A revolutionary material for high-power, high-temperature and high-radiation semiconductor applications? The future of military tech is here in silicon carbide, with properties that conventional silicon can’t touch. Noblis’ Dr. Zareh Soghomonian outlines how a strategic DoD roadmap can unleash its potential. Learn more here: https://bit.ly/3WYsSwz. #IgnitetheSpark #FortheBestofReasons #SiC
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#Semiconductor #Innovation: DARPA & Raytheon's Diamond-Structured GaN Chips Set to Transform Tech A groundbreaking collaboration between Defense Advanced Research Projects Agency (DARPA) and Raytheon marks a new chapter in semiconductor tech, with diamond-based GaN microchips primed to revolutionize defense applications and beyond. Why This Is a Game-Changer: 🔹 GaN's RF prowess outperforms traditional silicon, making it ideal for advanced radar and communication systems. 🔹 ECLIPSE program is the catalyst for GaN innovation, aiming to enhance millimeter wave applications. What This Means for the Market: 💰 Anticipate cross-industry ripple effects, especially in aerospace and automotive. 💰 Position your portfolio towards companies leading in advanced materials. 💰 Watch for sustainable growth through defense contracts tied to semiconductor advancements. Strategic Takeaway: When strategic defense imperatives meet innovation, a new frontier in technology is born. DARPA and Raytheon's joint venture isn't just a step forward; it's a giant leap that could redefine industry standards and investment landscapes. As the merging of military precision and market foresight unfolds, Market Unwinded remains your trusted guide through this transformative journey. Join our expedition into the future at Market Unwinded – Where every insight is a launchpad for strategic investment. Discover more: https://lnkd.in/deYVtBsD #Raytheon #DARPA #DefenseTech #GalliumNitride #MarketUnwinded #StrategicInvestments #AerospaceInnovation #GaN Strategize with Precision: Market Unwinded – Your Vanguard in Defense & Tech Investment Analysis.
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Did you know that our precision gold solder solutions are engineered to enhance intermetallic reliability? This holds especially true in applications utilizing a die with thicker gold plating, such as GaN die for high-frequency RF power amplifiers in 5G and critical military and aerospace wireless communications. Check out this video to learn more! #IndiumCorporation #Technology #Innovation #Soldering #MaterialsScience #ElectronicsManufacturing
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The U.S. Defense Advanced Research Projects Agency (DARPA) has awarded BAE Systems’ FAST Labs™ research and development organization a $12 million contract for the Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program. The DARPA THREADS program aims to overcome the temperature limits at the transistor scale inherent to power-amplifying functions. With new materials and approaches to diffusing the heat that degrades performance and mission life for monolithic microwave integrated circuits (MMICs), THREADS aims to resolve the thermal management challenges of today’s gallium nitride (GaN) devices. Many military systems leverage radio frequency (RF) electronics and have historically operated at powers well below their theoretical limits because the GaN transistors get too hot. Solving this challenge will improve the range of RF-based systems by nearly threefold. This will expand engagement distances for warfighters—taking them further out of harm’s way. BAE Systems will leverage its expertise and track record of developing and manufacturing advanced microelectronics for the program at its Microelectronics Center (MEC) located in Nashua, New Hampshire. The MEC is an accredited DoD Category 1A Trusted Supplier and manufactures GaN and gallium arsenide integrated circuits in production quantities for critical Department of Defense programs. Work on the THREADS program includes collaboration with Modern Microsystems, Penn State University, Stanford University, University of Notre Dame, and University of Texas at Dallas. #military #defense #defence #militaryleak https://lnkd.in/ghUhHhzq
BAE Systems Awarded $12 Million To Boost Effectiveness Of Radio Frequency-based Applications - MilitaryLeak.COM
militaryleak.com
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Critical Frequency Design was excited to participate in the inaugural Microelectronics Commons Annual Meeting in Washington, D.C. last week. The Microelectronics Commons empowers commercial, defense, and laboratory leaders to guide the DoD’s efforts in microelectronics development, bridging the gap from lab to fab. The success of The Microelectronics Commons depends on continued collaboration throughout the microelectronics community, and we look forward to meeting with members of industry, government, and academia. Want to learn more about how Critical Frequency Design is poised to support the Microelectronics Commons and the CHIPS and Science Act? Read more in our whitepaper - https://lnkd.in/e84Rgnkc #defense #defenseinnovation #SolutionsAtTheSpeedofLight
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Curious about the future of microelectronics in defense? Join us at this year’s Defense Conference to learn about U.S. fabrication efforts and strategies to leverage the commercial market for DoD needs. Learn more and register: https://bit.ly/3OCnny2 #PSCdefense23 #DefenseInnovation #TechMarket
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Curious about the future of microelectronics in defense? Join us at this year’s Defense Conference to learn about U.S. fabrication efforts and strategies to leverage the commercial market for DoD needs. Learn more and register: https://bit.ly/3slnre2 #PSCdefense23 #DefenseInnovation #TechMarket
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Curious about the future of microelectronics in defense? Join us at this year’s Defense Conference to learn about U.S. fabrication efforts and strategies to leverage the commercial market for DoD needs. Learn more and register: https://bit.ly/3QqpNCv #PSCdefense23 #DefenseInnovation #TechMarket
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Curious about the future of microelectronics in defense? Join us at this year’s Defense Conference to learn about U.S. fabrication efforts and strategies to leverage the commercial market for DoD needs. Learn more and register: https://bit.ly/3Pumvf8 #PSCdefense23 #DefenseInnovation #TechMarket
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#GaN technology is playing a crucial role in helping industries innovate and grow, including defense. Learn how the defense industry is using gallium nitride today, as well as some potential future uses of it. https://lnkd.in/dxPTc7uw
How The Defense Industry Is Using GaN Technology
rfglobalnet.com
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Brand partnership • Delivering Semiconductor Industry News & Insights with 8 Million Annual Impressions | Come Explore Marketing, Branding & Event Networking Opportunities | CLICK THE BOOKING LINK to schedule a meeting.
WESTERN DIGITAL TO DEVELOP NEXT-GENERATION RADIATION-HARDENED NON-VOLATILE MEMORY CHIPS FOR USE IN SPACE Are you looking to buy or sell used semiconductor equipment? VISIT Moov Technologies Inc. at https://lnkd.in/gFVNKNdz. and browse their 4 billion dollars of equipment listings around the world. Here are a few key facts from the article: ✅Project and Funding: The U.S. Space Force has initiated the Advanced Next Generation Strategic Radiation hardened Memory (ANGSTRM) project, awarding Western Digital Corp. a $35 million contract for its development. ✅Objective: ANGSTRM aims to develop next-generation radiation-hardened non-volatile memory chips. These chips are essential for strategic military applications in space, including strategic missiles and missile defense systems. ✅Memory Device Characteristics: The project focuses on creating memory devices that retain data without power and can withstand the extreme conditions of space, such as high radiation and variable temperatures. ✅Performance and Density Goals: The desired outcome is to create memory devices with monolithic memory densities ranging from 4 to 16 gigabits and multichip module densities from 32 to 128 gigabits. ✅Power and Temperature Requirements: The memory devices should operate efficiently, with power consumption as low as 1 milliwatt and standby power no more than 10 milliwatts. They should also function in a wide temperature range, from -40 to 125 degrees Celsius. Thanks again to Military Aerospace for the full article with more background and insights via the link below 💡 🙏 👇 https://lnkd.in/gXEQ-AJ7 #semiconductor #semiconductorindustry #manufacturing #technology #computerchips #india #china #enginering
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