Ansys Semiconductors

To meet the escalating computational needs of CPUs and GPUs for IoT, autonomous vehicles, and AI, integrated circuits must evolve to deliver greater functionality. As designers face the challenges of scaling with the complexity and density limitations of traditional flat 2D-IC architectures, advanced packaging techniques can enhance functional densification and performance while adhering to form-factor constraints and cost. Interposers play a crucial role in advanced packaging architectures by providing high connectivity between chiplets. Read this white paper to learn more about these challenges and Ansys' solutions for addressing them. Download White Paper:- https://ansys.me/4cMt5rX #Ansys #EDA #semiconductors #multiphysics

We’re thrilled to share the latest insights from Electronic Design on how Ansys is pushing the boundaries of semiconductor technology! 🚀 In a recent article, "Ansys Adds Another Dimension to the 3D Chip Design Process", discover how #Ansys is revolutionizing the way we approach 3D chip design with NVIDIA Omniverse. 🔍 Highlights from the Article: 💡 The advantages of 3D digital twins when it comes to building chiplet-based designs. 💡 The power-, heat-, and noise-related challenges that chiplets present to engineers. 💡 New capabilities of Ansys’s multiphysics software when connected to Omniverse. This new development is a game-changer for engineers and designers working on the next generation of #semiconductor technologies. Don’t miss out on the chance to see how Ansys is leading the way in 3D chip design innovation! 👉 Read the Full Article: https://ansys.me/3ymmYvn #NVIDIA #multipyhiscs

We are thrilled to unveil 2024 R2, the latest release from Ansys that's set to transform the future of product design! 🌟 We’re taking collaboration and digital transformation to new heights in this groundbreaking update. With 2024 R2, we are bridging the gaps between workflows, seamlessly integrating AI, and optimizing complex design tasks like never before. 🔍 What’s New in 2024 R2? 👉Enhanced Multiphysics Capabilities: Break through the limits of single-physics simulations and dive deep into multidimensional insights for your complex products. 👉Advanced Semiconductor Features: Discover innovative tools and functionalities designed to tackle the evolving challenges in semiconductor design and performance. Whether you're looking to refine your designs, streamline your workflows, or harness the power of AI for your engineering challenges, 2024 R2 offers the tools and capabilities you need. Ready to explore how 2024 R2 can drive your projects forward? 🌟👉 https://ansys.me/3WfLN43 #Ansys #multiphysics #semiconductors #EDA

The growing demand for computational power from CPUs and GPUs, the Internet of Things (IoT), self-driving cars, and Artificial Intelligence (AI)—require more functionality from integrated circuits. As designers face the challenges of scaling with the complexity and density limitations of traditional flat 2D-IC architectures, advanced packaging techniques can enhance functional densification and performance while adhering to form-factor constraints and cost. Interposers play a crucial role in advanced packaging architectures by providing high connectivity between chiplets. Read this white paper to learn more about these challenges and Ansys' solutions for addressing them. Download White Paper:- https://ansys.me/3Yeog6d #Ansys #EDA #semiconductors #multiphysics

Why Thermal management is a challenge in 3DIC design assemblies? Dealing with thermal challenges in #3dic involves tackling various factors, making it a complex yet rewarding task. Learn how Ansys is revolutionizing chip integration with its cutting-edge 3D-IC design technology simulation software! In our latest article, Marc Swinnen, Director of Product Marketing at #Ansys, shares insights on enhancing performance, reducing power consumption, and shrinking form factors for next-generation devices. Discover the Impact of Thermal Management on Stacking Density in Multi-Die Systems in this blog. Dive into the discussion and explore: 🔹 An overview of Ansys RHSC ET and its role in semiconductor chip-package-system design 🔹 Key industry trends and emerging challenges in thermal simulation for 3D-IC designs 🔹 Insights into power delivery optimization and reducing power-related issues 🔹 Strategies for addressing electromigration reliability and coupling effect challenges 🔹 Managing computational demands for large-scale multiphysics simulations 🔹 Overcoming challenges in creating accurate physical models and verifying connectivity Don't miss out on this insightful read! Click here: https://ansys.me/4f82fw2 #multiphysics #thermalanalysis #semiconductors

Physics-aware AI is essential for next-generation IC design. The vast amount of data generated by chip design tools is incredibly rich, but analyzing it can be time-consuming. This challenge has transformed into an opportunity to harness AI/ML technology within EDA (Electronic Design Automation) software tools. Explore our latest blog post to learn how AI/ML is revolutionizing chip design, fostering remarkable efficiency and creativity. #ANSYS #EDA #semiconductors #multipyhiscs Blog post - https://ansys.me/4d2Fzvg

The growing demand for computational power from CPUs and GPUs, the Internet of Things (IoT), self-driving cars, and Artificial Intelligence (AI)—require more functionality from integrated circuits. As designers face the challenges of scaling with the complexity and density limitations of traditional flat 2D-IC architectures, advanced packaging techniques can enhance functional densification and performance while adhering to form-factor constraints and cost. Interposers play a crucial role in advanced packaging architectures by providing high connectivity between chiplets. Read this white paper to learn more about these challenges and Ansys' solutions for addressing them. Download White Paper:- https://ansys.me/3W4pcHS #Ansys #EDA #semiconductors #multiphysics

Ansys and NVIDIA are working together to revolutionize IC design by visualizing and optimizing multi-die designs with the NVIDIA Omniverse platform. With insights from #Ansys electromagnetic, thermal, and mechanical simulations, Omniverse offers capabilities never seen before in IC design. Leveraging #NVIDIA Omniverse's advanced graphics and visual rendering technologies, Ansys provides a seamlessly interactive and intuitive experience. This increases accessibility to critical design insights through physics visualization. Read more about this groundbreaking collaboration in our blog: https://ansys.me/3WkYkEO #EDA #semiconductors #multipyhiscs

We are thrilled to announce that Ansys has joined the Intel Foundry Accelerator United States Military, Aerospace, and Government (USMAG) Alliance to provide secure design methodologies and flows for U.S. security applications. This partnership deepens our technical collaboration with Intel Foundry, enhancing Ansys Redhawk-SC™ to deliver a comprehensive thermal management flow for the Intel 18A advanced process technology. This will enable reliable, high-performance chip design. Press Release:- https://ansys.me/3XXnGtq #Ansys #IntelFoundry #multiphysics #Semiconductors #ChipDesign

Exciting news! Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are now certified for Samsung’s SF2Z manufacturing technology. This certification enables early adopters to reliably design cutting-edge semiconductor products for high-performance computing (HPC), smartphones, artificial intelligence (AI), data center communication, and graphics processors. Read more about this Press Release here:- https://ansys.me/4bFltpU