Yole Group

📈 Yole Group Press - Advanced IC substrate industry: exciting developments on the horizon The advanced #IC substrate market, currently dominated by organic core substrates, saw revenue decline in 2023, marking a year of correction. However, starting in 2024, the industry is poised for growth, with an expected CAGR of 9% projected to bring the market to US$25.53 billion by 2029. This growth will largely be driven by the rising demand for FC BGA substrates for FCBGA and 2.5D/3D advanced packages, fueled by AI accelerators for #HPC and #datacenters, #5G, #AI PC CPUs, XPUs, and #automotive sectors. The competition to commercialize glass core substrates is heating up, with numerous players entering the fray, striving to lead in GCS -based product commercialization. Leading companies like Absolics, Intel, and Samsung are at the forefront, backed by an extensive network of equipment, material, and glass suppliers in their sub-supply chains. According Bilal H. from Yole Group, exciting advancements are expected in the realm of glass core substrates... 👉 Read more on: https://zurl.co/d9fV

📰 Monthly Industry Insights Newsletter - Hesai AT128 LiDAR for Li Auto L9 at a glance   The LiDAR market, dominated by #robotaxis until 2022, is now led by passenger cars, reflecting the growing demand for #autonomousdriving technologies. The LiDAR market for passenger cars is projected to reach nearly $3 billion by 2029, with a 39% CAGR23-29. 📈 Within this impressive dynamic created by Chinese OEMs, Chinese #LiDAR manufacturers are leading the way, with over 80% of the global market share across all #vehicle types. Hesai Technology now leads the LiDAR market, bolstered by a key partnership with Li Auto and the use of Lumentum’s innovative multi-junction #VCSEL technology. 🚘 👀 Read more to get #semiconductor outlines by Yole Group analysts, the latest news in the #industry and the upcoming events on #Automotive.   ➡ Subscribe ! https://lnkd.in/dWguhSC5

📅 Yole Group Photonics Forum at CIOE 2024 | Shenzhen, China, September 11-12 Just 2 weeks to go until the YOLE GROUP PHOTONICS FORUMS 2024! This year, we’re hosting three specialized forums, each spotlighting groundbreaking advancements across different sectors: ▶ Imaging Technologies Forum - 📅 September 11, PM Featuring Florian Domengie (Yole Group), Jason Wang (OMNIVISION), Lars Johnsson (metalenz), Jian DENG (AlpsenTek), Marie-Charlotte LECLERC (STMicroelectronics), and Xuefei Yang (PROPHESEE). ▶ MicroLEDs for AR Forum - 📅 September 12, AM Featuring Zine B. (Yole Group), Liang SUN (TCL), Aaron XU (JBD), Eric Zhao (Goeroptics), Reza Chaji (VueReal Inc.), and Chen chen (Saphlux, Inc.). ▶ Photonics & Compound Semiconductor Forum - 📅 September 12, PM Featuring Ali Jaffal, PhD and Martin Vallo (Yole Group), Andrew JOHNSON (Vital Materials Co., Limited), Corrado Sciancalepore (SOITEC), Hai DING (InnoLight Technology), and Marcus Y. (Intel Corporation). 📣 Special Offer: Enjoy a 20% discount on your registration using promo code "YOLEFORUMS20". Register now to secure your spot and savings! Don’t miss this chance to reconnect with industry leaders, gain insights into the latest trends, and explore the technologies shaping the future of #imaging, #displays, #photonics, and #compoundsemiconductors. More info: https://lnkd.in/eQYpc3GJ

❓Yole Group asks - TDK InvenSense’s 20-year journey of resilient innovation in sensing solutions Despite the challenging market conditions in 2023, TDK stood out as one of the few resilient companies in the MEMS industry, achieving growth while many others struggled. Their ability to outpace the market reflects strategic foresight and adaptability… Today, Pierre Delbos from Yole Group sat down with Omar Abed, CEO of TDK InvenSense to discuss how they’re navigating the current market, spearheading innovation, and setting the stage for future success. 🎤 “TDK will strengthen its leadership position in the same way we came to be the leader we are today”, explains Omar Abed. And he adds: “By driving innovation that meaningfully impacts people’s lives. I cannot emphasize enough the importance of customer focus and understanding the customer experience to steer the direction of innovation”. 👉 Discover the discussion between TDK InvenSense and Yole Group on https://lnkd.in/e7E99p9Z #MEMS #innovation #semiconductor #marketevolution #supplychain

🎬 ChipChat with Yole Group   Get exciting insights into the semiconductor devices industry with Pierre Cambou! 🙌 From powering our #smartphones to driving the latest innovations in #AI, these tiny components are at the heart of almost every pieces of #technology we use today. In his latest report "Semiconductor Trends in Mobile and Consumer", Pierre highlights the immense potential of #semiconductors in driving next-generation technologies and future trends. 🚀 More info : https://lnkd.in/e-wVtSUf   A huge thank you to Pierre Cambou for sharing his expertise! 🙏    For more content on the semiconductor industry, visit our website: https://lnkd.in/emdx_WVH

📰 EE TIMES - What’s in the Box? Hesai AT12 LiDAR for Li Auto L9 at a Glance In just ten years, Hesai Technology has emerged as the global leader in #LiDAR, triggered by its partnership with Li Auto (Li Auto) which began in 2021. The company has set itself apart with its AT128 1D scan mirror LiDAR, surpassing Seyond’s fiber laser-based system in both cost and performance and proving more reliable than RoboSense’s MEMS-based product. In this article, Yole Group unveils some key insights into our cost and #technology analyses as part of the #Automotive Teardown Tracks. We take an in-depth look at Hesai’s AT128 LiDAR integrated into the Li Auto L9 and highlights the market dynamics propelling the rise of this Chinese Tier 1 manufacturer. 👉 Read the full article published by EE Times | Electronic Engineering Times, in collaboration with Arnaud Morillon from Yole Group on: https://lnkd.in/eD2ynJGB

🗨 - Yole Group Viewpoint – Generative AI  Yole Group Viewpoint series offer comprehensive and detailed insights into the key topics and technologies in the #semiconductor market.  This month's topic covers generative AI and how it is transforming #datacenters, with a spotlight on memory and processing power.    2024 marks a turning point for #generativeAI, fueling demand for advanced node processors and HBM. Gen AI and Open AI are driving GAFAM large investment which are pushing the semiconductor transformation.   Generative AI's rise prompts hyperscale data center expansion, propelling the need for #AI accelerators and HBM. NVIDIA's strategic maneuvers, such as the acquisition of Mellanox Technologies, are strengthening its position in the AI infrastructure realm. Nevertheless, TSMC's strong market position is being tested by unprecedented demand, which presents an opportunity for competitors like Samsung Semiconductor to seize market share and establish a more significant presence in the industry.  Advanced #packaging firms benefit from increased demand for complex solutions. Substrate manufacturers observe steady demand, with prices stabilized post-semiconductor shortage. The surge in generative AI prompts discussions on energy consumption, pushing towards more efficient LLMs and potentially accelerating #neuromorphic #computing adoption.     👉 Discover more content on generative AI : https://lnkd.in/e9BQQsTj   

📆 ANALYST THURSDAY – Generative AI Driving Advances in the High-Performance Computing and the Memory Markets | AUGUST 29, ONLINE The rise of generative #AI, exemplified by #ChatGPT and DALL-E, has fueled rapid advancements in #computing and #memory hardware, critical to the development of these technologies. As AI models grow more complex and data-intensive, data centers face increasing demands for enhanced computational power and robust memory systems. This surge is driving innovations in high-performance computing (#HPC) and boosting the high-bandwidth memory (HBM) market, significantly impacting #DRAM and #NAND demand. This upcoming webcast will explore established #GPU and #ASIC competitors in #datacenter applications, featuring a teardown of NVIDIA GPUs and their evolution. It will also highlight the growing AI data center market's impact on the global memory market, particularly the rising need for #HBM. Beyond GPUs, specialized AI accelerators and neural processing units (NPUs) also benefit from HBM technology, necessitating high-performance NAND storage solutions to minimize downtimes. Don’t miss this opportunity to stay ahead of the curve in the High-Performance Computing and the Memory market. Whether you’re an industry professional, investor, or technology enthusiast, this webinar will provide valuable insights to help you navigate and capitalize on market trends. Register now! More info: https://lnkd.in/eeYDWDDb

✍ Yole Group write for EE TIMES - Apple R1 opens new avenues in spatial computing The Apple Vision Pro headset represents a new milestone in computing. The concept of spatial computing is a new paradigm and the first new class of product introduced by Apple since the #iPhone in 2007. Likewise, the R1 is a completely new chip design... 👉 Today, discover the article written by Don Scansen, in collaboration with Yole Group, for EE Times | Electronic Engineering Times on: https://zurl.co/WVcZ

📈 Yole Group Press - Memory industry: China holds firmly onto its capabilities in advanced AI technology The burgeoning adoption of generative #AI has significantly fueled demand for advanced DDR5 #DRAM and #HBM technologies within data centers while also triggering increased demand for enterprise SSDs to support AI servers. Additionally, the first smartphones and PCs equipped with on-device generative AI capabilities are entering the market. These devices, requiring substantial memory/storage due to the size of large-language models, are set to further boost bit demand in the mobile and consumer market segments. According to Simone Bertolazzi from Yole Group: “In response to this new wave of AI-driven growth, major players such as Samsung Electronics, SK hynix, and Micron Technology have shifted a greater portion of their wafer capacity toward meeting the soaring demand for HBM. This shift has led to a deceleration in overall bit production and a hastened transition toward an undersupply of non-HBM products. Production cuts made in late 2022 became effective only in Q3-2023, as OEM inventory levels began to tighten, heralding a rebound in the memory market.” The memory sector is now on a path to a swifter recovery than previously anticipated, with revenue projections showing a sharp increase for the upcoming years... 👉Read the full story on: https://zurl.co/IvI2