PHIX Photonics Assembly

PHIX strongly advocates the importance of taking packaging and assembly into account early in the photonic integrated circuit (PIC) design process. That's why we're happy to share that Latitude Design Systems have included an Assembly Design Kit (ADK) for the PHIX Characterization Package into their PIC Studio design software. This is another win for cost-effective, high-performance, and scalable integrated #photonics device manufacturing! ➤ Read more: https://lnkd.in/gBhU3aEG #chipindustry #siliconphotonics #designsoftware

Lithium niobate on insulator (#LNOI) is a very promising PIC platform with a high electro-optic coefficient, enabling low-power and high-speed modulation, perfect for #datacom needs. This module, assembled by PHIX for the LOLIPOP Project, is based on an LNOI chip fabricated at CSEM's #TFLN foundry with 5 high-speed modulators operating at 1550 nm wavelength. The package, which involved #wirebonding to a PCB designed by imec and hybrid integration with a silicon nitride (SiN) spot size converter chip by LioniX International, demonstrated sideband modulation frequencies of at least 40 GHz and very low optical losses. With our involvement in LOLIPOP, PHIX aims to prepare for further #industrialization and commercialization of heterogeneous integration processes that combine the strengths of multiple PIC platforms. ➤ More about LOLIPOP: https://lnkd.in/edVWvmsW #photonics

Are you attending the EPIC Technology Meeting on Photonics for Miniaturized Optics at Sony DADC in Salzburg, Austria, on September 18-19th? PHIX sales manager Ibrahim Imrak will be happy to meet you there! He can update you about our high-precision #3Dmicrofabrication capabilities, with which we can print #microoptics directly onto #opticalfiber or surfaces of photonic integrated circuits (PICs). ➤ Register for the event here: https://lnkd.in/dVuGX3bR #meetthexperts #photonics EPIC - EUROPEAN PHOTONICS INDUSTRY CONSORTIUM

To further improve the synergy between our technological roadmap and business development, Jeroen Duis has moved to the role of Chief Technology Officer (CTO) at PHIX. Jeroen will continue to work closely with the strong sales organization that he built up around himself over the past five years. Sales director Marcel van Veen, now joining the PHIX #managementteam alongside Jeroen, will lead the sales teams located in The Netherlands (pictured) and the United States. ➤ Read more about Jeroen's new role and our sales team expansion: https://lnkd.in/eNaPQ7TY #companynews #photonics #chipindustry #technicalsales

To further support the volume scale-up of our customers, PHIX recently took delivery of an ASMPT AMICRA Nano die bonder. This machine is capable of wafer-level or panel-level die bonding with dicing tape pickup and inline placement accuracy inspection. It was specially modified with a custom imaging system to achieve a world leading bonding accuracy of 200 nanometers at 3 sigma. Another customization enables laser welding at greater speeds and with a more localized application of heat. We're excited with this further upgrade of our integrated #photonics and #MEMS volume packaging capabilities! ➤ Discover our #contractmanufacturing offering: https://lnkd.in/dYnwAnz #siliconphotonics #chipindustry #diebonding

PHIX is proud to have signed a memorandum of understanding (MoU) with Industrial Technology Research Institute (ITRI)(工業技術研究院, 工研院) and BizLink Semiconductor Technology in #Taiwan for joint development and industrialization in the area of next-generation integrated #photonics #transceivers. Among other things, we aim to further commercialize and scale up the wafer-level heterogeneous integration processes that we have developed. This MoU signing is part of the Innovation Mission Taiwan, organized by Rijksdienst voor Ondernemend Nederland (RVO), PhotonDelta, and Netherlands Office Taipei. #trademission #partnership

The core #companyvalues of PHIX reflect how we work together as colleagues and partners, how we make business decisions, and what we look for when we hire new people. Our entire team embodies: 𝐓𝐞𝐚𝐦 𝐒𝐩𝐢𝐫𝐢𝐭 - We love cooperation, help each other, and take on a constructive and positive attitude. 𝐄𝐦𝐛𝐫𝐚𝐜𝐞 𝐃𝐢𝐯𝐞𝐫𝐬𝐢𝐭𝐲 - We respect our differences and care for each other, recognizing that our diversity makes us stronger. 𝐑𝐞𝐥𝐢𝐚𝐛𝐥𝐞 𝐏𝐚𝐫𝐭𝐧𝐞𝐫 - We take a result-driven and data-driven approach, deliver what we promise, are trustworthy, honest and transparent. 𝐂𝐨𝐦𝐦𝐢𝐭𝐭𝐞𝐝 𝐀𝐦𝐛𝐢𝐭𝐢𝐨𝐧 - We are passionate and ambitious about advancing photonics packaging and making PHIX and our customers succeed. We are committed to establishing a long- term manufacturing footprint in Europe. 𝐀𝐜𝐭𝐢𝐨𝐧𝐚𝐛𝐥𝐞 𝐄𝐭𝐡𝐢𝐜𝐬 - Doing good is about the choices we make. We contribute to a fairer, healthier and more sustainable world, by abstaining from contributions to bribery, slavery, child labor, and mass destruction. Do you feel that there is any way in which we can live up even more to these values? We are dedicated to continuous improvement! ➤ Share your thoughts with us: https://lnkd.in/euHPfPip #teamspirit #diversity #peoplematter

We're proud to announce that we're developing a new open architecture prototyping package for photonic integrated circuits (PICs), the 𝐏𝐇𝐈𝐗 𝐑𝐅 𝐂𝐡𝐚𝐫𝐚𝐜𝐭𝐞𝐫𝐢𝐳𝐚𝐭𝐢𝐨𝐧 𝐏𝐚𝐜𝐤𝐚𝐠𝐞! As the name suggests, this packaging solution supports 16 RF signals in a GSG configuration, alongside its 120 DC connections. Based on off-the-shelf building blocks and standardized production processes, this packaging solution enables quick and affordable characterization of your first PICs or system integration tests of your RF optoelectronic modules. Besides highly standardized, it's also very flexible, supporting PICs of different sizes and material platforms. The cost-effective prototyping with short turnaround times that this packaging platform provides is an important first step towards the volume scale-up of your innovative PIC based technology that PHIX can provide for you down the road! The first data on the RF Characterization Package can be found on our website. ➤ Compare PHIX Standard Package Types: https://lnkd.in/dbpNVpfW This work was supported in part by the photonixFAB project which is co-funded by the European Union under grant agreement no. 101111896. The photonixFAB project is supported by the Chips Joint Undertaking and its members, including top-up funding by Belgium, Germany, France, Israel, Italy, and The Netherlands, and it is also supported by Switzerland separately. Our partners: X-FAB, LIGENTEC, Luceda Photonics, SMART Photonics, imec, CEA-Leti, Aryballe, NVIDIA, Nokia, Thales, and PhotonFirst. #rfelectronics #siliconphotonics #photonics

Meet our integrated #photonics packaging experts next month at ECOC Exhibition in Frankfurt, Germany! Find Sherif, Andrea and Roelof at the Holland High Tech Pavilion, booth B71, and discover our scalable PIC packaging solutions. ➤ ECOC info & free registration: https://lnkd.in/dEaXA-m #siliconphotonics #meettheexperts #tradeshow

Where would our photonic chip industry be without #photography? This invention from the 1800s helps us communicate what we do, revealing products and processes that are nearly invisible to the naked eye, or locked away from the public inside cleanrooms. And at PHIX we are very aware of a photograph's aesthetic power too! Below are some top picks from our archive. In celebration of #WorldPhotographyDay, can you show us your favorite images of #photonics in action? ➤ Post them in the comments! #apictureisworthathousandwords #chipindustry