofer IAF, Fraunhofer IIS, Fraunhofer IMS, Fraunhofer IPMS, Fraunhofer ISIT